TWM477045U - Package substrate - Google Patents
Package substrateInfo
- Publication number
- TWM477045U TWM477045U TW103200266U TW103200266U TWM477045U TW M477045 U TWM477045 U TW M477045U TW 103200266 U TW103200266 U TW 103200266U TW 103200266 U TW103200266 U TW 103200266U TW M477045 U TWM477045 U TW M477045U
- Authority
- TW
- Taiwan
- Prior art keywords
- package substrate
- package
- substrate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103200266U TWM477045U (en) | 2014-01-07 | 2014-01-07 | Package substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103200266U TWM477045U (en) | 2014-01-07 | 2014-01-07 | Package substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM477045U true TWM477045U (en) | 2014-04-21 |
Family
ID=60625587
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103200266U TWM477045U (en) | 2014-01-07 | 2014-01-07 | Package substrate |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWM477045U (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI556382B (en) * | 2014-08-26 | 2016-11-01 | 矽品精密工業股份有限公司 | Packaging substrate and a method for fabricating the same |
TWI566331B (en) * | 2015-08-14 | 2017-01-11 | 恆勁科技股份有限公司 | Package module and its substrate structure |
CN106469705A (en) * | 2015-08-14 | 2017-03-01 | 恒劲科技股份有限公司 | Package module and its board structure |
US9786588B2 (en) | 2014-12-10 | 2017-10-10 | Via Alliance Semiconductor Co., Ltd. | Circuit substrate and package structure |
TWI675441B (en) * | 2018-05-14 | 2019-10-21 | 欣興電子股份有限公司 | Package carrier structure and manufacturing method thereof |
CN110504238A (en) * | 2018-05-16 | 2019-11-26 | 欣兴电子股份有限公司 | Packaging carrier plate structure and its manufacturing method |
-
2014
- 2014-01-07 TW TW103200266U patent/TWM477045U/en not_active IP Right Cessation
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI556382B (en) * | 2014-08-26 | 2016-11-01 | 矽品精密工業股份有限公司 | Packaging substrate and a method for fabricating the same |
US9786588B2 (en) | 2014-12-10 | 2017-10-10 | Via Alliance Semiconductor Co., Ltd. | Circuit substrate and package structure |
CN109378308A (en) * | 2014-12-10 | 2019-02-22 | 上海兆芯集成电路有限公司 | Circuit substrate and packaging structure |
TWI566331B (en) * | 2015-08-14 | 2017-01-11 | 恆勁科技股份有限公司 | Package module and its substrate structure |
CN106469705A (en) * | 2015-08-14 | 2017-03-01 | 恒劲科技股份有限公司 | Package module and its board structure |
CN106469705B (en) * | 2015-08-14 | 2019-02-05 | 恒劲科技股份有限公司 | Package module and its board structure |
TWI675441B (en) * | 2018-05-14 | 2019-10-21 | 欣興電子股份有限公司 | Package carrier structure and manufacturing method thereof |
US10937723B2 (en) | 2018-05-14 | 2021-03-02 | Unimicron Technology Corp. | Package carrier structure having integrated circuit design and manufacturing method thereof |
CN110504238A (en) * | 2018-05-16 | 2019-11-26 | 欣兴电子股份有限公司 | Packaging carrier plate structure and its manufacturing method |
CN110504238B (en) * | 2018-05-16 | 2021-01-22 | 欣兴电子股份有限公司 | Package carrier structure and manufacturing method thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG10201400390YA (en) | Package structure | |
SG10201401622RA (en) | Package structure | |
GB2544029B (en) | Packages | |
AU361269S (en) | Package | |
SG11201701526QA (en) | Substrate container | |
ZA201608596B (en) | Packaging | |
GB201515808D0 (en) | Packaging | |
HUE049086T2 (en) | Embedded package substrate capacitor | |
EP3232467A4 (en) | Semiconductor package | |
GB201401145D0 (en) | Packaging | |
TWM477045U (en) | Package substrate | |
EP3689775C0 (en) | Package | |
GB201701519D0 (en) | Substrate manufacture | |
GB201410317D0 (en) | Substrate | |
GB201515771D0 (en) | Packaging | |
EP3106409A4 (en) | Package | |
GB201515773D0 (en) | Packaging | |
AP2017009713A0 (en) | Packaging | |
GB2529208B (en) | Package assembly | |
EP3192750A4 (en) | Package | |
GB201515772D0 (en) | Packaging | |
KR101561920B9 (en) | Semiconductor package | |
SG11201705193VA (en) | Package | |
GB2532549B (en) | Packaging | |
TWI561440B (en) | Package |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4K | Expiration of patent term of a granted utility model |