TWI530757B - A photosensitive resin composition - Google Patents

A photosensitive resin composition Download PDF

Info

Publication number
TWI530757B
TWI530757B TW100145649A TW100145649A TWI530757B TW I530757 B TWI530757 B TW I530757B TW 100145649 A TW100145649 A TW 100145649A TW 100145649 A TW100145649 A TW 100145649A TW I530757 B TWI530757 B TW I530757B
Authority
TW
Taiwan
Prior art keywords
photosensitive resin
resin composition
mass
compound
integer
Prior art date
Application number
TW100145649A
Other languages
English (en)
Chinese (zh)
Other versions
TW201232173A (en
Inventor
Shinichi Kunimatsu
Yamato Tsutsui
Kazuya Naito
Original Assignee
Asahi Kasei E Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei E Materials Corp filed Critical Asahi Kasei E Materials Corp
Publication of TW201232173A publication Critical patent/TW201232173A/zh
Application granted granted Critical
Publication of TWI530757B publication Critical patent/TWI530757B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
    • C08F290/062Polyethers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031Organic compounds not covered by group G03F7/029
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061Etching masks
    • H05K3/064Photoresists

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Graft Or Block Polymers (AREA)
TW100145649A 2010-12-24 2011-12-09 A photosensitive resin composition TWI530757B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010288105 2010-12-24

Publications (2)

Publication Number Publication Date
TW201232173A TW201232173A (en) 2012-08-01
TWI530757B true TWI530757B (zh) 2016-04-21

Family

ID=46313653

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100145649A TWI530757B (zh) 2010-12-24 2011-12-09 A photosensitive resin composition

Country Status (6)

