CN103282829B - 感光性树脂组合物 - Google Patents

感光性树脂组合物 Download PDF

Info

Publication number
CN103282829B
CN103282829B CN201180062574.6A CN201180062574A CN103282829B CN 103282829 B CN103282829 B CN 103282829B CN 201180062574 A CN201180062574 A CN 201180062574A CN 103282829 B CN103282829 B CN 103282829B
Authority
CN
China
Prior art keywords
mass
polymer combination
photosensitive polymer
integer
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201180062574.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN103282829A (zh
Inventor
国松真
国松真一
筒井大和
内藤也
内藤一也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Original Assignee
Asahi Kasei Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Kogyo KK filed Critical Asahi Kasei Kogyo KK
Publication of CN103282829A publication Critical patent/CN103282829A/zh
Application granted granted Critical
Publication of CN103282829B publication Critical patent/CN103282829B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
    • C08F290/062Polyethers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031Organic compounds not covered by group G03F7/029
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061Etching masks
    • H05K3/064Photoresists

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Polymerisation Methods In General (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Graft Or Block Polymers (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
CN201180062574.6A 2010-12-24 2011-11-28 感光性树脂组合物 Active CN103282829B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010288105 2010-12-24
JP2010-288105 2010-12-24
PCT/JP2011/077415 WO2012086371A1 (ja) 2010-12-24 2011-11-28 感光性樹脂組成物

Publications (2)

Publication Number Publication Date
CN103282829A CN103282829A (zh) 2013-09-04
CN103282829B true CN103282829B (zh) 2016-08-17

Family

ID=46313653

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180062574.6A Active CN103282829B (zh) 2010-12-24 2011-11-28 感光性树脂组合物

Country Status (6)

Country Link
JP (2) JP5707420B2 (ko)
KR (3) KR20130098406A (ko)
CN (1) CN103282829B (ko)
MY (1) MY179988A (ko)
TW (1) TWI530757B (ko)
WO (1) WO2012086371A1 (ko)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6063200B2 (ja) * 2012-10-15 2017-01-18 旭化成株式会社 感光性樹脂組成物
KR101675822B1 (ko) * 2013-08-07 2016-11-15 코오롱인더스트리 주식회사 드라이 필름 포토 레지스트용 감광성 수지 조성물
JP6207943B2 (ja) * 2013-09-19 2017-10-04 旭化成株式会社 感光性樹脂組成物及び感光性樹脂積層体
JP6486672B2 (ja) * 2013-12-20 2019-03-20 旭化成株式会社 感光性エレメント、及びその製造方法
JP2015152854A (ja) * 2014-02-18 2015-08-24 旭化成イーマテリアルズ株式会社 感光性樹脂組成物、感光性樹脂積層体及びレジストパターン形成方法
TWI671594B (zh) * 2014-05-13 2019-09-11 日商日立化成股份有限公司 感光性樹脂組成物、感光性元件、抗蝕劑圖案的形成方法及印刷配線板的製造方法
WO2015174468A1 (ja) * 2014-05-13 2015-11-19 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
WO2016047691A1 (ja) * 2014-09-24 2016-03-31 旭化成イーマテリアルズ株式会社 感光性樹脂組成物、感光性樹脂積層体、樹脂パターンの製造方法、硬化膜及び表示装置
TWI561920B (en) * 2014-12-22 2016-12-11 Chi Mei Corp Photosensitive polysiloxane composition, protecting film, and element having the protecting film
JP6584105B2 (ja) 2015-03-19 2019-10-02 株式会社日立製作所 微生物固定化担体及び微生物固定化担体の製造方法
TWI706222B (zh) * 2015-04-08 2020-10-01 日商旭化成股份有限公司 感光性樹脂組合物
JP2017003966A (ja) * 2015-06-12 2017-01-05 Jsr株式会社 感光性組成物、及びメッキ造形物の製造方法
CN114296315A (zh) * 2015-09-11 2022-04-08 旭化成株式会社 感光性树脂组合物
KR101890899B1 (ko) * 2015-10-21 2018-08-22 닛산 가가쿠 가부시키가이샤 광도파로 형성용 조성물
JP6567952B2 (ja) * 2015-10-26 2019-08-28 旭化成株式会社 感光性樹脂組成物、感光性樹脂積層体及びレジストパターン形成方法
JP6809873B2 (ja) * 2015-12-28 2021-01-06 旭化成株式会社 積層体
KR20180077743A (ko) * 2016-12-29 2018-07-09 주식회사 동진쎄미켐 네가티브 감광성 수지 조성물
TWI664497B (zh) * 2017-01-30 2019-07-01 日商旭化成股份有限公司 感光性樹脂組合物、感光性樹脂積層體、形成有光阻圖案之基板及電路基板之製造方法
CN110832034B (zh) * 2017-08-18 2022-10-18 积水化学工业株式会社 湿固化型树脂组合物、电子部件用粘接剂和显示元件用粘接剂
JP7162448B2 (ja) * 2018-05-29 2022-10-28 旭化成株式会社 感光性樹脂組成物、感光性樹脂組成物を用いた転写フィルム、樹脂パターン製造方法、及び硬化膜パターンの製造方法
TWI770578B (zh) * 2019-08-06 2022-07-11 日商旭化成股份有限公司 感光性樹脂組合物、及感光性元件
CN115485621A (zh) * 2020-04-28 2022-12-16 富士胶片株式会社 感光性转印材料、树脂图案的制造方法、电路配线的制造方法及触摸面板的制造方法
TWI830425B (zh) * 2021-10-25 2024-01-21 日商旭化成股份有限公司 感光性元件、及光阻圖案之形成方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009022724A1 (ja) * 2007-08-15 2009-02-19 Asahi Kasei E-Materials Corporation 感光性樹脂組成物及びその積層体
EP2042309A2 (en) * 2007-09-28 2009-04-01 FUJIFILM Corporation Method of producing a negative planographic printing plate
CN101449208A (zh) * 2006-08-03 2009-06-03 旭化成电子材料元件株式会社 感光性树脂组合物以及层压体
CN101652715A (zh) * 2007-04-04 2010-02-17 旭化成电子材料株式会社 感光性树脂组合物及层叠体

