CN104854165B - 树脂前体和含有它的树脂组合物、树脂薄膜及其制造方法、以及层压体及其制造方法 - Google Patents

树脂前体和含有它的树脂组合物、树脂薄膜及其制造方法、以及层压体及其制造方法 Download PDF

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CN104854165B
CN104854165B CN201480003496.6A CN201480003496A CN104854165B CN 104854165 B CN104854165 B CN 104854165B CN 201480003496 A CN201480003496 A CN 201480003496A CN 104854165 B CN104854165 B CN 104854165B
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resin
dianhydride
resin precursor
carbon atoms
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CN104854165A (zh
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金田隆行
加藤聪
饭塚康史
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Asahi Kasei Corp
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
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    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
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    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/28Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • BPERFORMING OPERATIONS; TRANSPORTING
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    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
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    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
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    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42Block-or graft-polymers containing polysiloxane sequences
    • C08G77/452Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
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    • C09D179/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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    • C09D183/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/10Block or graft copolymers containing polysiloxane sequences
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    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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  • Laminated Bodies (AREA)
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CN201480003496.6A 2013-03-18 2014-03-17 树脂前体和含有它的树脂组合物、树脂薄膜及其制造方法、以及层压体及其制造方法 Active CN104854165B (zh)

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JP2013-055555 2013-03-18
JP2013055555 2013-03-18
PCT/JP2014/057186 WO2014148441A1 (ja) 2013-03-18 2014-03-17 樹脂前駆体及びそれを含有する樹脂組成物、樹脂フィルム及びその製造方法、並びに、積層体及びその製造方法

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CN202010801999.5A Active CN111892708B (zh) 2013-03-18 2014-03-17 树脂前体和含有它的树脂组合物、树脂薄膜及其制造方法、以及层压体及其制造方法

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JP (8) JPWO2014148441A1 (ja)
KR (9) KR102008162B1 (ja)
CN (2) CN104854165B (ja)
TW (1) TWI568716B (ja)
