TWI556382B - Packaging substrate and a method for fabricating the same - Google Patents

Description

Package substrate and its preparation method

The present invention relates to a package substrate and a method of fabricating the same, and more particularly to a package substrate using a photosensitive dielectric material and a method of fabricating the same.

With the rapid development of the electronics industry, many high-end electronic products are gradually moving toward light, thin, short, and small high integration. With the evolution of packaging technology, the packaging technology of wafers is becoming more and more diversified. The size or volume of the package is also shrinking, so that the semiconductor package is light, thin and short.

Generally, the structure of the package substrate is composed of a stacked copper layer and a glass layer (material FR-X, CEM-X). Generally, there are two ways to make a conductive via or a conductive via for a package substrate. The first method is to mechanically drill or laser drill the first layer of glass fiber layer, then electroplating the conductive blind hole, then pressing the copper layer, and patterning the copper layer into a line, and then repeating the pressure. The laminated substrate is prepared by the steps of bonding a glass fiber layer, drilling, and electroplating copper. In the second method, the glass fiber layer and the copper layer are stacked first, and then the glass fiber layer and the copper layer are mechanically drilled, and then the conductive via holes are plated.

Sections 1A to 1H show a cross-sectional view of a conventional method of manufacturing a package substrate Figure.

As shown in FIG. 1A, a core plate 10 is provided and the through holes 100 are formed by mechanical drilling or laser drilling.

Copper is then electroplated in the via 100 to form the conductive pillars 13, as shown in FIG. 1B.

Next, the unpatterned copper layer is pressed and the patterning step is etched to form the wiring layer 11, as shown in FIG. 1C.

As shown in FIG. 1D, the dielectric layer 12 (material, such as glass fiber material) covering the circuit layer 11 is laminated on the core board 10, and is unpatterned on the dielectric layer 12. The copper layer 15 is formed on the copper layer 15, and the photoresist which is not photohardened is removed by exposure and development, and the photoresist layer 14 of the copper layer 15 is exposed.

As shown in FIG. 1E, the copper layer 15 not covered by the photoresist layer 14 is removed by etching to obtain a patterned copper layer 15, and the photoresist layer 14 is removed.

A solder resist layer 16 is formed on the patterned copper layer 15, as shown in FIG. 1F.

As shown in Fig. 1G, the solder resist opening 16a of the copper layer 15 is exposed by mechanical drilling or laser drilling.

As shown in FIG. 1H, a conductive member 17 is formed in the solder resist opening 16a.

However, the above package substrate must be formed by forming an unpatterned copper layer on the core substrate, and then forming a patterned photoresist layer on the copper layer before patterning the copper layer.

In addition, the above production method uses mechanical drilling or laser drilling, the machine Although the mechanical drilling can be penetrated once, it has the effect of saving man-hours; however, the mechanical through-hole can only be used for apertures larger than 100μm in size, so if you want to make high-density wiring products or apertures smaller than 100μm, you must use lasers. drilling.

Although laser drilling has the advantage of making a smaller aperture, laser drilling is expensive, so laser drilling processes are generally avoided when making substrates.

However, as the demand for miniaturization of electronic products increases, the demand for small apertures increases. Therefore, how to implement package substrates with small apertures at a lower cost is an urgent development direction in the industry.

In view of the above-mentioned deficiencies of the prior art, the present invention provides a method of fabricating a package substrate, comprising: providing a first photosensitive dielectric layer having a first surface and a second surface; wherein the first photosensitive dielectric layer Forming a plurality of conductive pillars penetrating the first surface and the second surface; and forming a wiring layer electrically connected to the conductive pillar on the first surface of the first photosensitive dielectric layer.

The present invention further provides a package substrate comprising: a first photosensitive dielectric layer having a first surface and a second surface; a plurality of conductive pillars penetrating the first surface and the second surface, and the conductive pillar has An end surface exposed on the second surface; and a wiring layer formed on the first surface of the first photosensitive dielectric layer, and the wiring layer is electrically connected to the conductive pillar.

In an embodiment of the method for fabricating a package substrate of the present invention, the step of providing the first photosensitive dielectric layer and forming the plurality of conductive pillars comprises: forming a plurality of the release members with an exposed portion on a release member First opening a photosensitive dielectric layer; forming a conductive material in the openings to obtain a plurality of the conductive pillars; and after forming the wiring layer, removing the release member.

In an embodiment of the method for fabricating a package substrate of the present invention, the step of forming the wiring layer includes: forming an exposed portion of the first photosensitive dielectric layer or a conductive pillar on the first photosensitive dielectric layer. Opening the patterned second photosensitive dielectric layer; and forming a conductive material in the opening to obtain the wiring layer.

In the package substrate of the present invention, the second optical type dielectric layer formed on the first surface of the first photosensitive dielectric layer in which the wiring layer is not formed is further included.