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3824550A1 (de) * 1988-07-20 1990-01-25 Basf Ag Lichtempfindliche, negativ arbeitende aufzeichnungsschicht
JP3315562B2 (ja) * 1995-06-15 2002-08-19 共栄社化学株式会社 硬化性樹脂組成物
JP4329182B2 (ja) * 1999-09-30 2009-09-09 日立化成デュポンマイクロシステムズ株式会社 アルカリネガ現像型感光性樹脂組成物、パターンの製造法及び電子部品
JP4716347B2 (ja) * 2001-04-05 2011-07-06 旭化成イーマテリアルズ株式会社 ドライフィルムレジスト
WO2003077035A1 (fr) * 2002-03-12 2003-09-18 Asahi Kasei Kabushiki Kaisha Composition de resine photosensible et utilisation de celle-ci
US20040058276A1 (en) * 2002-09-23 2004-03-25 Dueber Thomas E. Halo resistent, photoimagable coverlay compositions, having, advantageous application and removal properties, and methods relating thereto
JP4147920B2 (ja) * 2002-11-29 2008-09-10 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP4207044B2 (ja) * 2003-11-19 2009-01-14 日立化成工業株式会社 感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2006317924A (ja) * 2005-04-14 2006-11-24 Mitsubishi Chemicals Corp カラーフィルタ用硬化性樹脂組成物、カラーフィルタ、および液晶表示装置
WO2006120887A1 (ja) * 2005-05-12 2006-11-16 Nippon Kayaku Kabushiki Kaisha 感光性樹脂組成物、その硬化物及びそれを含有するフィルム
KR101190945B1 (ko) * 2005-10-25 2012-10-12 히다치 가세고교 가부시끼가이샤 감광성 수지 조성물, 이것을 이용한 감광성 엘리먼트, 레지스트 패턴의 형성방법 및 프린트 배선판의 제조방법
JP2007264483A (ja) * 2006-03-29 2007-10-11 Fujifilm Corp パターン形成材料及びパターン形成方法
WO2009128369A1 (ja) * 2008-04-14 2009-10-22 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及びその積層体
JP5411521B2 (ja) * 2009-02-09 2014-02-12 旭化成イーマテリアルズ株式会社 感光性樹脂積層体
JP5549841B2 (ja) * 2009-09-07 2014-07-16 日立化成株式会社 感光性樹脂組成物、永久レジスト用感光性フィルム、レジストパターンの形成方法、プリント配線板及びその製造方法、表面保護膜並びに層間絶縁膜