WO (1) WO2014148441A1 (ja)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102008162B1 (ko) * 2013-03-18 2019-08-07 아사히 가세이 가부시키가이샤 수지 전구체 및 그것을 함유하는 수지 조성물, 수지 필름 및 그 제조 방법, 그리고, 적층체 및 그 제조 방법
CN112961382A (zh) * 2014-06-25 2021-06-15 旭化成株式会社 具有孔隙的聚酰亚胺薄膜及其制造方法
ES2760976T3 (es) * 2015-02-11 2020-05-18 Kolon Inc Acido poliámico, resina de poliimida y película de poliimida
JP6599620B2 (ja) * 2015-03-05 2019-10-30 旭化成株式会社 ポリイミドを貼り合わせ接着層とする光学部材
CN105001799B (zh) * 2015-07-28 2017-08-08 深圳市安品有机硅材料有限公司 一种有机硅导热粘接片的制备方法
CN105153995B (zh) * 2015-07-28 2017-11-28 深圳市安品有机硅材料有限公司 导热硅橡胶粘接组合物、导热硅橡胶粘接片材及其应用
TWI574997B (zh) * 2016-06-01 2017-03-21 台虹科技股份有限公司 聚醯胺酸組成物及其應用
WO2018025957A1 (ja) * 2016-08-03 2018-02-08 日産化学工業株式会社 剥離層形成用組成物
JP6458099B2 (ja) 2016-09-16 2019-01-23 旭化成株式会社 ポリイミド前駆体、樹脂組成物、樹脂フィルム及びその製造方法
WO2018186215A1 (ja) * 2017-04-07 2018-10-11 株式会社アイ.エス.テイ ポリイミド膜
WO2018208639A1 (en) * 2017-05-10 2018-11-15 E. I. Du Pont De Nemours And Company Low-color polymers for flexible substrates in electronic devices
CN108864932A (zh) * 2017-05-11 2018-11-23 信越化学工业株式会社 有机硅改性聚酰亚胺树脂组合物
KR101912738B1 (ko) * 2017-05-23 2018-10-30 주식회사 대림코퍼레이션 광 특성 및 위상 지연 특성이 우수한 고투명성을 갖는 폴리이미드 전구체 수지 조성물, 이를 이용한 폴리이미드 필름 제조방법, 및 이에 의해 제조된 폴리이미드 필름
KR102604658B1 (ko) * 2017-06-08 2023-11-21 닛산 가가쿠 가부시키가이샤 플렉서블 디바이스용 기판의 제조방법
KR101966737B1 (ko) * 2017-06-23 2019-04-09 주식회사 엘지화학 폴리이미드 전구체 조성물 및 이를 이용한 폴리이미드 필름
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JP6537584B2 (ja) * 2017-12-04 2019-07-03 ユニチカ株式会社 ガラス基板への塗工用溶液
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JP7304338B2 (ja) * 2018-03-30 2023-07-06 株式会社カネカ ポリイミド膜の製造方法および電子デバイスの製造方法
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JP7327983B2 (ja) * 2018-05-16 2023-08-16 旭化成株式会社 ポリイミド前駆体樹脂組成物
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KR102463960B1 (ko) * 2018-06-22 2022-11-04 미쓰이 가가쿠 가부시키가이샤 폴리아마이드산 및 이것을 포함하는 바니시, 필름, 터치 패널 디스플레이, 액정 디스플레이, 및 유기 el 디스플레이
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WO2020138360A1 (ja) * 2018-12-28 2020-07-02 三菱瓦斯化学株式会社 イミド-アミド酸共重合体及びその製造方法、ワニス、並びにポリイミドフィルム
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WO2022070617A1 (ja) * 2020-09-29 2022-04-07 東洋紡株式会社 無機基板とポリアミック酸硬化物の積層体
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CN118215713A (zh) * 2021-11-10 2024-06-18 株式会社钟化 树脂组合物、成形体和薄膜
TW202342595A (zh) * 2022-03-03 2023-11-01 日商Ube股份有限公司 顯示器基板用聚醯亞胺前驅物、顯示器基板用聚醯亞胺膜及顯示器基板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1711308A (zh) * 2003-01-10 2005-12-21 日东电工株式会社 聚酰亚胺薄膜及其制造方法
JP2006124637A (ja) * 2004-10-26 2006-05-18 Saehan Micronics Inc ポリイミド接着剤用組成物およびこれを用いたポリイミド接着テープ
JP2006124670A (ja) * 2004-09-28 2006-05-18 Hitachi Chem Co Ltd プリプレグ、金属箔張積層板及びこれらを使用した印刷回路板
CN102165370A (zh) * 2008-09-30 2011-08-24 索尼化学&信息部件株式会社 感光性硅氧烷聚酰亚胺树脂组合物
CN102666658A (zh) * 2009-12-22 2012-09-12 新日铁化学株式会社 聚酰亚胺树脂、其制造方法、粘接剂树脂组合物、覆盖膜以及电路基板

