CN101636851B - 发光二极管结构以及用于制成发光二极管结构的工艺 - Google Patents
发光二极管结构以及用于制成发光二极管结构的工艺 Download PDFInfo
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- CN101636851B CN101636851B CN2008800062087A CN200880006208A CN101636851B CN 101636851 B CN101636851 B CN 101636851B CN 2008800062087 A CN2008800062087 A CN 2008800062087A CN 200880006208 A CN200880006208 A CN 200880006208A CN 101636851 B CN101636851 B CN 101636851B
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Abstract
描述了用于LED结构的过模压透镜和某些制造技术。在一个实施例中,制成薄的YAG磷光体板并且将其贴在安装到基板晶片上的蓝色LED上。接着,在单模压工艺期间在每个LED结构上模压清晰透镜。然后,将这些LED与晶片分离。模压透镜可以包含红色磷光体以便产生更暖和的白色光。在另一个实施例中,首先临时将磷光体板安装到底板上,并且在磷光体板上模压包含红色磷光体的透镜。将具有过模压透镜的板从底板中移除并且贴在提供能量的LED的顶部。然后,在每个LED结构上模压清晰透镜。模压磷光体加载透镜的形状可以被设计成改善颜色-角度关系的均匀性。多个管芯可以由单个透镜封装。在另一个实施例中,将预制的准直透镜粘贴到过模压透镜的平坦顶部。
Description
本申请是Willem Smits、Grigorily Basin等人于2005年3月29日提交的题为“Wide Emitting Lens for LED Useful for Backlighting”、序列号为No.11/093961的美国申请的部分继续申请(CIP),该序列号为No.11/093961的美国申请是Grigoriy Basin等人于2005年2月28日提交的题为“Overmolded Lens Over LED Die”、序列号为No.11/069418的美国申请的CIP,所述序列号为No.11/069418的美国申请是GrigoriyBasin等人于2004年11月15日提交的题为“Molded Lens Over LEDDie”、序列号为No.10/990208的美国申请的CIP,所有这些文献都通过引用合并于此。
本发明涉及发光二极管(LED),特别地,涉及特定的透镜设计和用于在LED管芯(die)上形成透镜的技术。
LED管芯典型地以朗伯模式发射光。通常,在LED管芯上使用透镜以便缩窄光束或者形成侧发射模式。用于表面安装LED的常见类型的透镜是预制模压塑料,其键合到其中安装了LED管芯的封装。转让给飞利浦Lumileds照明公司并且通过引用合并于此的美国专利No.6274924中示出了一种这样的透镜。
与各种不同的透镜设计一起,本文描述了形成用于表面安装LED的模压透镜的技术。此外,还描述了用于在该透镜内提供颜色转换磷光体的各种不同的技术。
在用于形成透镜的一种方法中,将一个LED管芯或多个LED管芯安装到支撑结构上。该支撑结构可以是陶瓷衬底、硅衬底或者其他类型的支撑结构,其中LED管芯电连接到该支撑结构上的金属焊盘。该支撑结构可以是安装到电路板上的基板(submount)或者封装中的热沉。
模具(mold)在其内具有与支撑结构上的LED管芯位置相应的压痕(indentation)。这些压痕填充有液态光学透明材料,例如硅树脂,其在固化时形成硬化的透镜材料。这些压痕的形状将是透镜的形状。将所述模具和LED管芯/支撑结构集中在一起,使得每个LED管芯驻留在关联的压痕中的液态透镜材料内。
接着,加热模具以便使透镜材料固化(硬化)。然后,将模具和支撑结构分离,从而在每个LED管芯上留下完整的透镜。这个一般的工艺过程将称为过模压(overmold)。与其中在待封装对象周围装入空模具之后在高压下注入液态材料的注射成型技术形成对照的是,本发明没有使用这种注射并且LED和任何线焊(wire bond)都没有被模压工艺施加应力。此外,透镜材料的浪费非常小。再者,在模具压痕之间不存在导管,这是注射成型所需要的。
可以利用不同的模具来重复过模压工艺以便形成重叠的透镜壳。这些透镜可以包含磷光体的任意组合以便将LED光转换成任何颜色,包括白色。
在一个实施例中,通过在加热和加压下烧结磷光体颗粒或者通过烘干磷光体颗粒浆来形成薄的陶瓷磷光体板。每个板具有尺寸与提供能量的LED的顶面近似的表面,所述LED例如蓝色LED。磷光体可以是YAG磷光体,其中来自LED的蓝色光和来自YAG磷光体的绿黄色光的组合产生白色光。可以将这些板贴(affix)在安装到基板晶片上的LED上,接着在每个LED结构上模压清晰透镜。然后,切分(singulate)基板以便分离LED结构。
在另一个实施例中,在LED和YAG磷光体板上模压的透镜包括红色磷光体以便产生更暖和的白色光。
在另一个实施例中,首先临时地将磷光体板安装到底板(backplate)上,并且在磷光体板上模压包含红色磷光体的透镜。从底板移除具有过模压透镜的板并且将其贴到提供能量的LED的顶部。然后,在每个LED结构上模压清晰透镜。