In an embodiment of the method for fabricating a package substrate of the present invention, the step of forming the patterned second photosensitive dielectric layer comprises: forming a full coverage on the first photosensitive dielectric layer a second photosensitive dielectric layer of the dielectric layer; and patterning the second photosensitive dielectric layer with an exposure process.

In an embodiment of the method for fabricating a package substrate of the present invention, before forming the first photosensitive dielectric layer, a seed layer is formed on the release member, and the first photosensitive dielectric layer is formed on the substrate. On the seed layer, and after removing the release member, the seed layer not on the conductive post is removed.

In the package substrate produced by the above method, the package substrate further comprises a seed layer formed on an end surface of the conductive pillar.

In the package substrate of the present invention and the method for fabricating the same, after forming the circuit layer, the conductive pillar is exposed on the end surface of the second surface to form a conductive bump, and the conductive bump is electrically connected to the conductive substrate. Line layer.

In an embodiment of the package substrate of the present invention and the method of manufacturing the same, the The material of a photosensitive dielectric layer is a photocurable material.

In still another embodiment of the package substrate of the present invention and the method of fabricating the same, the semiconductor device is disposed and electrically connected to the package substrate.

As can be seen from the above, the present invention achieves a simplified process by using a photosensitive packaging material having both photoresist and package characteristics without using a photoresist.

Furthermore, the present invention creates a circuit by patterning a photosensitive dielectric layer, thereby achieving the need for fine wiring without the use of mechanical drilling or laser drilling, and increasing the wiring density.

In addition, since the manufacturing method of the package substrate provided in the present case does not require the use of laser drilling, the process can be simplified and the production cost can be reduced.

In addition, the present invention is a package substrate that does not have a core board, so that the thickness of the entire package substrate can be reduced, and thus applied to an electronic product having a small thickness.

10‧‧‧ core board

100‧‧‧through hole

11‧‧‧Line layer

12‧‧‧Dielectric layer

13‧‧‧conductive column

14‧‧‧ photoresist layer

15‧‧‧ copper layer

16‧‧‧ solder mask

16a‧‧‧ solder mask opening

17‧‧‧Conducting components

20‧‧‧ release parts

21‧‧‧ seed layer

3‧‧‧Package substrate

30‧‧‧First photosensitive dielectric layer

30'‧‧‧First photosensitive dielectric material

30a‧‧‧ first surface

30b‧‧‧second surface

30c‧‧‧Opening

31‧‧‧conductive column

31a‧‧‧ end face

32‧‧‧Second photosensitive dielectric layer

32'‧‧‧Second photosensitive dielectric material

32a‧‧‧second opening

33‧‧‧Line layer

34‧‧‧Insulating protective layer

34a‧‧‧First opening

35‧‧‧Electrical bumps

40‧‧‧Semiconductor components

401‧‧‧ solder balls

50‧‧‧Photomask

1A to 1H are schematic views showing a method of manufacturing a conventional package substrate; and FIGS. 2A to 2I are schematic views showing a method of manufacturing the package substrate of the present invention, wherein the 2A' is another embodiment of FIG. 2A, 2I' is another embodiment of FIG. 2I; and FIG. 3 is a cross-sectional view showing still another embodiment of the package substrate of the present invention.

The embodiments of the present invention are described below by way of specific specific examples, and those skilled in the art can easily easily disclose the contents disclosed in the present specification. Other advantages and effects of the present invention are understood. The present invention may be embodied or applied in various other specific embodiments, and various modifications and changes may be made without departing from the spirit and scope of the invention.

It is to be understood that the structure, the proportions, the size and the like of the drawings are only used in conjunction with the disclosure of the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. The conditions are limited, so it is not technically meaningful. Any modification of the structure, change of the proportional relationship or adjustment of the size should remain in this book without affecting the effectiveness and the purpose of the creation. The technical content revealed by the creation can be covered. In the meantime, the terms "upper", "first", "second", "end" and the like, as used in this specification, are for convenience only, and are not intended to limit the scope of the creation. Changes or adjustments in their relative relationship are considered to be within the scope of the creation of the creation of the product without substantial changes.

2A to 2I are cross-sectional views showing a method of manufacturing the package substrate of the present invention.

As shown in Fig. 2A, a first photosensitive dielectric material 30' is formed on a release member 20.

In the present embodiment, a carrier plate (for example, a steel plate, a crucible, a glass carrier plate) having a metal layer (for example, copper,) formed on its surface is used as the release member 20. The first photosensitive dielectric material 30' of the present embodiment is exemplified by a negative photosensitive dielectric material, and the first photosensitive dielectric material 30' is formed on the release member 20, and a photomask is used. 50 covers the blind hole, buried hole or through hole The position, and exposure curing (usually using UV Curing) of the first photosensitive dielectric material 30'.

