CN102244016A - 树脂密封型半导体装置及其制造方法、引线框 - Google Patents

树脂密封型半导体装置及其制造方法、引线框 Download PDF

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CN102244016A
CN102244016A CN2011101578208A CN201110157820A CN102244016A CN 102244016 A CN102244016 A CN 102244016A CN 2011101578208 A CN2011101578208 A CN 2011101578208A CN 201110157820 A CN201110157820 A CN 201110157820A CN 102244016 A CN102244016 A CN 102244016A
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lead frame
lead
housing
wire
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CN102244016B (zh
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佐佐木武
新藤昌浩
恩田和美
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Sanyo Electric Co Ltd
Sanyo Semiconductor Co Ltd
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Abstract

本发明提供一种树脂密封型半导体装置及其制造方法、引线框。防止因超声波Al引线接合牢固地将被固定在引线框上的各半导体芯片等和引线框的引线接合部接合以及切断引线框的外框时的外框的未切断部分而造成的各半导体芯片等产生短路的弊害。使引线框上的引线接合部等沿引线接合方向延伸，用连结引线等与引线框的外框连结，从而阻止超声波Al引线接合时的超声波振动力的发散，形成Al线与引线接合部等的牢固的接合。而且，树脂密封工序结束后，切断外框，但即使外框的未切断部分残留在树脂封装件的侧面的情况下，通过在连结引线等和其他悬吊引线等之间的外框上设有缺口等，防止连结引线等与悬吊引线等连结。

Description

树脂密封型半导体装置及其制造方法、引线框
本申请是申请日为2009年8月28日、申请号为200910168127.3、发明名称为“树脂密封型半导体装置及其制造方法、引线框”的分案申请。
技术领域
本发明涉及树脂密封型半导体装置及其制造方法、引线框。
背景技术
树脂密封型半导体装置是通过将引线框和各种半导体芯片等一体化之后，对除了外部引线、外框之外的部分进行树脂密封而形成的。其详情如下所述，首先，准备对由Cu材料等构成的基底金属进行冲压加工而成的引线框。引线框包括：用于搭载半导体芯片等的岛；由与半导体芯片的接合焊盘等连结的引线接合部等构成的内部引线；从内部引线延伸到密封树脂的外部的外部引线；支承外部引线间的连接杆(tie bar)；支承引线框整体的外框；为了支承自外框分离的岛等而将外框与岛等连结的悬吊引线。
半导体芯片的背面被导电材料固定并芯片接合(die bond)在岛上。而且，半导体芯片上的接合焊盘和内部引线上的引线接合部被金线等引线接合而连接。芯片电容器等无源元件也跨在内部引线间地被导电材料固定。固定有半导体芯片等的引线框被安置在树脂密封装置内，包括连接杆的外部引线部和外框部以被夹持在树脂密封装置的上模和下模之间的状态而被注入树脂，搭载有半导体芯片等的引线框被树脂密封。之后，对外部引线进行镀锡等之后，通过冲压加工切断连接杆、外框，根据需要进行外部引线的折弯加工，完成树脂密封型半导体装置。