由于磷光体板是平坦的,因而当视角接近与LED/磷光体的表面垂直的角度时,色温变得更热(更蓝)。为了补偿这种颜色-角度非均匀性,限定包含红色磷光体的模具的形状,使得当视角变化时色温更加均匀。因此,模具的形状依赖于使用的特定LED和磷光体板。
在一个实施例中,用来通过过模压形成外透镜的固化硅树脂比通过过模压形成的任何内透镜都硬得多。当形成较软的内透镜时或者当专用LED产生热量时,该透镜不在专用LED上产生应力,而硬的外透镜则防止外部元件的影响并且保持清晰。
在另一个实施例中,例如为了静电放电(ESD)保护,多个LED或某个LED和另一个芯片由单个过模压透镜封装,其中该透镜的形状基于被封装的特定芯片。
在另一个实施例中,在LED上形成模压透镜,其中该透镜可以是清晰的或加载了磷光体。透镜的顶部具有平坦的部分。然后,将尺寸与LED近似相同的预制准直透镜(例如菲涅尔(Fresnel)透镜)贴在该过模压透镜的平坦部分上。这种小的准直光源作为蜂窝电话相机闪光灯是特别有用的。
在另一个实施例中,将软硅树脂凝胶用作LED和基板之间的底层填料以便填充任何空隙(void)。该底层填料可选地可以涂敷LED的侧面。然后,利用硬透镜对得到的结构进行过模压。该底层填料有助于在工艺和操作期间支撑LED管芯,将热量耦合到基板,并且降低LED管芯与硬的外透镜之间的应力。
本文描述了透镜的许多其他实施例和应用。
图1为安装到支撑结构(例如基板)上的四个LED管芯以及用于在每个LED管芯周围形成透镜的模具的侧视图。
图2为插入到填充了液态透镜材料的模具中的压痕中的LED管芯的侧视图。
图3为在液体被固化从而得到封装了每个LED管芯的透镜之后从模具中移除的LED管芯的侧视图。
图4为基板或电路板上的LED管芯阵列的透视图,其中在每个LED管芯上形成模压透镜。
图5为安装到基板上的倒装芯片LED管芯的特写侧视图,所述基板又安装到电路板上,并且其中在LED管芯上形成模压透镜。
图6为安装到基板上的非倒装芯片LED管芯的特写侧视图,所述基板又安装到电路板上,其中导线将LED管芯上的n和p金属电连接到电路板上的引线,并且其中在LED管芯上形成模压透镜。
图7-11为其上形成了不同透镜的LED管芯的截面图。
图12为使用本发明技术模压到LED管芯上的侧发射透镜的截面图。
图13为使用本发明技术模压到LED管芯上的准直透镜的截面图。
图14为贴在使用本发明技术模压到LED管芯上的朗伯(lambertian)透镜上的预制侧发射透镜的截面图。
图15为使用图14的LED和侧发射透镜的用于液晶显示器或其他类型显示器的背光源的截面图。
图16为具有相机的蜂窝电话的透视图,所述相机使用具有模压透镜的LED作为闪光灯。
图17和图18为两种类型的模压透镜的截面图。所示的所有透镜都关于中心轴对称,但是本发明同样可以应用到非对称透镜。
图19-22示出了用于获得希望的发射模式的外壳透镜或内透镜上的表面特征。
图23示出了高圆顶透镜用于准直发射模式。
图24和图25示出了硬的外透镜和软的内透镜用于限制线焊上的应力。
图26-28示出了各种类型的内或中间透镜上形成的外透镜用于侧发射模式。
图29示出了另一种侧发射模压透镜。
图30示出了模压壳的使用,每个模压壳包含不同的磷光体。
图31示出了在支撑衬底上形成模具部分以便制成模压透镜。
图32示出了在透镜的一部分上沉积金属反射器以便实现希望的发射模式。
图33为在背光源中使用具有侧发射透镜的LED的液晶显示器的侧视图。
图34为使用具有准直透镜的LED作为RGB光源的背投影电视的侧视图。
图35示出了现有技术LED发射模式(朗伯型)以及它们在屏幕上的重叠亮度分布。
图36示出了使用本发明的透镜的LED的宽角度发射模式以及它们在屏幕上的重叠亮度分布。
图37更详细地示出了图36中的LED的发射模式。
图38示出了依照本发明一个实施例的宽发射透镜和LED的截面图。
图39示出了图38的透镜的光强-角度关系的曲线图。
图40为依照本发明另一个实施例的宽发射透镜和LED的截面图。
图41A-41E示出了过模压磷光体晶片,然后切割模压磷光体晶片并且将单独的过模压板附接到LED管芯的步骤。
图42A-42E示出了过模压磷光体板并且将过模压板附接到LED管芯的步骤。
图43A-43D示出了利用磷光体板过模压LED的步骤,其中透镜材料包含红色磷光体以便产生暖白色光。
图44A-44C示出了具有平坦磷光体层的LED,其中模具被定制形状以形成补偿颜色-角度关系中的非均匀性的磷光体加载透镜。
图45A和图45B示出没有平坦磷光体层的LED,其中模具被定制形状以形成改善颜色-角度关系的均匀性的磷光体加载透镜。
图46A-46D示出了在LED管芯和另一种类型的半导体芯片(例如瞬态电压抑制器)上模压透镜。
图47A-47C示出了在不同颜色的多个LED上模压单个透镜。
图48A-48C示出了在LED上模压透镜并且然后将准直透镜贴在过模压透镜的平坦部分上。
图49A和图49B示出了使用硅树脂凝胶底层填料填充LED管芯下面空隙,其中LED然后由硬的外透镜封装。
不同附图中利用相同的附图标记标出的元件可以是相同或等价的。
作为初步的事情,在生长衬底上形成常规的LED。在使用的实例中,LED为基于GaN的LED,例如AlInGaN LED,其用于产生蓝色或UV光。典型地,使用常规的技术在蓝宝石生长衬底上生长相对较厚的n型GaN层。该相对较厚的GaN层典型地包括低温成核层以及一个或多个附加层以便为n型包覆层和有源层提供低缺陷晶格结构。然后,在厚的n型层上形成一个或多个n型包覆层,接着是有源层、一个或多个p型包覆层以及p型接触层(用于金属化)。
