CN102257431B - 正型感光性树脂组合物、抗蚀图形的制造方法、半导体装置以及电子器件 - Google Patents
正型感光性树脂组合物、抗蚀图形的制造方法、半导体装置以及电子器件 Download PDFInfo
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- CN102257431B CN102257431B CN2009801518528A CN200980151852A CN102257431B CN 102257431 B CN102257431 B CN 102257431B CN 2009801518528 A CN2009801518528 A CN 2009801518528A CN 200980151852 A CN200980151852 A CN 200980151852A CN 102257431 B CN102257431 B CN 102257431B
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Images
Classifications
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
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- Physics & Mathematics (AREA)
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- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
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- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Phenolic Resins Or Amino Resins (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
Claims (21)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310016907.2A CN103091987B (zh) | 2008-12-26 | 2009-12-16 | 正型感光性树脂组合物、抗蚀图形的制造方法、半导体装置以及电子器件 |
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JP2008334127 | 2008-12-26 | ||
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JP2009-110997 | 2009-04-30 | ||
JP2009110997 | 2009-04-30 | ||
JP2009244379 | 2009-10-23 | ||
JP2009-244379 | 2009-10-23 | ||
PCT/JP2009/070987 WO2010073948A1 (ja) | 2008-12-26 | 2009-12-16 | ポジ型感光性樹脂組成物、レジストパターンの製造方法、半導体装置及び電子デバイス |
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CN201310016907.2A Division CN103091987B (zh) | 2008-12-26 | 2009-12-16 | 正型感光性树脂组合物、抗蚀图形的制造方法、半导体装置以及电子器件 |
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CN102257431A CN102257431A (zh) | 2011-11-23 |
CN102257431B true CN102257431B (zh) | 2013-06-26 |
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CN2009801518528A Active CN102257431B (zh) | 2008-12-26 | 2009-12-16 | 正型感光性树脂组合物、抗蚀图形的制造方法、半导体装置以及电子器件 |
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EP (1) | EP2372457B1 (zh) |
JP (2) | JP5158212B2 (zh) |
KR (2) | KR101398754B1 (zh) |
CN (2) | CN103091987B (zh) |
DE (1) | DE202009018857U1 (zh) |
SG (1) | SG172756A1 (zh) |
TW (1) | TWI461851B (zh) |
WO (1) | WO2010073948A1 (zh) |
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Publication number | Priority date | Publication date | Assignee | Title |
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KR101398754B1 (ko) * | 2008-12-26 | 2014-05-27 | 히타치가세이가부시끼가이샤 | 포지티브형 감광성 수지 조성물, 레지스트 패턴의 제조 방법, 반도체 장치 및 전자 디바이스 |
JP5504824B2 (ja) * | 2009-10-28 | 2014-05-28 | Jsr株式会社 | ポジ型感放射線性樹脂組成物、層間絶縁膜及びその形成方法 |
JP5630374B2 (ja) * | 2010-06-11 | 2014-11-26 | 信越化学工業株式会社 | マイクロ構造体の製造方法及び光パターン形成性犠牲膜形成用組成物 |
US20110309481A1 (en) * | 2010-06-18 | 2011-12-22 | Rui Huang | Integrated circuit packaging system with flip chip mounting and method of manufacture thereof |
JP5915532B2 (ja) | 2010-09-16 | 2016-05-11 | 日立化成株式会社 | ポジ型感光性樹脂組成物、レジストパターンの製造方法及び電子部品 |
JP5903831B2 (ja) * | 2011-10-27 | 2016-04-13 | ナガセケムテックス株式会社 | 基板表面保護膜用組成物及び基板の製造方法 |
US8932796B2 (en) * | 2011-11-10 | 2015-01-13 | International Business Machines Corporation | Hybrid photoresist composition and pattern forming method using thereof |
SG11201401963QA (en) * | 2011-12-13 | 2014-09-26 | Hitachi Chemical Co Ltd | Photosensitive resin composition, method for manufacturing patterned cured film, and electronic component |
JP2013130816A (ja) * | 2011-12-22 | 2013-07-04 | Nippon Zeon Co Ltd | 永久膜用樹脂組成物及び電子部品 |
JP2013134346A (ja) * | 2011-12-26 | 2013-07-08 | Hitachi Chemical Co Ltd | 感光性樹脂組成物、パターン硬化膜の製造方法、半導体装置及び電子部品 |
WO2013118680A1 (ja) * | 2012-02-07 | 2013-08-15 | 日立化成株式会社 | 感光性樹脂組成物、パターン硬化膜の製造方法及び電子部品 |
WO2013122208A1 (ja) * | 2012-02-17 | 2013-08-22 | 日立化成株式会社 | 感光性樹脂組成物、パターン硬化膜の製造方法及び電子部品 |
JP2013228416A (ja) * | 2012-04-24 | 2013-11-07 | Hitachi Chemical Co Ltd | ポジ型感光性樹脂組成物及びこれを用いた感光性フィルム |
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DE202009018857U1 (de) | 2014-01-09 |
SG172756A1 (en) | 2011-08-29 |
TW201033736A (en) | 2010-09-16 |
CN102257431A (zh) | 2011-11-23 |
CN103091987A (zh) | 2013-05-08 |
CN103091987B (zh) | 2016-11-23 |
JP5494766B2 (ja) | 2014-05-21 |
JP5158212B2 (ja) | 2013-03-06 |
KR20130086258A (ko) | 2013-07-31 |
EP2372457B1 (en) | 2014-11-26 |
KR101397771B1 (ko) | 2014-05-20 |
EP2372457A1 (en) | 2011-10-05 |
JP2013015856A (ja) | 2013-01-24 |
KR101398754B1 (ko) | 2014-05-27 |
WO2010073948A1 (ja) | 2010-07-01 |
KR20110050740A (ko) | 2011-05-16 |
US8461699B2 (en) | 2013-06-11 |
JPWO2010073948A1 (ja) | 2012-06-14 |
US20110254178A1 (en) | 2011-10-20 |
TWI461851B (zh) | 2014-11-21 |
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