Country Link
JP (2) JP5707420B2 (ko)
KR (3) KR20130098406A (ko)
CN (1) CN103282829B (ko)
MY (1) MY179988A (ko)
TW (1) TWI530757B (ko)
WO (1) WO2012086371A1 (ko)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6063200B2 (ja) * 2012-10-15 2017-01-18 旭化成株式会社 感光性樹脂組成物
KR101675822B1 (ko) * 2013-08-07 2016-11-15 코오롱인더스트리 주식회사 드라이 필름 포토 레지스트용 감광성 수지 조성물
JP6207943B2 (ja) * 2013-09-19 2017-10-04 旭化成株式会社 感光性樹脂組成物及び感光性樹脂積層体
JP6486672B2 (ja) * 2013-12-20 2019-03-20 旭化成株式会社 感光性エレメント、及びその製造方法
JP2015152854A (ja) * 2014-02-18 2015-08-24 旭化成イーマテリアルズ株式会社 感光性樹脂組成物、感光性樹脂積層体及びレジストパターン形成方法
TW201546547A (zh) * 2014-05-13 2015-12-16 Hitachi Chemical Co Ltd 感光性樹脂組成物、感光性元件、抗蝕劑圖案的形成方法及印刷配線板的製造方法
CN106462066A (zh) * 2014-05-13 2017-02-22 日立化成株式会社 感光性树脂组合物、感光性元件、抗蚀图案的形成方法及印刷布线板的制造方法
JP6318260B2 (ja) * 2014-09-24 2018-04-25 旭化成株式会社 感光性樹脂積層体、樹脂パターンの製造方法、硬化膜の製造方法及び表示装置の製造方法
TWI561920B (en) * 2014-12-22 2016-12-11 Chi Mei Corp Photosensitive polysiloxane composition, protecting film, and element having the protecting film
JP6584105B2 (ja) * 2015-03-19 2019-10-02 株式会社日立製作所 微生物固定化担体及び微生物固定化担体の製造方法
KR101990230B1 (ko) * 2015-04-08 2019-06-17 아사히 가세이 가부시키가이샤 감광성 수지 조성물
JP2017003966A (ja) * 2015-06-12 2017-01-05 Jsr株式会社 感光性組成物、及びメッキ造形物の製造方法
JP6514346B2 (ja) * 2015-09-11 2019-05-15 旭化成株式会社 感光性樹脂組成物
EP3373051B1 (en) * 2015-10-21 2020-03-11 Nissan Chemical Corporation Composition for forming optical waveguide
JP6567952B2 (ja) * 2015-10-26 2019-08-28 旭化成株式会社 感光性樹脂組成物、感光性樹脂積層体及びレジストパターン形成方法
JP6809873B2 (ja) * 2015-12-28 2021-01-06 旭化成株式会社 積層体
KR20180077743A (ko) * 2016-12-29 2018-07-09 주식회사 동진쎄미켐 네가티브 감광성 수지 조성물
TWI664497B (zh) * 2017-01-30 2019-07-01 日商旭化成股份有限公司 感光性樹脂組合物、感光性樹脂積層體、形成有光阻圖案之基板及電路基板之製造方法
JP7088838B2 (ja) * 2017-08-18 2022-06-21 積水化学工業株式会社 湿気硬化型樹脂組成物、電子部品用接着剤、及び、表示素子用接着剤
JP7162448B2 (ja) * 2018-05-29 2022-10-28 旭化成株式会社 感光性樹脂組成物、感光性樹脂組成物を用いた転写フィルム、樹脂パターン製造方法、及び硬化膜パターンの製造方法
TWI770578B (zh) * 2019-08-06 2022-07-11 日商旭化成股份有限公司 感光性樹脂組合物、及感光性元件
WO2021220980A1 (ja) * 2020-04-28 2021-11-04 富士フイルム株式会社 感光性転写材料、樹脂パターンの製造方法、回路配線の製造方法及びタッチパネルの製造方法
TWI830425B (zh) * 2021-10-25 2024-01-21 日商旭化成股份有限公司 感光性元件、及光阻圖案之形成方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3824550A1 (de) * 1988-07-20 1990-01-25 Basf Ag Lichtempfindliche, negativ arbeitende aufzeichnungsschicht
JP3315562B2 (ja) * 1995-06-15 2002-08-19 共栄社化学株式会社 硬化性樹脂組成物
JP4329182B2 (ja) * 1999-09-30 2009-09-09 日立化成デュポンマイクロシステムズ株式会社 アルカリネガ現像型感光性樹脂組成物、パターンの製造法及び電子部品
JP4716347B2 (ja) * 2001-04-05 2011-07-06 旭化成イーマテリアルズ株式会社 ドライフィルムレジスト
WO2003077035A1 (fr) * 2002-03-12 2003-09-18 Asahi Kasei Kabushiki Kaisha Composition de resine photosensible et utilisation de celle-ci
US20040058276A1 (en) * 2002-09-23 2004-03-25 Dueber Thomas E. Halo resistent, photoimagable coverlay compositions, having, advantageous application and removal properties, and methods relating thereto
JP4147920B2 (ja) * 2002-11-29 2008-09-10 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
CN101980082B (zh) * 2003-11-19 2013-07-17 日立化成株式会社 感光性树脂组合物、感光性组件、抗蚀图的形成方法及印刷电路板的制造方法
JP2006317924A (ja) * 2005-04-14 2006-11-24 Mitsubishi Chemicals Corp カラーフィルタ用硬化性樹脂組成物、カラーフィルタ、および液晶表示装置
KR101299025B1 (ko) * 2005-05-12 2013-08-27 니폰 가야꾸 가부시끼가이샤 감광성 수지 조성물, 그 경화물 및 그를 함유하는 필름
KR101141841B1 (ko) * 2005-10-25 2012-05-08 히다치 가세고교 가부시끼가이샤 감광성 수지 조성물, 이것을 이용한 감광성 엘리먼트,레지스트 패턴의 형성방법 및 프린트 배선판의 제조방법
JP2007264483A (ja) * 2006-03-29 2007-10-11 Fujifilm Corp パターン形成材料及びパターン形成方法
KR101059408B1 (ko) * 2006-08-03 2011-08-29 아사히 가세이 일렉트로닉스 가부시끼가이샤 감광성 수지 조성물 및 적층체
CN101652715B (zh) * 2007-04-04 2012-05-02 旭化成电子材料株式会社 感光性树脂组合物及层叠体
JP5221543B2 (ja) * 2007-08-15 2013-06-26 旭化成イーマテリアルズ株式会社 感光性樹脂組成物及びその積層体
JP2009086373A (ja) * 2007-09-28 2009-04-23 Fujifilm Corp ネガ型平版印刷版の現像方法
CN102007452B (zh) * 2008-04-14 2012-10-31 旭化成电子材料株式会社 感光性树脂组合物及其层压体
JP5411521B2 (ja) * 2009-02-09 2014-02-12 旭化成イーマテリアルズ株式会社 感光性樹脂積層体
JP5549841B2 (ja) * 2009-09-07 2014-07-16 日立化成株式会社 感光性樹脂組成物、永久レジスト用感光性フィルム、レジストパターンの形成方法、プリント配線板及びその製造方法、表面保護膜並びに層間絶縁膜