这样的树脂密封型半导体装置的组装工序记载在以下的专利文献1和非专利文献1中。
专利文献1：日本特开2005-64076号公报
非专利文献1：图解最尖端半导体封装技术总汇/半导体技术研究会编(2007年9月25日第一版第1次发行株式会社工业调查会)
在树脂密封型半导体装置中，如上所述，芯片接合于引线框上的岛的半导体芯片通常以如上所述的Au线(金线)将半导体芯片上的焊盘电极与内部引线上的引线接合部引线接合而连接。但是，在半导体芯片的输出大的情况下，流过大电流，因此引线接合用的线需要粗的线。而且，功率半导体芯片通过焊锡进行芯片接合，高温下的引线接合很困难。因此，这种情况下，替代高价的Au线，使用廉价且电阻也低、并且在常温下能接合的Al线(铝线)。
用Au线进行引线接合的情况下，提高作为接合对象的部分的温度，通过所谓的热压接，形成Au和Al的合金，形成牢固的接合。除了热量以外，利用超声波增加接合力的情况也很多。相对于此，用Al线进行引线接合的情况下，为了在常温下进行作业，还需要增加超声波的强度。原因在于，需要弄破形成在半导体芯片上的焊盘电极表面的氧化铝膜、形成在引线框上的引线接合部的各种氧化膜等，使Al线和焊盘电极等的铝等直接接触。
这种情况下，为了使超声波的振动方向朝着Al线延伸的恒定的方向，形成最佳的结合，由超声波的振动产生的力需要集中施加在被引线接合的部分。因此，第1个课题是，以使引线框上的引线接合部不孤立地、由超声波的振动产生的力不流失的方式对引线接合部施加足够的力。
此外，在树脂密封型半导体装置中，在引线框的岛上除了半导体芯片之外，有时芯片接合有无源元件等。作为无源元件的芯片电容器跨在两个不同的内部引线上的接合部上而被固定。
这种情况下，引线框变薄时，在半导体芯片、无源元件的芯片接合、引线接合时的力的作用下，引线框有可能变形。针对这个问题，采用如下对策：通过设置悬吊引线，将该悬吊引线配置在封装件的外部，与刚性好的引线框的外框连接，增加机械强度。
该悬吊引线所连结的引线框的外框在树脂密封后，在切断外部引线间的连接杆时同时被切断去除，因此与各半导体芯片等连结的悬吊引线间也被断开，确保各半导体芯片等之间的电绝缘性。但是，有时外框在树脂肪封装件的侧面未被完全地切断去除而残留，残留的引线框的外框与各悬吊引线仍然保持连结的状态，有时搭载在与各悬吊引线相连的岛等上的半导体芯片等之间产生短路。消灭这样残留的外框所导致的半导体芯片等之间的短路成为第2个课题。
发明内容
本发明的树脂密封型半导体装置的制造方法的特征在于，包括以下工序：将半导体芯片芯片接合于引线框上的岛的工序；用Al线对上述半导体芯片和上述引线框进行超声波引线接合的工序；以及对芯片接合有上述半导体芯片的上述引线框进行树脂密封的工序，上述引线框上的引线接合部沿着上述超声波的振动方向延伸，并与上述引线框的外框连结。
并且，本发明的树脂密封型半导体装置的制造方法的特征在于，包括以下工序：准备在外框上具有缺口的引线框的工序；将半导体芯片芯片接合在上述引线框的岛上的工序；将上述半导体芯片和上述引线框电连接的工序；利用树脂封装件对芯片接合有上述半导体芯片的上述引线框进行密封的工序；以及将露出到上述树脂封装件外侧的连接杆切断的工序，切断上述连接杆的同时，在包括设置在上述外框上的上述缺口部分在内的位置切断上述引线框的上述外框。
此外，本发明的树脂密封型半导体装置的特征在于，包括：芯片接合在引线框的岛上的半导体芯片；用Al线与上述半导体芯片超声波引线接合的上述引线框上的引线接合部；以及对上述引线框进行树脂密封的树脂封装件，上述引线框上的上述引线接合部朝着上述Al线的接合方向延伸到上述树脂封装件的端部。