各种不同的技术被用来获得对n型层的电访问。在倒装芯片实例中,蚀刻掉p型层和有源层的若干部分以暴露n层以便金属化。通过这种方式,p触点和n触点处于芯片的相同侧并且可以直接电连接到封装(或基板)接触垫。来自n金属触点的电流起初通过n层横向传播。形成对照的是,在竖直注射(非倒装芯片)LED中,在芯片的一侧形成n触点并且在芯片的另一侧形成p触点。到p触点或n触点之一的电接触典型地利用导线或金属桥来形成,并且另一个触点直接键合到封装(或基板)接触垫。为了简单起见,在图1-3的实例中使用了倒装芯片LED。
美国专利No.6649440和No.6274399中描述了形成LED的实例,这两个专利都转让给了飞利浦Lumileds照明公司并且通过引用合并于此。
可选地,将导电衬底键合到LED层(典型地键合到p层),并且移除所述蓝宝石衬底。可以将一个或多个LED管芯键合到基板上的金属焊盘,其中导电衬底直接键合到金属焊盘,其将参照图5和图6进行更详细的描述。可以将一个或多个基板的电极键合到印刷电路板,该印刷电路板包括用于连接到其他LED或连接到电源的金属引线。该电路板可以串联和/或并联地互连各种不同的LED。
形成的特定LED以及它们是否安装到基板上对于理解本发明的目的并不重要。
图1为安装到支撑结构12上的四个LED管芯10的侧视图。该支撑结构可以是基板(例如具有金属引线的陶瓷或硅)、金属热沉、印刷电路板或者任何其他结构。在这个实例中,支撑结构12是具有金属焊盘/引线的陶瓷基板。
模具14具有与每个LED管芯10上的透镜的希望的形状相应的压痕16。模具14优选地由金属制成。具有模具14的大体形状的非常薄的不粘薄膜18被放置或形成在模具14上。薄膜18具有防止硅树脂粘结到金属上的公知的常规材料。
如果透镜材料不粘结到模具上,那么就不需要薄膜18。这可以通过使用不粘模具涂层、使用不粘模具材料或者使用导致不粘界面的模具工艺来实现。这样的工艺可能涉及选择特定的工艺温度以获得最小的粘性。通过不使用薄膜18,可以形成更复杂的透镜。
在图2中,模具压痕16已经填充了可热固化的液态透镜材料20。该透镜材料20可以是任何适当的光学透明材料,例如硅树脂、环氧树脂或者混合的硅树脂/环氧树脂。混合物可以用来实现匹配的热膨胀系数(CTE)。硅树脂和环氧树脂具有足够高的折射率(大于1.4),以便大大地改善来自AlInGaN或AlInGaP LED的光提取以及充当透镜。一种类型的硅树脂具有折射率1.76。
真空密封在支撑结构12和模具14的外围之间形成,并且将这两个工件彼此挤压,使得每个LED管芯10插入到液态透镜材料20中并且透镜材料20被压缩。
接着,将模具加热到大约150摄氏度(或者其他适当的温度)达一定时间,以便使透镜材料20硬化。
然后,将支撑结构12与模具14分离。薄膜18使得得到的硬化透镜容易与模具14脱离。然后,移除薄膜18。
在另一个实施例中,可以首先利用诸如粘结剂中的磷光体粒子或硅树脂之类的材料覆盖图1中的LED管芯10。利用另一种材料填充模具压痕16。接着,当将管芯置于模具中时,模具材料在覆盖材料上被定形。
图3示出了得到的在每个LED管芯10上具有模压透镜22的结构。在一个实施例中,所述模压透镜的直径介于1mm与5mm之间。透镜22可以具有任何尺寸或形状。
图4为得到的结构的透视图,其中支撑结构12支撑LED管芯阵列,每个LED管芯具有模压透镜22。使用的模具将具有相应的压痕阵列。如果支撑结构12是陶瓷或硅基板,那么可以通过锯切或折断基板12以形成单独的LED管芯来分离每个LED(连同其底下的基板部分)。可替换地,可以分离/切割支撑结构12以支撑LED子组,或者可以不分离/切割地使用支撑结构12。
透镜22不仅改善了来自LED管芯的光提取并且折射该光以形成希望的发射模式,而且该透镜也封装了LED管芯以便保护该管芯不受污染、增加了机械强度并且保护了任何线焊。
图5为由任何适当材料(例如陶瓷或硅)制成的基板24上的单个倒装芯片LED管芯的一个实施例的简化特写视图。在一个实施例中,基板24充当图1-4中的支撑结构12,并且图5的管芯/基板通过锯切与图4的结构分离。图5的LED管芯10具有底部p接触层26、p金属触点27、p型层28、发光有源层30、n型层32以及与n型层32接触的n金属触点31。基板24上的金属焊盘直接金属键合到触点27和31。通过基板24的通孔终止于基板24的底面上的金属焊盘,其键合到电路板45上的金属引线40和44。金属引线40和44连接到其他的LED或者连接到电源。电路板45可以是具有覆盖在绝缘层上的金属引线40和44的金属板(例如铝)。使用图1-3的技术制成的模压透镜22封装了LED管芯10。
图5中的LED管芯10也可以是非倒装芯片管芯,具有将顶部n层32连接到基板24上的金属焊盘的导线。透镜22可以封装该导线。
在一个实施例中,电路板45本身可以是图1-3的支撑结构12。图6中示出了这个实施例。图6为非倒装芯片LED管芯10的简化特写视图,该LDE管芯具有通过导线38连接到电路板45上的金属引线40的顶部n金属触点34。LED管芯10安装在基板36上,该基板在图6的实例中为金属厚片。导线42将p层26/28电连接到电路板45上的金属引线44。透镜22被示为完全封装了导线和基板36;然而,在其他的实施例中,不必封装整个基板或整个导线。
常用的现有技术的封装方法是旋涂保护涂层。然而,该封装工艺不适合用于将磷光体涂层添加到LED管芯,因为LED管芯上的密封材料的厚度不均匀。此外,这样的封装方法并不形成透镜。用于在LED管芯上提供磷光体的常用技术是利用硅树脂/磷光体组分填充LED管芯周围的反射杯。然而,该技术形成具有变化的厚度的磷光体层并且不制成适当的透镜。如果希望得到透镜,那么附加的工艺仍然必须产生塑料模压透镜并且将它贴在LED管芯上。