Also Published As

Publication number Publication date
TW201232173A (en) 2012-08-01
KR20130098406A (ko) 2013-09-04
CN103282829B (zh) 2016-08-17
JP5707420B2 (ja) 2015-04-30
JPWO2012086371A1 (ja) 2014-05-22
WO2012086371A1 (ja) 2012-06-28
MY179988A (en) 2020-11-19
JP2015096960A (ja) 2015-05-21
CN103282829A (zh) 2013-09-04
KR20170120190A (ko) 2017-10-30
KR20150017384A (ko) 2015-02-16
KR102019580B1 (ko) 2019-09-06

Similar Documents

Publication Publication Date Title
TWI530757B (zh) A photosensitive resin composition
TWI570513B (zh) And a method for forming a photosensitive resin composition and a circuit pattern
WO2008015983A1 (en) Photosensitive resin composition and laminate
TWI392967B (zh) Photosensitive resin composition and laminate
TWI536094B (zh) Photosensitive resin laminate
WO2007129589A1 (ja) 感光性樹脂組成物
TW201843527A (zh) 感光性樹脂組合物、感光性元件、抗蝕圖案之形成方法、及配線板之製造方法
JP4979391B2 (ja) 感光性樹脂積層体
TWI608298B (zh) Photosensitive resin composition, photoresist film using the same, method of forming a photoresist pattern, and method of forming a conductor pattern
TWI240149B (en) Photosensitive resin composition, photosensitive element comprising the same, process for producing resist pattern, and process for producing printed circuit board
TWI396045B (zh) A photosensitive resin composition and a laminate thereof
TW201217905A (en) in which the Haze of the support film is 0.01-2.0%, and the total particles with diameter greater than 5 μm and agglutinate with diameter greater than 5 μm in the support film are less than 5 per mm<SP>2</SP>
JP5592631B2 (ja) 感光性樹脂組成物
JP4885243B2 (ja) 感光性樹脂組成物及び積層体
TWI412884B (zh) Photosensitive resin composition, photosensitive resin laminate, photoresist pattern forming method and manufacturing method of conductor pattern, printed wiring board, lead frame, substrate and semiconductor package
JP2012220686A (ja) 感光性樹脂組成物及びその積層体
TW201111911A (en) Photosensitive resin composition, photosensitive resin laminate, and method for forming resist pattern
JP5411521B2 (ja) 感光性樹脂積層体
TW202020563A (zh) 感光性樹脂組合物
JP2010113349A (ja) 感光性樹脂組成物
WO2021095784A1 (ja) 感光性樹脂組成物及び感光性樹脂積層体
JP2009053388A (ja) 感光性樹脂組成物
JP2006225498A (ja) 光重合開始剤