并且，本发明的树脂密封型半导体装置的特征在于，包括：芯片接合半导体芯片并与之电连接的引线框；以及对上述引线框进行密封的树脂封装件，残留在上述树脂封装件外周的上述引线框的外框在设置于该引线框的该外框上的缺口部分被切断。
此外，本发明的引线框的特征在于，包括：用于搭载半导体芯片的岛；用Al线与上述半导体芯片超声波接合的引线接合部；形成在引线框的外周的外框；以及将上述岛和上述外框连接的多个悬吊引线，上述引线接合部具有沿着上述超声波的振动方向延伸的连结引线，与上述外框连结。
并且，本发明的引线框的特征在于，包括：用于搭载半导体芯片的岛；构成引线框的外周的外框；以及将上述岛和上述外框连结的多个悬吊引线，在2个悬吊引线之间的上述外框上形成有缺口。
根据本发明，即使半导体芯片3等的焊盘电极和引线框1上的引线接合部14a等之间、半导体芯片2等彼此的焊盘电极间的引线接合通过采用Al线6a等的超声波引线接合来进行，也能形成牢固的接合。而且，根据本发明，引线框1的外框8即使残留在树脂封装件12的外周，也能防止内置在树脂封装件12内的各半导体芯片2等之间产生短路。
附图说明
图1是表示本发明的第1实施方式的树脂密封型半导体装置的制造方法的树脂密封前的状态的俯视图。
图2是表示本发明的第2实施方式的树脂密封型半导体装置的制造方法的树脂密封前的状态的俯视图。
图3是表示以往的实施方式的树脂密封型半导体装置的制造方法的树脂密封前的状态的俯视图。
图4是表示安置在树脂密封装置的模具内的、搭载有半导体芯片等的引线框的图。
图5是表示自上模侧透视安置在树脂密封装置的模具内的、搭载有半导体芯片等的引线框的图。
具体实施方式
第1实施方式
下面根据附图说明本发明的第1实施方式。
另外，所使用的引线框1存在多个相同图案只排列成一列的引线框，也存在排列成2列、3列的引线框，为了理解发明，因为对一个图案进行记述就足够，所以对一个图案详细地图示来进行说明。此外，对于封装件，也采用作为简单的封装件的SIP(Single In-line Package)类型来进行说明。
在说明本实施方式之前，根据图3对本发明之前的引线框1的构造进行说明。如图3所示，引线框1上的、搭载有功率半导体芯片2和控制器用半导体芯片3的岛13、搭载有其他芯片电容器4等的岛13、内部引线1b分别通过悬吊引线5a、5b、5c，与引线框的外框8连结，提高了其刚性。作为将半导体芯片3与引线框1的引线接合部14a、14b、14c引线接合时的线，在采用通过热压接来进行引线接合的Au线的情况下，引线接合的力主要沿垂直方向作用在引线框1的主面上。因此，对于图3所示的引线框1的主面，作用在左右、上下方向的力较小，在该引线框1的构造中较少成为问题。但是，采用Al线6a、6b、7a、7b、7c来进行超声波引线接合时，超声波振动产生的较大的力作用在引线框1的主面的左右、上下方向，因此有可能产生问题。
这样，根据图1说明本发明的第1实施方式。
首先，准备引线框1，使用焊锡预成型体等将流过大电流且发热量多的功率半导体芯片2芯片接合在引线框1的、半导体芯片2要搭载的岛13上。这种情况下，引线框1使用对Cu材料进行镀Ni等而形成的引线框。此外，控制器用半导体芯片3耗电少，因此通过Ag糊剂等，将控制器用半导体芯片3芯片接合在控制器用半导体芯片3要搭载的岛13上。芯片电容器4那样的无源元件也同样通过Ag糊剂接合在引线框1的岛13和内部引线1b上。在通过Ag糊剂接合的情况下，引线框1也被镀Ag等。