In addition, in an embodiment, the release member 20 is formed with a seed layer 21 as shown in Fig. 2A'. In the present embodiment, the material of the seed layer 21 is not particularly limited, and only a metal that can be etched and patterned can be used.

As shown in FIG. 2B, the first photosensitive dielectric material 30' that has not been cured by exposure is removed to obtain a first photosensitive dielectric layer 30 having a plurality of openings 30c of the release member 20 exposed outwardly. The first photosensitive dielectric layer 30 has an opposite first surface 30a and a second surface 30b, and the second surface 30b is connected to the release member 20.

In the present embodiment, there is no particular limitation on the method of removing the unexposedly cured first photosensitive dielectric material 30', and it is only necessary to use a method of generally removing the photoresist.

As shown in FIG. 2C, the openings 30c are filled with a conductive material to form the conductive pillars 31.

As shown in Fig. 2D, a second photosensitive dielectric material 32' is formed on the first photosensitive dielectric layer 30.

The second photosensitive dielectric material 32' of the present embodiment is a photocurable material, and in the embodiment, the second photosensitive dielectric material 32' is exemplified by a negative photosensitive dielectric material. The second photosensitive dielectric material 32' is formed on the first photosensitive dielectric layer 30 and the conductive pillar 31, and covers the position where the line is to be formed by using the mask 50, and then exposes and cures the second photosensitive type. Dielectric material 32'.

As shown in FIG. 2E, the second photosensitive dielectric material 32' is cured without exposure, and the second photosensitive dielectric layer 32 is obtained, and the second photosensitive dielectric layer 32 is exposed. A portion of the first photosensitive dielectric layer 30 or the second opening 32a of the conductive pillar 31.

In the present embodiment, the design of the photosensitive dielectric layer 32 is obtained by an exposure and development process in conjunction with the design of the mask 50 (as shown in FIG. 2D). Further, the method for removing the second photosensitive type dielectric material 32' which is not exposed and cured is not particularly limited, and only a method of generally removing the photoresist is used.

As shown in FIG. 2F, a conductive material is filled in the second opening 32a of the second photosensitive dielectric layer 32 to form a wiring layer 33 electrically connected to the conductive pillar 31.

In this embodiment, the second photosensitive dielectric layer 32 is patterned by exposure and development, and the second opening 32a is filled with a conductive material, and can be directly formed on the first photosensitive dielectric layer 30. The circuit layer 33, and since the present invention uses a photosensitive dielectric material having both photoresist and package characteristics, it is not necessary to remove the photosensitive dielectric material and the press-fit encapsulant after forming the wiring layer 33. Process, which simplifies the process and effectively reduces the steps required for production.

As shown in FIG. 2G, an insulating protective layer 34 having a first opening 34a exposing a portion of the wiring layer 33 is formed on the wiring layer 33, and the insulating protective layer 34 is, for example, a solder resist layer.

In the embodiment, the method for forming the insulating protective layer 34 on the circuit layer 33 is completed according to the conventional process, and the method is no longer performed. Said.

As shown in Fig. 2H, the release member 20 is removed to obtain two package substrates 3 of the present invention. The package substrate 3 of the present invention comprises: a first photosensitive dielectric layer 30 having a first surface 30a and a second surface 30b opposite thereto; and a plurality of conductive pillars 31 extending through the first surface 30a and the second surface 30b, and The conductive pillar 31 has an end surface 31a exposed on the second surface 30b; a circuit layer 33 formed on the first surface 30a of the first photosensitive dielectric layer 30, and the wiring layer 33 is electrically connected to the conductive pillar; And an insulating protective layer 34 formed on the wiring layer 33, and the insulating protective layer 34 has a first opening 34a exposing a portion of the wiring layer 33.

In this embodiment, the package substrate 3 further includes a second photosensitive dielectric layer 32 formed on the first surface 30a of the first photosensitive dielectric layer 30. The second photosensitive dielectric layer 32 is formed. A region of the wiring layer 33 is not formed on the first surface 30a.

As shown in FIG. 2I, a conductive bump 35 is formed on the end surface 31a of the conductive pillar 31, and the conductive bump 35 is electrically connected to the wiring layer 33 by the conductive pillar 31.

As shown in FIG. 2I', if the seed layer 21 is formed as shown in FIG. 2A', the seed layer 21 formed on the end surface 31a of the conductive post 31 is further included, and the seed crystal is The layer 21 is sandwiched between the conductive pillars 31 and the conductive bumps 35. In the foregoing embodiment, the plating effect between the conductive pillars 31 and the conductive bumps 35 is increased by the seed layer 21, and the reliability of the entire package substrate can be improved.

Referring to Figure 3, which is continued from Figure 2I, the present invention is included in the foregoing The semiconductor device 40 is disposed and electrically connected to the package substrate 3 to obtain a package substrate having the semiconductor device 40.