图7-11示出了可以利用上述技术制成的各种不同的透镜。
图7示出了已经通过使用任何适当的方法涂敷了磷光体60的LED管芯10。一种这样的方法是美国专利No.6576488中描述的电泳,该专利转让给了飞利浦Lumileds照明公司并且通过引用合并于此。适当的磷光体是公知的。透镜22通过使用上述技术而制成。磷光体60通过LED发射(例如蓝色或UV光)而被提供能量,并且发射不同波长(例如绿色、黄色或红色)的光。磷光体发射单独地或者与LED发射一起可以产生白色光。
利用磷光体涂敷LED的工艺是耗时的。为了消除利用磷光体涂敷LED管芯的工艺,可以将磷光体粉末与液态硅树脂混合以便嵌入到透镜62中,如图8所示。
如图9所示,为了在LED管芯上提供厚度被仔细控制的磷光体材料,通过使用上述技术制成内透镜64,并且使用单独的模压步骤(通过使用具有更深和更宽压痕的模具)直接在内透镜64上制成任意厚度的外磷光体/硅树脂壳66。
图10示出了可以通过使用另一模具在磷光体/硅树脂壳66上制成以便进一步对光束定形的外透镜68。
图11示出了分别具有红色、绿色和蓝色发射磷光体的壳70、72和74,其覆盖在清晰硅树脂壳76、78和80上。在这种情况下,LED管芯10发射UV光,并且红色、绿色和蓝色发射的组合产生白色光。所有的壳都利用上述方法来产生。
可以通过使用上述模压技术来制成许多其他形状的透镜。图12为LED 10、基板24和模压侧发射透镜84的截面图。在一个实施例中,透镜84由诸如硅树脂之类的非常柔软的材料制成,其在从模具中移除时弯曲。当透镜不是简单的形状时,通常将不使用脱模薄膜18(图1)。
图13为LED 10、基板24和模压准直透镜86的截面图。透镜86可以通过使用可变形模具或者通过使用软透镜材料来制造,所述软透镜材料在从模具中拉拔时压缩并且在脱离模具之后伸展到其模压形状。
图14示出了可以如何将预制透镜88贴在模压朗伯透镜22上。在图14的实例中,以上面所述方式制成透镜22。透镜22用来封装LED 10并且防止其受污染。然后,使用UV可固化粘合剂或者机械夹具将预制侧发射透镜88固定在透镜22上。该透镜形成技术相对于常规的技术具有优势。在常规的技术中,预制透镜(例如侧发射透镜)通过粘合剂固定在LED管芯上,并且通过注射硅树脂来填充任何空隙。该常规的工艺难以预制,这首先归因于要为透镜布置和间隙填充步骤仔细地定位分开的管芯/基板。使用图14的本发明的技术,可以通过在每个LED上制成模压透镜来同时封装大的LED阵列(图4)。然后,可以在这些LED仍然处于该阵列(图4)中的同时或者在其分开之后将预制透镜88贴在每个模压透镜22上。
此外,可以使得模压透镜非常小(例如1-2mm直径),这与常规的透镜不同。因此,可以制成非常小的完全封装的LED。可以使得这样的LED具有非常低的轮廓,这对于某些应用来说是有利的。
图14还示出了其上安装了基板24的电路板45。该电路板45可以让LED阵列/基板24安装于其上。
图15为液晶显示器(LCD)或使用背光源的其他显示器的背光源的截面图。通常的用途是电视、监视器、蜂窝电话等等。所述LED可以是红色、绿色和蓝色以便产生白色光。这些LED形成二维阵列。在所示的实例中,每个LED结构是图14中所示的LED结构,但是也可以使用任何合适的透镜。优选地,利用白色反射式漫射材料涂敷背光源箱的底部和侧壁90。在每个LED的正上方是白色漫射点92,其防止每个LED正上方的背光发射光斑。点92由透明或漫射PMMA片94支撑。侧发射透镜88发射的光在背光源的下部混合,然后在离开上面的漫射器96之前进一步在背光源的上部混合。可以将线性LED阵列安装到窄的电路板45上。
图16示出了用作相机中的闪光灯的具有模压透镜22的LED 10。图16中的相机是蜂窝电话98的一部分。蜂窝电话98包括彩色屏幕100(其可以具有使用这里描述的LED的背光源)和小键盘102。
如参照图10所讨论的,可以在内壳上制成外透镜以便进一步对光束定形。可以使用不同的壳材料,这取决于不同壳的要求。图17-30示出了可以结合过模压工艺使用的各种不同的透镜和材料的实例。
图17和图18示出了用于内壳的两种类型的模压透镜,其通过使用上面描述的模压技术而制成。可以将许多LED 10安装到相同的支撑结构12上。如前所述,支撑结构12可以是具有金属迹线(trace)和接触垫的陶瓷或硅基板。可以将任意数量的LED安装到相同的支撑结构12上,并且典型地将以相同的方式处理相同支撑结构12上的所有LED,但这不是必需的。例如,如果支撑结构大并且规定了整个LED阵列的光模式,那么每个LED透镜可以不同,以便提供规定的总的光模式。
可以注射底层填料以填充LED管芯10的底部与支撑结构12之间的任何间隙,以便首先防止LED下面的任何空气间隙并且改善热传导。
上面已经参照图3-6描述了图17,其中对于朗伯辐射模式而言,内模压透镜22通常是半球形的。图18中的内模压透镜106通常为具有圆整边缘的矩形。取决于外透镜提供的辐射模式,内模压透镜22或106之一可能更合适。其他形状的内模压透镜也可能是合适的。每个透镜的顶视图一般都是圆形的。
图19示出了图18的结构,其中透镜外表面具有折射光以实现希望的辐射模式的图案。可以在内模压透镜中(通过模具本身)直接形成外表面图案,或者可以在过模压到内模压透镜上或通过粘合剂(例如硅树脂、环氧树脂等等)贴到内模压透镜上的外透镜中形成外表面图案。图案108是衍射光栅,而图案110使用双步长(binary step)折射光。在这些实例中,所述图案形成具有图20所示的辐射模式的一般侧发射透镜。在图20中,峰值强度出现在50-80度内,并且远大于0度处的强度。