接着，在功率半导体芯片2和控制器用半导体芯片3之间、控制器用半导体芯片3和引线框1上的引线接合部14a之间通过粗的Al线6a、6b进行超声波引线接合，形成电源线。同时，通过稍细的Al线7a、7b、7c进行超声波引线接合，该稍细的Al线7a、7b、7c从控制器用半导体芯片3连接到功率半导体芯片2的栅极、引线框1上的引线接合部14b、14c。
支承上述Al线超声波接合时的施加在引线框1左右、上下方向的力，将超声波振动高效地用作进行引线接合的力，这一点成为第1实施方式的发明的主旨。例如，考虑到将粗的Al线6b与引线框1上的引线接合部14a引线接合时的、超声波的振动方向。这种情况下，施加在Al线6b上的超声波振动处于被引线接合的Al线6b朝着的方向、即为图1中的左斜上的方向。这种情况下，超声波振动产生的力的方向能分解为图中的向上和向左的力。这样一来，如图3所示，在只有悬吊引线5a的情况下，无法支承作用于左横向的力，所以引线框1上的引线接合部14a多少会向左方向振动，无法有效地使用超声波的力。
相对于此，在表示本发明的图1中，由连结引线9可靠地支承引线框1上的引线接合部14a的左侧，防止超声波振动的力向左流失。而且，连结引线9与牢固的引线框1的外框8连结，因此更进一步阻止超声波振动的力向左流失。同样，Al线6b的作用在控制器用半导体芯片3上的焊盘电极上的朝着右斜下方的超声波振动的力的向下的力也通过悬吊引线5a支承，该超声波振动的力的向右的力由连结引线9支承，因此能进行牢固的接合。
Al线6a的作用在控制器用半导体芯片3上的焊盘电极上的朝着左斜上方向的超声波振动的力也是同样由悬吊引线5a支承向上的力和由连结引线9支承向左的力的合力。接着，对施加在功率半导体芯片2上的焊盘电极上的超声波振动的力进行考察。这种情况下，超声波振动的力朝着Al线6a的朝向、即、图1的右下方。这种情况的超声波振动的力能分解为向下的力和向右的力。其中，向下的力由外部引线1a支承。向右的力在图3的情况下无法支承，在表示本发明的图1中，设置连结引线10，与外框8一体地形成，因此能充分地支承向右的力。
对于稍细的Al线7a等超声波引线接合时的振动的力，也与粗Al线6a等情况同样地由连结引线9等支承。在Al线7a的情况下，向左上方的力作用在被引线接合的内部引线1b部分，但该力小于粗Al线6a等情况的力，因此其向上的力和向左的力由悬吊引线5c支承。在Al线7b的情况下，大致沿上下方向作用有力，因此向上的力由悬吊引线5a支承，向下的力由外部引线1a支承。在Al线7c的情况下，为左右方向的振动力，因此通过连结引线9和10从左右牢固地支承。
如上所述，超声波振动的力除了由悬吊引线5a、5b、5c和外部引线1a支承之外，还通过第1实施方式中所采用的连结引线9和10牢固地支承，因此即使通过超声波Al引线接合也能形成稳定的接合，能进行可靠性高的引线接合。接着，搭载了功率半导体芯片2等的引线框1通过树脂密封工序被树脂密封，图1的点划线所围着的内部是充满树脂而形成的树脂封装件12。之后，直到树脂密封工序结束支承外部引线1a的连接杆11和支承引线框1整体的引线框1的外框8被切断，根据需要，通过对外部引线1a进行折弯加工等，完成树脂密封型半导体装置。
第2实施方式
在说明第2实施方式之前，对树脂密封工序和引线框1的外框8的切断工序的内容和问题进行研究。在树脂密封工序中，如图4所示，搭载有通过Al线6a等引线接合的半导体芯片2等的引线框1被夹在树脂密封装置的上模100和下模101之间的空间中，进行树脂注入。在图4中，左侧的连接杆11夹在上模100和下模101之间，起到了阻挡杆的作用，阻止树脂从左侧流出到树脂封装件12的外部。此外，右侧的引线框1的外框8夹在上模100和下模101之间，阻止树脂从右侧流出到树脂封装件12的外部。跟前侧、纵深侧也同样利用外框8阻止树脂流出到树脂封装件12的外部。