In this embodiment, the package substrate includes: a first photosensitive dielectric layer 30 having a first surface 30a and a second surface 30b opposite thereto; and a plurality of conductive pillars penetrating the first surface 30a and the second surface 30b 31, and the conductive pillar 31 has an end surface 31a exposed on the second surface 30b; a circuit layer 33 formed on the first surface 30a of the first photosensitive dielectric layer 30, and the wiring layer 33 is electrically connected The conductive pillar 31; and the semiconductor component 40 disposed on the second surface 30b of the first photosensitive dielectric layer 30, and the semiconductor component 40 is electrically connected to the conductive bump 35 by solder balls 401, and The conductive pillar 31 is electrically connected to the wiring layer 33.

As can be seen from the above, in the package substrate of the present invention and the method of manufacturing the same, the buried via, the blind via, the through via or the via is formed by the photosensitive dielectric material without using a process of mechanical drilling or laser drilling; In addition, the photosensitive dielectric material can be used not only for forming holes, but also for forming a wiring layer by patterning the photosensitive dielectric material to increase the wiring density of the package substrate; further, the package substrate of the present invention does not need additional The core board is provided to reduce the thickness of the whole package substrate, and the photosensitive dielectric layer has both photoresist characteristics and insulating package characteristics, thereby eliminating the need for additional photoresist, thereby simplifying the process.

The above-described embodiments are merely illustrative of the principles of the invention and its effects, and are not intended to limit the invention. Modifications and variations of the above-described embodiments can be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be patented as described later. Listed in the scope.

3‧‧‧Package substrate

30‧‧‧First photosensitive dielectric layer

30a‧‧‧ first surface

30b‧‧‧second surface

31‧‧‧conductive column

31a‧‧‧ end face

32‧‧‧Second photosensitive dielectric layer

32a‧‧‧second opening

33‧‧‧Line layer

34‧‧‧Insulating protective layer

34a‧‧‧First opening

Claims (13)

A method for manufacturing a package substrate, comprising: providing a first photosensitive dielectric layer having a first surface and a second surface; and forming a plurality of first and second surfaces in the first photosensitive dielectric layer And a conductive layer; and forming a circuit layer electrically connected to the conductive pillar on the first surface of the first photosensitive dielectric layer. The method for manufacturing a package substrate according to claim 1, wherein the step of providing the first photosensitive dielectric layer and forming the plurality of conductive pillars comprises: forming an exposed portion on a release member. a plurality of first photosensitive dielectric layers of openings; forming a conductive material in the openings to obtain a plurality of the conductive pillars; and after forming the wiring layer, removing the release member. The method for manufacturing a package substrate according to claim 1, wherein the step of forming the circuit layer comprises: forming an exposed portion of the first photosensitive dielectric layer on the first photosensitive dielectric layer or a patterned second photosensitive dielectric layer of the opening of the conductive pillar; and a conductive material is formed in the opening to obtain the wiring layer. The method for manufacturing a package substrate according to claim 3, wherein the step of forming the patterned second photosensitive dielectric layer comprises: Forming a second photosensitive dielectric layer overlying the first photosensitive dielectric layer on the first photosensitive dielectric layer; and patterning the second photosensitive dielectric layer by an exposure process. The method for manufacturing a package substrate according to claim 1, wherein after forming the circuit layer, the conductive pillar is exposed on an end surface of the second surface to form a conductive bump, and the conductive bump is electrically connected. To the circuit layer. The method for manufacturing a package substrate according to claim 2, wherein before forming the first photosensitive dielectric layer, forming a seed layer on the release member, the first photosensitive dielectric layer The seed layer is formed on the seed layer, and after the release member is removed, the seed layer not located on the conductive post is removed. The method of manufacturing a package substrate according to claim 1, wherein the material of the first photosensitive dielectric layer is a photocurable material. The method for manufacturing a package substrate according to claim 1, wherein the package substrate is disposed on the package substrate and electrically connected to the semiconductor device. A package substrate includes: a first photosensitive dielectric layer having opposite first and second surfaces; and a plurality of conductive pillars extending through the first surface and the second surface and having an exposed surface And a circuit layer formed on the first surface of the first photosensitive dielectric layer and electrically connected to the conductive pillar. The package substrate as described in claim 9 of the patent application, including the second The light-type dielectric layer is formed on a first surface of the first photosensitive dielectric layer where the wiring layer is not formed. The package substrate according to claim 9 , wherein the conductive bump is formed on an end surface of the conductive pillar, and the conductive bump is electrically connected to the circuit layer. The package substrate according to claim 9, wherein the material of the first photosensitive dielectric layer is a photocurable material. The package substrate according to claim 9 is further characterized in that the semiconductor device is provided and electrically connected to the package substrate.