对于内透镜的要求通常与对于外透镜的要求不同。例如,内透镜应当很好地粘附到支撑结构上,不随时间而呈黄色或变得更不透明,具有高折射率(大于1.4),不破坏或将任何导线压在LED上,耐受高的LED温度并且具有一致的热系数。内透镜应当是非刚性的(例如硅树脂)以便不在LED或任何导线上提供应力。相对照而言,外透镜材料通常只需要能够以希望的图案来图案化并且粘附到内透镜上。可以对外透镜过模压或者可以预制外透镜并且将其粘贴到内透镜上。用于外透镜的材料可以是可UV固化的,而用于内透镜的材料可以是热固化的。热固化比UV固化花费更长的时间。
一般而言,内透镜材料的硬度范围是Shore 005-90,而外壳的硬度范围是Shore A 30或更大。
图21示出了在透镜外表面上形成的用于产生与图20的模式类似的一般侧发射光模式的菲涅尔透镜图案112。外表面可以是内模压透镜的外表面或者外壳的外表面,如参照图19所示。这适用于这里所描述的所有图案。
图22示出了外透镜表面上产生准直光模式或另一光模式的金子塔114或锥形116图案。
图23示出了用于产生准直模式的高圆顶外透镜118。
图19和图21-23的表面图案可以(例如通过改变表面角度)被配置成产生任何光模式。可以形成全息结构、TIR和其他模式。准直光模式典型地用于背投影电视,而侧发射光模式典型地用于背光照明LCD屏幕。
图24示出了使用诸如硅树脂凝胶之类的软材料作为内模压透镜124以便不对键合到LED 10上的导线126产生应力。凝胶典型地被UV固化。模压或预制外透镜128并且利用粘合剂进行粘贴。外透镜128典型地将硬得多以便经久耐用、抗粒子等等。外透镜128可以是硅树脂、环氧硅树脂(epoxy-silicone)、环氧树脂、硅树脂弹性体、硬橡胶、其他聚合物或其他材料。外透镜可以被UV固化或热固化。
图25类似于图24,但是具有不同形状的内模压透镜129(类似于图18)以用于不同的发射模式或较低的轮廓。透镜129可以是软硅树脂凝胶。外透镜130将进一步对发射模式定形并且保护软内透镜129。
所有附图中的LED都可以是倒装芯片或线焊类型。
图26示出了一种LED结构,其具有拥有内透镜所需特性的软内模压透镜132、充当界面层并用于结构稳定性的硬中间壳134以及用于产生侧发射光模式的外透镜136。外透镜136可以是软的,以便有助于模压工艺。可替换地,可以预制外透镜136并且将其粘贴到中间壳134上。中间壳134的使用使得外透镜材料的选择基本上与内透镜材料无关。
图27示出了如何可以在内透镜132或中间壳134的任何部分上制成外透镜138。
图28示出了直接在内透镜144材料上制成外透镜142。
图29示出了在内透镜132上模压的另一种形状的侧发射透镜145。可以在没有任何内透镜的情况下直接在LED管芯10上模压透镜145。
图30示出了一种LED,其中每个壳146、147和148包含不同的磷光体材料,例如红色发射磷光体、绿色发射磷光体和蓝色发射磷光体。LED管芯10可以发射UV。磷光体粒子之间的间隙允许UV穿过内壳以便向外壳中的磷光体提供能量。可替换地,仅仅使用红色和绿色磷光体壳,并且LED管芯10发射蓝色光。红色、绿色和蓝色光的组合产生白色光。此外,可以调节这些壳的厚度、磷光体粒子的密度以及磷光体颜色的顺序以获得希望的光。可以使用任何形状的透镜。
图31示出了在支撑结构12本身上使用模具模式149。通过在支撑结构12上模压该模式,使用与图1中所示的方法类似的方法,或者使用金属化工艺,或者使用另一种合适的工艺来制成高指数材料(例如聚合物)或反射材料(例如铝或银)。然后,将模具模式149用作用于制成透镜150的另一材料的模具。在一个实施例中,透镜150材料是沉积在支撑结构12上制成的模具中然后固化的液体(例如硅树脂)。然后,可以对表面平面化。得到的透镜通过反射/折射撞击到壁(比如反射杯)上的光而准直该光。
图32示出了在其侧面喷溅了金属151以便反射LED 10发射的光的模压透镜22。反射的光将由LED 10散射并且最终通过顶部开口发射。金属151可以是任何反射材料,比如铝或银。该金属可以改为喷溅到透镜22的顶部上以形成侧发射模式。透镜22可以被制成任何形状以便形成希望的光发射模式。
图33为液晶显示器(LCD)152的侧视图,该液晶显示器具有拥有可控RGB像素的LCD屏幕154、漫射器156以及背光源158,其用于混合来自红色、绿色和蓝色LED 160的光以便产生白色光。背光源158为漫反射箱。LED 160具有使用上述任何技术制成的侧发射透镜。
图34为背投影电视162的侧视图,其具有用于增亮规定的视角内的图像的前透镜164、一组红色、绿色和蓝色LED 166、用于调制和聚焦RGB光以便产生彩色电视图像的调制器/光学器件170以及反射器172。调制器可以是可控反射镜阵列、LCD面板或者任何其他合适的器件。LED 166具有使用上述任何技术制成的准直透镜。
如上所述,可以设计主透镜或辅助透镜以形成侧发射模式。这种侧发射模式在预期混合来自多个LED的光时,例如在来自多个LED的光用于产生用于LED面板的均匀背光或者用于装饰照明或者用于另一用途时是特别有用的。
如图35所示,没有安装到背板(backplane)182上的透镜或者仅有安装到背板182上的半球形透镜的LED 180典型地将以朗伯模式183发射光。LED 180阵列照射漫射屏184的背部。屏幕184可以是图33的LCD背光源中的漫射器156。图中还示出了每个LED的漫射亮度分布185及其全宽半高(FWHM)。除非这些LED彼此放置得足够靠近,否则屏幕184前面的总的光输出将具有可察觉的亮斑。因此,这种背光源需要相对较高密度的LED,从而导致昂贵的背光源。