这种情况下，为了尽可能缩小树脂封装件12，因此使仅支持岛13等而不具有其他作用的图4所示的悬吊引线5a等尽可能形成得变细且较短。而且，如图4所示，引线框1的外框8的内侧部分和树脂封装件12的外周部分也以接触且相邻的状态形成。树脂密封工序结束时，结束了作为支承体的作用的连接杆11和外框8同时被切断，根据树脂封装件12的外侧和引线框1的外框8的内侧之间的位置关系等，有时外框8未完全去除，外框8的一部分残留在树脂封装件12的外周。
这种情况下，悬吊引线5a等与残留的不需要外框8连结，因此成为其残留部的支承体。特别是，也被认为是悬吊引线的一种的上述的连结引线9等支承Al引线接合时的大的超声波振动力，因此与通常的悬吊引线5a等相比，连结引线9等构成得宽度非常宽，因此将残留的不需要的外框8比引线5a等范围大且牢固地支承。具体来说，在表示第1实施方式的图1的情况下，切断引线框1的外框8时，外框8从树脂封装件12的端部朝着树脂封装件12的外部延伸，因此，在树脂封装件12的横向的侧面和上侧面难以完全切断外框8，细小的引线框1的外框8残留在该树脂封装件12的侧面的可能性高。
在不以某些方法去除残留在树脂封装件12的侧面的引线框1的外框8的情况下，在图1所示的情况下，产生如下弊害：与载置有半导体芯片2的岛13连结的悬吊引线5b和与载置有半导体芯片3的岛13连结的悬吊引线5a经由残留在树脂封装件12侧面的引线框1的外框8保持连结的状态，未被断开。连结引线9也产生同样的弊害，连结引线9的宽度远远宽于悬吊引线5a等的宽度，是谋求有效地利用Al引线接合时的超声波振动力而引入的。即，与载置有半导体芯片3的岛13连结的连结引线9和与接合有芯片电容器4的一方的电极的内部引线1b连结的悬吊引线5c经由残留在树脂封装件12侧面的引线框1的外框8保持连结的状态，未被断开。
为了防止或去除这些弊害，较长地形成悬吊引线5a等，使悬吊引线5a的一部分在露出到树脂封装件12的外侧的状态下，将该露出部与外框8一起切断，或根据需要，从切断后的树脂封装件的外周刮掉残留的外框8。但是，无法容易地刮掉与宽度较宽的连结引线9等较大范围地连接的残留了的外框8。此外，为了加长悬吊引线5a等而一部分露出到树脂封装件12的外侧，引线框1整体增大了相当于悬吊引线5a等加长的量，或者通过缩小外框8的宽度而不改变引线框1整体大小等，这些需要花费时间和精力。
这样，基于图2详细地说明本发明的第2实施方式。第2实施方式的特征在于，不改变引线框1整体的大小，而且，不刮掉残留的外框8地阻止通过引线框1的外框8的不需要的残留物将连结引线9等和悬吊引线5c等连结，防止各半导体元件等因残留的外框8而产生短路。
图5是表示从上模100方向透视到的图4所示的树脂密封装置的内部的、搭载有半导体元件2等的状态下的引线框1的结构。外部引线1a侧起到作为连接杆11被上模100和下模101牢固地夹持的阻挡件的作用，防止树脂流出到外部引线1a侧。而且，树脂封装件12的两侧和上表面侧的同样被上模100和下模101牢固夹持的引线框1的外框8防止树脂流出到树脂封装件12外。并且，示出了在与树脂封装件12的端部接触的、被上模100和下模101夹持的引线框1的外框8上形成有从该外框8的内侧朝着外侧的缺口15、16。
第2实施方式的发明的特征如图5、图2所示，通过在引线框1的外框8上形成缺口15、16等，断开残留在树脂封装件12侧面的引线框1的外框8，排除各悬吊引线5c等、连结引线9等之间的连结，防止各半导体元件2等之间的短路。缺口15等如图2所示那样在引线框1的外框8与树脂封装件12抵接的一侧较小地形成，是不对引线框1的整体的强度产生影响那样程度的大小。缺口15的横向宽度只要是能断开引线框1的残留的外框8那样的宽度即可。缺口15的纵深也是缺口15的前端从树脂封装件12露出的程度即可。在图2中只记载了2个缺口15、16，形成在包括需要断开的连结引线在内的各悬吊引线之间。