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ZA858142B (en) * 1984-10-24 1986-06-25 M & T Chemicals Inc Siloxane-containing polymers
JPS61141732A (ja) 1984-12-14 1986-06-28 Ube Ind Ltd 透明な芳香族ポリイミドおよび組成物
JPS61176632A (ja) * 1985-02-01 1986-08-08 Sumitomo Bakelite Co Ltd 耐熱性樹脂の製造方法
JPS63225629A (ja) * 1986-12-15 1988-09-20 Mitsubishi Electric Corp ポリイミド系樹脂
JP2609140B2 (ja) * 1988-11-21 1997-05-14 チッソ株式会社 低弾性率ポリイミドおよびその製造法
US5008361A (en) * 1990-01-02 1991-04-16 Occidental Chemical Corporation Crystalline polyimidesiloxanes
WO1991010699A1 (en) 1990-01-18 1991-07-25 Nippon Steel Chemical Co., Ltd. Resin for protecting semiconductors
JPH03212429A (ja) * 1990-01-18 1991-09-18 Nippon Steel Chem Co Ltd 半導体保護用樹脂
JP2993128B2 (ja) 1990-12-26 1999-12-20 チッソ株式会社 感光性樹脂組成物の製造法
JPH06271670A (ja) 1993-03-22 1994-09-27 Mitsui Toatsu Chem Inc 熱安定性良好な無色透明ポリイミドおよびその製造方法
JP3537907B2 (ja) * 1994-03-29 2004-06-14 株式会社東芝 ポリイミド前駆体、ポリイミド前駆体組成物、ポリイミド樹脂および電子部品
JPH08245879A (ja) * 1995-03-10 1996-09-24 Toshiba Chem Corp ポリイミド樹脂組成物
JP3738469B2 (ja) 1995-07-27 2006-01-25 日立化成工業株式会社 ポリイミド及びこれを用いた光部品
JP3730389B2 (ja) * 1998-02-06 2006-01-05 三井化学株式会社 ポリアミド酸共重合体及びポリイミド共重合体、ならびに耐熱性接着剤
US6232428B1 (en) 1999-01-19 2001-05-15 I.S.T. Corporation Essentially colorless, transparent polyimide coatings and films
JP4099769B2 (ja) * 2003-11-19 2008-06-11 荒川化学工業株式会社 メトキシシリル基含有シラン変性ポリイミドシロキサン樹脂の製造法、当該樹脂、当該樹脂組成物、硬化膜および金属箔積層体
JP2006249116A (ja) 2005-03-08 2006-09-21 Fuji Photo Film Co Ltd ポリイミドおよびそれを用いた光学フィルム
JP2008101123A (ja) * 2006-10-19 2008-05-01 Toyobo Co Ltd 変性ポリイミド系樹脂組成物、それからなるペースト及びそれらから得られる電子部品
JP2008163107A (ja) * 2006-12-27 2008-07-17 Mitsubishi Gas Chem Co Inc 光学部材
JP2008297231A (ja) * 2007-05-30 2008-12-11 Nippon Kayaku Co Ltd ヒドロキシアミド基含有脂環式ポリイミド及びその前駆体、並びにそれらを用いたポジ型感光性樹脂組成物、並びにそれらの硬化物
KR101225842B1 (ko) * 2007-08-27 2013-01-23 코오롱인더스트리 주식회사 무색투명한 폴리이미드 필름
CN102089858B (zh) * 2008-02-20 2013-03-13 夏普株式会社 柔性半导体基板的制造方法
JP5282414B2 (ja) * 2008-02-29 2013-09-04 Jnc株式会社 インクジェット用インク
JP4771100B2 (ja) * 2008-08-27 2011-09-14 信越化学工業株式会社 無溶剤型ポリイミドシリコーン系樹脂組成物及びその硬化物
JP2010265338A (ja) * 2009-05-12 2010-11-25 Shin-Etsu Chemical Co Ltd 接着剤組成物、接着用シート及びダイシング・ダイアタッチフィルム
JP5147137B2 (ja) * 2009-06-04 2013-02-20 日東電工株式会社 ポリイミド樹脂用組成物
US8487062B2 (en) * 2009-09-30 2013-07-16 Shin-Etsu Chemical Co., Ltd. Polyimidesilicone having alcoholic hydroxyl group and process for producing the same
WO2011122199A1 (ja) * 2010-03-31 2011-10-06 Jsr株式会社 基板の製造方法およびそれに用いられる組成物
JP2011219672A (ja) * 2010-04-13 2011-11-04 Toyobo Co Ltd ポリイミド樹脂
JP5667392B2 (ja) * 2010-08-23 2015-02-12 株式会社カネカ 積層体、及びその利用
JP5747822B2 (ja) * 2010-09-28 2015-07-15 東レ株式会社 樹脂組成物およびその製造方法
WO2012118020A1 (ja) 2011-02-28 2012-09-07 Jsr株式会社 樹脂組成物およびそれを用いた膜形成方法
KR20140068846A (ko) 2011-09-12 2014-06-09 도레이 카부시키가이샤 폴리이미드 수지, 이것을 사용한 수지 조성물 및 적층 필름
JP5866918B2 (ja) * 2011-09-21 2016-02-24 東レ株式会社 リチウムイオン電池正極用バインダー、それを含有するリチウムイオン電池正極用ペーストおよびリチウムイオン電池正極の製造方法
JP6020129B2 (ja) * 2012-12-19 2016-11-02 Jnc株式会社 ポリアミド酸組成物
KR102008162B1 (ko) * 2013-03-18 2019-08-07 아사히 가세이 가부시키가이샤 수지 전구체 및 그것을 함유하는 수지 조성물, 수지 필름 및 그 제조 방법, 그리고, 적층체 및 그 제조 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1711308A (zh) * 2003-01-10 2005-12-21 日东电工株式会社 聚酰亚胺薄膜及其制造方法
JP2006124670A (ja) * 2004-09-28 2006-05-18 Hitachi Chem Co Ltd プリプレグ、金属箔張積層板及びこれらを使用した印刷回路板
JP2006124637A (ja) * 2004-10-26 2006-05-18 Saehan Micronics Inc ポリイミド接着剤用組成物およびこれを用いたポリイミド接着テープ
CN102165370A (zh) * 2008-09-30 2011-08-24 索尼化学&信息部件株式会社 感光性硅氧烷聚酰亚胺树脂组合物
CN102666658A (zh) * 2009-12-22 2012-09-12 新日铁化学株式会社 聚酰亚胺树脂、其制造方法、粘接剂树脂组合物、覆盖膜以及电路基板

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