申请人已经发明了图36-38中所示的宽发射透镜,其在背光源中特别有用。在图36中,示出具有宽发射透镜的LED 188安装到背板190上。每个LED管芯的峰值光发射(Ipeak)出现在偏离中心轴(法线)的50-80度内,如图37所示。70-80度之间的范围是优选的。透镜被设计成使得沿着中心轴的光发射(I0)为峰值发射的5%-33%。相应地,每个LED的亮度分布192与图35中的亮度分布185相比更为展开。因此,图36的背光源中的LED 188间距可以比图35中的LED 180间距更大,同时从漫射屏184实现相同的光输出均匀性。这导致不那么昂贵的背光源。
所述亮度分布应当没有漏斗状透镜在中心尖端处通常出现的剧烈转变。
中心轴强度与58-80度峰值强度的最佳比值将取决于应用,例如实现背光源的规定的亮度所需的LED间距。峰值强度至少三倍于沿中心轴的强度并且在图37的实施例中,该比值介于4-8之间。
图38是具有上述特性的宽发射透镜的一个实施例的截面图。如参照图1-6所述,将LED管芯194安装到由陶瓷、硅或其他材料制成的衬底或基板196上,并且如参照图1-6所述在LED管芯194上模压第一透镜198。可以将多个管芯安装到单个大基板上。透镜198可以由任何适当的材料(例如硅树脂)制成。
接着,分离基板196,并且然后通过回流焊接技术或其他适当的技术将其安装到背板190(PCB)上。
将辅助透镜202预制成具有希望的宽发射特性。该辅助透镜可以是注射成型或机械加工塑料或者其他材料。这样的材料包括COC、COP、PMMA、环氧树脂、硅树脂、玻璃或者任何其他适当的材料。然后,将辅助透镜202安装成覆盖在第一透镜198之上并且接触背板190以便支撑。空气间隙204(或其他低折射率材料间隙)形成将光弯向侧面的内折射界面。辅助透镜202的外表面与空气的界面进一步弯曲光以便实现50-80度内的峰值强度。辅助透镜202可以直接接触第一透镜198;然而,辅助透镜202的形状将必须被改变以便实现相同的宽发射模式。
在另一个实施例中,辅助透镜202接触基板196并由基板196支撑而不是接触背板190并由背板190支撑。
可以利用诸如环氧树脂之类的粘合剂将辅助透镜202固定到背板或基板或者可以利用扣环(snap-tab)连接固定辅助透镜202。
与参考背板固定辅助透镜202相比,通过参考基板来固定辅助透镜202实现了稍微更好的控制,因为背板上LED和第一透镜198的高度可以随着安装参数而稍微变化。
具有非球形圆顶内部空气隙的非球形辅助透镜202是易于模压的简单设计。透镜202在背板190附近被底切以便在底切表面处向上反射光,使得光不向下朝背板190发射。这避免了光环并且增大了背光源的光输出。
图39示出了图38的LED的光强-角度关系。峰值强度大约72度,并且沿中心轴的强度大约为峰值强度的10%。
在另一个实施例中,辅助透镜202的表面包含如参照图19、图21和图22所描述的微型结构,其进一步折射光以实现希望的发射模式。
图40为具有透镜206的LED 194的截面图,该透镜206具有全内反射(TIR)部分208。该TIR部分208为漏斗状。该TIR部分208使得大多数向上发射的光发生内反射并且通过侧面部分210发射。这种设计可用来降低沿中心轴的强度,同时仍然提供50-80度内的峰值强度以及沿中心轴的在峰值强度的5-33%之间的强度。在图33的背光源中,可以采用这些透镜实施例中的任何一个。
图38和图40以及在其他附图中的辅助透镜也可以用在没有模压的第一透镜的LED管芯上。然而,优选的是与模压的第一透镜一起使用以便保护LED。辅助透镜的直径典型地将在4-10mm的范围之内。
图41A-41E示出了过模压陶瓷磷光体板并且将过模压板附接到LED管芯的步骤。可以将磷光体板制成具有精确的特性,因为可以仔细地控制其厚度(例如50-300微米)以及磷光体密度。当蓝色光(例如440nm-460nm)向磷光体提供能量时,磷光体发射更长波长的光。当磷光体板贴在蓝色LED上时,一定百分比的蓝色光穿过该板,并且该蓝色光与磷光体产生的光混合。
一种制成陶瓷磷光体片的方式是使用加热和加压烧结磷光体粉末的颗粒。穿过所述板的蓝色LED光的百分比取决于磷光体的密度和板的厚度,其可以精确地加以控制。另一种制成磷光体薄片的方式是在薄片内制成磷光体浆并且然后烘干所述浆。Gerd Mueller等人的题为“Luminescent Ceramic for a Light Emitting Diode”的美国专利申请20050269582中描述了制成这样的陶瓷磷光体板,该文献通过引用合并于此。
与蓝色LED一起使用的流行的磷光体是YAG:Ce磷光体(掺杂了大约2%的铈的钇铝石榴石),其可在商业上获得。
图41A示出了使用任何适当的粘合剂临时安装到底板212上的陶瓷磷光体板晶片211,所述粘合剂可以借助于力或借助于溶剂而容易地脱离。底板212可以具有防止在后来的步骤中粘结固化的硅树脂的特氟纶(Teflon)涂层。所述晶片典型地为矩形,但是可以为任意形状。该晶片将在后来被锯切以便形成用于数百LED的磷光体板。在这个实例中,晶片211为50-300微米厚的YAG磷光体,其在利用来自蓝色LED的蓝色光而被提供能量时发射绿黄色光。得到的白色光通常被认为是刺眼的,因为它具有高的色温(例如4000-6000K)。如下面所描述的,红色磷光体将用来降低色温,这在常规上被称为形成更暖和的白色光。