通过在该引线框1的外框8上形成缺口15等，在树脂密封工序中，用上模100、下模101夹持引线框1时，能够将该缺口15等用作对准标记，所以具有精度良好地对引线框1的外框8的内侧与模具100等进行对位这样的优点。缺口15等从外框8的内侧朝向外侧凹陷，因此在该凹陷内，如图5所示，与形成在外部引线1a上的连接杆11和树脂封装件12之间的树脂毛刺17同样地形成有树脂毛刺18。
因此，在接着切断外框8的情况下，能以缺口15等的内部的黑色的树脂毛刺18为基准，沿着与树脂封装件12之间的边界最大限定地切断外框8，所以未切断的外框8残留的概率也变低。而且，横截缺口15等地切断引线框1的外框8，因此，即使在树脂封装件12的侧面产生了引线框1的外框8的未切断的部分，也能在缺口15等部分断开外框8的未切断的部分。即，通过该缺口15等，即使存在引线框1的外框8的未切断的部分，外框8的残留部也会被切断。
因此，由于缺口15的存在，从载置有控制器用半导体芯片3的岛13延伸的悬吊引线5a、连结引线9、从载置有芯片电容器4的一方的电极的内部引线1b延伸的悬吊引线5c之间的连结被阻止。同样，由于缺口16的存在，从载置有控制器用半导体芯片3、芯片电容器4的岛13延伸的悬吊引线5a以及从载置有功率半导体芯片2的岛13延伸的悬吊引线5b由引线框1的外框8的残留部连结的情况也被阻止。
结果，根据第2实施方式的发明，解决了因引线框1的外框8的切断残留部而引起的各半导体芯片等之间的短路这样的问题，能制造可靠性高的树脂密封型半导体装置。另外，缺口15等在图2中形成为コ字形，只要能达到本发明的目的，以从外框8的内侧朝着外侧的V字形、半圆形等与コ字形不同的形状形成也没有关系。
而且，在本发明的各实施方式中，作为超声波引线接合材料，对使用Al线的情况进行了记载，但当然也可以适用于使用以铜为主要成分的线的情况。对于封装件，对SIP型封装件进行了说明，但只要发明构思相同，当然也可以使用DIP(DualIn-line Package)型封装件等其他封装件。

Claims (6)

1.一种树脂密封型半导体装置的制造方法，其特征在于，包括：
准备在外框上具有缺口的引线框的工序；
将半导体芯片芯片接合在上述引线框的岛上的工序；
将上述半导体芯片和上述引线框电连接的工序，
利用树脂封装件对芯片接合有上述半导体芯片的上述引线框进行密封的工序；
将露出到上述树脂封装件外侧的连接杆切断的工序，
切断上述连接杆的同时，在包括设置在上述外框上的上述缺口的部分在内的位置切断上述引线框的上述外框。
2.根据权利要求1所述的树脂密封型半导体装置的制造方法，其特征在于，
将上述缺口形成在2个悬吊引线之间的上述引线框的上述外框上。
3.一种树脂密封型半导体装置，其特征在于，
包括：
芯片接合半导体芯片并与之电连接的引线框；
对上述引线框进行密封的树脂封装件，
残留在上述树脂封装件外周的上述引线框的外框在设置于该引线框的该外框上的缺口部分被切断。
4.根据权利要求3所述的树脂密封型半导体装置，其特征在于，
上述引线框包括：芯片接合有上述半导体芯片的岛和将上述岛与上述外框连结的多个悬吊引线，
上述缺口部分形成在2个悬吊引线之间的上述外框上。
5.一种引线框，其特征在于，
包括：
用于搭载半导体芯片的岛；
构成引线框的外周的外框；
将上述岛和上述外框连结的多个悬吊引线，
在2个上述悬吊引线之间的上述外框上形成有缺口。
6.根据权利要求5所述的引线框，其特征在于，
隔着上述外框的上述缺口的2个上述悬吊引线的一方或双方是将上述外框与上述岛或内部引线连结的连结引线。
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