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101449208A (zh) * 2006-08-03 2009-06-03 旭化成电子材料元件株式会社 感光性树脂组合物以及层压体
CN101652715A (zh) * 2007-04-04 2010-02-17 旭化成电子材料株式会社 感光性树脂组合物及层叠体
WO2009022724A1 (ja) * 2007-08-15 2009-02-19 Asahi Kasei E-Materials Corporation 感光性樹脂組成物及びその積層体
EP2042309A2 (en) * 2007-09-28 2009-04-01 FUJIFILM Corporation Method of producing a negative planographic printing plate

Also Published As

Publication number Publication date
JPWO2012086371A1 (ja) 2014-05-22
KR20130098406A (ko) 2013-09-04
KR102019580B1 (ko) 2019-09-06
JP2015096960A (ja) 2015-05-21
KR20150017384A (ko) 2015-02-16
KR20170120190A (ko) 2017-10-30
CN103282829A (zh) 2013-09-04
TWI530757B (zh) 2016-04-21
JP5707420B2 (ja) 2015-04-30
MY179988A (en) 2020-11-19
TW201232173A (en) 2012-08-01
WO2012086371A1 (ja) 2012-06-28

Similar Documents

Publication Publication Date Title
CN103282829B (zh) 感光性树脂组合物
CN101449208B (zh) 感光性树脂组合物以及层压体
CN102428406B (zh) 感光性树脂组合物
CN101910943B (zh) 感光性树脂层压体
CN101652715B (zh) 感光性树脂组合物及层叠体
CN103091989B (zh) 感光性树脂层压体
CN102549498B (zh) 抗蚀材料用感光性树脂组合物以及感光性树脂层压体
CN106462068A (zh) 感光性树脂组合物以及电路图案的形成方法
CN111596526B (zh) 感光性树脂组合物及感光性树脂层叠体
CN1940723B (zh) 感光性树脂组合物及其层合体
CN107407880A (zh) 感光性树脂组合物
CN101779165B (zh) 感光性树脂组合物及其层压体
KR101719025B1 (ko) 감광성 수지 조성물, 이를 이용한 포토레지스트 필름, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법
TWI608298B (zh) Photosensitive resin composition, photoresist film using the same, method of forming a photoresist pattern, and method of forming a conductor pattern
CN103076718B (zh) 感光性树脂组合物、感光性树脂层压体、抗蚀图案形成方法、以及印刷线路板、引线框、半导体封装体和凹凸基板的制造方法
CN102007452B (zh) 感光性树脂组合物及其层压体
JP5057861B2 (ja) 感光性樹脂組成物及びその積層体
JP4761923B2 (ja) 感光性樹脂組成物及び積層体
CN102144189B (zh) 感光性树脂组合物、层压体、抗蚀图案形成方法以及导体图案、印刷电路板的制造方法
CN101568882A (zh) 感光性树脂组合物及层压体
CN106918993A (zh) 感光性树脂组合物、感光性树脂层叠体以及保护图案形成方法
CN104111585A (zh) 感光性树脂组合物、感光性树脂层压体和抗蚀图案形成方法
JP4230227B2 (ja) 光重合性樹脂組成物
TWI770578B (zh) 感光性樹脂組合物、及感光性元件
CN109690404A (zh) 感光性树脂组合物和感光性树脂层叠体

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20160505

Address after: Tokyo, Japan, Japan

Applicant after: Asahi Kasei Kogyo K. K.

Address before: Tokyo, Japan, Japan

Applicant before: Asahi Chemical Corp.

C14 Grant of patent or utility model
GR01 Patent grant