在图41B中,向模具214中的压痕213填充包含红色磷光体粒子216的液态硅树脂215。常规的不粘脱模薄膜(未示出)保形地涂敷模具并且之后允许不用太大拉力地移除模压的硅树脂。任何类型的自动液体分配器都可以用来分配硅树脂/磷光体混合物。红色磷光体的实例包括公知的BaSSN、CaS和e-CaS。红色磷光体粒子的最佳密度以及压痕213的形状由红色磷光体提供的希望的色温降低决定。如果希望达到特定的色温的话,也可以在硅树脂215中使用其他的磷光体粒子,例如YAG、绿色、橙色、蓝色等等。在一个实施例中,所使用的硅树脂215使得它在固化之后相对较软,从而在操作LED结构期间在LED以及得到的磷光体板上存在很少的应力。在另一个实施例中,硅树脂215与后来用于制成外透镜的硅树脂相同或等效。
接着,将底板212和模具214放置在一起,以便将磷光体晶片211浸没到硅树脂215中。将底板212和模具214夹在一起,在结构的周围形成真空并且硅树脂215被压缩。在这个过模压步骤期间,排空了液态硅树脂中的任何气泡。然后,通过加热或UV固化硅树脂215。之后,借助于脱模薄膜将底板212和模具214分离。
然后,锯切得到的模压磷光体晶片以便形成单独的模压磷光体板,其中每个板近似于LED的尺寸。所述磷光体加载硅树脂在磷光体板上形成透镜。在一个实施例中,在锯切工艺期间将模压磷光体晶片保留在底板212上,并且锯片仅切穿晶片。这使得所述板更易于由自动拾放机拾放。在另一个实施例中,从底板212移除模压晶片,然后进行锯切。
在图41C中,自动拾放臂从底板212移除每个模压磷光体板218(具有磷光体加载硅树脂221的YAG板220)并且将模压磷光体板218粘结到安装在基板226(这个阶段的晶片)上的蓝色LED 224的顶面。基板226可以包含与图4中所示阵列类似的二维阵列中的数百蓝色LED224。基板226典型地为陶瓷并且包含用于每个LED的金属迹线和电极以便连接到电源。磷光体板218与LED 224的粘结可以通过低熔点玻璃、硅树脂、环氧树脂、其他透明粘合剂或者加热和加压实现。
在将在后面详细说明的一个实施例中,模具压痕213的形状通过计算机建模来确定,以便补偿LED/板组合发射的光的色温-角度关系的非均匀性。
在图41D中,在LED 224和模压磷光体板218上模压清晰硅树脂透镜234以便封装整个结构。参照图1-4以及其他附图描述的工艺可以用来制成外透镜234。模压外透镜234改善了LED的光提取,实现了希望的光发射模式,并且防止了磷光体板218的分层。
在另一个实施例中,外透镜234比磷光体加载硅树脂221更硬。这导致用于保护的机械强度大的外透镜以及抗灰尘粒子的平滑的外表面,同时降低LED和互连线路上的应力。
然后,切割基板226以切分LED结构。上例中的LED发射例如3000-4000K内的暖白色光。任何其他的磷光体都可以用于所述磷光体板和硅树脂中的磷光体。
可以通过在测试之后依照模压磷光体板218的颜色特性划分(bin)这些模压磷光体板来进一步控制色温。接着,测试基板226上的LED224并且依照其颜色特性分类这些LED。然后,为特定的LED选择划分的模压磷光体板218以便实现目标色温。
图41E示出了贴到LED 224上的过模压磷光体板218的另一个实施例。在图41E中,通过使用硅树脂或加热硅树脂侧向下地将模压磷光体板218贴到LED 224上。
除了磷光体在模压之前被切割之外,图42A-42E类似于图41A-41E。首先,锯切或折断磷光体片以便形成与提供能量的LED尺寸近似相同的磷光体板。
图42A示出了使用任何适当的粘合剂临时安装到底板222上的陶瓷磷光体板228的二维阵列,所述粘合剂可以借助于力或借助于溶剂而容易地脱离。底板222和磷光体板特性可以与图41A-41E中的相同。
在图42B中,向模具230中的压痕229填充包含红色磷光体粒子232的液态硅树脂231。常规的不粘脱模薄膜(未示出)保形地涂敷模具并且之后允许不用太大拉力地移除模压的硅树脂。磷光体、硅树脂和模具的特性与上面描述的那些类似。
接着,将底板222和模具230放置在一起,以便将所述板228浸没到硅树脂231中。将底板222和模具230夹在一起,在结构的周围形成真空并且硅树脂231被压缩。然后,通过加热或UV固化硅树脂231。之后,借助于脱模薄膜将底板222和模具230分离。
在图42C中,自动拾放臂从底板222移除每个模压板234并且将模压板234粘结到安装在基板晶片238上的蓝色LED 236的顶面。基板238可以包含与图4中所示阵列类似的二维阵列中的数百蓝色LED 236。基板238典型地为陶瓷并且包含用于每个LED的金属迹线和电极以便连接到电源。磷光体板228与LED 236的粘结可以通过低熔点玻璃、硅树脂、环氧树脂、其他透明粘合剂或者加热和加压实现。
在一个将在后面详细说明的实施例中,模具压痕229的形状通过计算机建模来确定,以便补偿LED/板组合发射的光的色温-角度关系的非均匀性。
在图42D中,在LED 236和模压板234上模压清晰硅树脂透镜244以便封装整个结构。参照图1-4以及其他附图描述的工艺可以用来制成外透镜244。
然后,切割基板238以切分LED结构。上例中的LED发射例如3000-4000K内的暖白色光。任何其他的磷光体都可以用于所述磷光体板和硅树脂中的磷光体。划分和匹配的优点参照图41A-41E进行了描述。
图42E示出了贴到LED管芯上的过模压磷光体板234的另一个实施例。在图42E中,通过使用硅树脂或加热透镜侧向下地将模压板234贴到LED 236上。为了简化拾放过程,底板222(图42B)可以从模压板脱离,同时模压板仍然处于模具230中。然后,拾放臂附接到暴露的板,从模具230中移除模压板并且将其放置在LED 236上。
在图41A-E和图42A-E中,第一模压步骤仅仅覆盖磷光体板。图43A-43D示出了其中第一模压步骤也封装LED的工艺。
在图43A中,将磷光体板228(例如YAG)贴到基板238上的LED管芯236上。
在图43B中,向模具250中的压痕248填充包含红色磷光体粒子254的液态硅树脂252。如上所述,也可以使用其他的磷光体。将基板238和模具250放置在一起,并且加热硅树脂252以便固化它。出于上面陈述的原因,得到的硅树脂可以相对较软,或者可以与用来制成外透镜的硅树脂相同或相似。
在图43C中,将基板238和模具250分离,使得红色磷光体透镜258封装每个LED和磷光体板,从而产生暖白色光。
在图43D中,使用本文描述的模压工艺在每个LED上模压硬的硅树脂透镜260以便封装和保护整个LED结构。像在所有实施例中一样,外透镜260可以由模具定形以便产生实际上任意的光发射模式,例如朗伯模式、侧发射模式、准直模式等等。
图44A-44C示出了模压工艺用来产生更均匀的色温-视角关系。
在图44A中,YAG磷光体262粉末保形地涂敷LED 236,得到平坦的磷光体表面。一种利用磷光体保形地涂敷LED的方式是电泳沉积。Dave Collins等人的题为“Using Electrophoresis to Produce aConformally Coated Phosphor-Converted Light Emitting Semiconductor”的美国专利no.6576488中描述了电泳沉积,该文献通过引用合并于此。当磷光体为例如图43A中所示的板时,图44B和图44C的工艺同样适用。图44B和图44C的工艺同样适用其中希望色温-角度关系更均匀的任何LED结构。
图44A中示出的色温曲线图表明,0%视角下磷光体涂敷LED的色温比其他视角下的色温冷(更高的CCT或更蓝)。这是因为当沿表面的法向行进时,蓝色光行进最少的距离通过磷光体。结果,当从不同的角度观看LED时,白色光改变颜色。尽管所示的色温范围从3000K到3500K,这些温度可以更高(例如高达6000K)或者更低,这取决于涂层的特定磷光体和厚度。
精确地制成在厚度方面发生变化,使得蓝色光在所有角度下行进相同的距离通过磷光体的磷光体涂层是非常困难的。
为了补偿这种颜色-角度关系的非均匀性,使用了包含基本上均匀分布的补偿磷光体的模压透镜。在一个实例中,将红色磷光体分散在与图43B中的模具250类似的模具中的液态硅树脂中。模具的尺寸基于要校正的LED的实际色温-角度特性通过计算机建模来确定。通常,模具将是凸的,其中精确的宽度、深度、曲率和磷光体密度通过计算机建模确定。具有磷光体涂层的LED置于液态硅树脂中,并且固化该硅树脂。然后,将具有模压透镜的LED从模具中移除。
图44B示出了包含红色磷光体的补偿模压透镜264的一个实例。可以使用其他的补偿磷光体,这取决于希望的色温。由色温-角度关系的曲线图可知,通过来自红色磷光体的添加的红色分量降低了平均温度,并且温差(temperature delta)从(图44A的)500K降低到250K,从而得到更均匀的色温-角度关系。透镜264优选地相对较软以便降低LED上的应力。
在图44C中,使用前述技术在颜色补偿透镜264上模压硬的硅树脂透镜268。
图45A示出了没有平坦的磷光体层的LED 236,其中模具被定制形状以形成改善色温-角度关系的均匀性的磷光体加载透镜272。计算机建模用来基于LED的颜色-角度关系确定模具的最佳形状和磷光体密度。通常,透镜272的形状使得蓝色光在大范围的角度上穿过透镜的近似相同的厚度。透镜的相对尺寸将比图45A中所示大得多。透镜272中的磷光体可以是YAG和红色或者任何其他磷光体的组合。透镜中的磷光体分布基本上是均匀的。多个重叠的模压透镜也可以用来实现希望的颜色特性。
然后,在更软的补偿透镜272上模压硬的外透镜276。该透镜276可以是清晰的或者包含磷光体。
在图45B中,内模压透镜272包含YAG磷光体,中间模压透镜277包含红色磷光体并且硬的外透镜276不包含磷光体。透镜272和277二者都可以被定形以便提供基本上均匀的色温-角度关系。也可以使用其他类型的磷光体和附加的磷光体加载透镜。在一些情况下,通过不将所有磷光体混合到单个透镜中来提供对于颜色和色温-角度关系的更好的控制。清晰的外透镜通常增大了光提取。
图46A-46D示出了在LED管芯和另一种类型的半导体芯片(例如瞬态电压抑制器(TVS)或光电检测器)上模压透镜。
图46A为基板280的一部分的顶视图,其示出连接到LED 282的电源引线之间的TVS芯片284和LED 282。基板280上的金属迹线未示出。在例如由于静电放电(ESD)而引起电压浪涌时,TVS芯片284中的电路将瞬态电压短接到地以便旁路LED 282。否则,可能损坏LED 282。TVS电路是公知的。据申请人所知,现有技术TVS电路没有利用用于LED的透镜的一部分来封装。图46A中所示的基板280是其上安装了许多对LED和TVS管芯的晶片的一部分。该基板晶片将在以后被锯切以便切分所述LED/TVS配对。
图46B为基板280的侧视图。与图43B和其他附图中所示类似的模具具有填充了包含磷光体颗粒的液态硅树脂的压痕。将所述基板晶片和模具放置在一起,使得每个LED/TVS配对处于单个压痕中的硅树脂内,并且接着对硅树脂固化。之后,将基板晶片从模具中分离,并且得到图46C的结构。模压磷光体透镜286封装了这两个芯片。使用的磷光体的类型、磷光体的密度以及透镜286的形状由希望的色温特性决定。在一个实施例中,透镜286中的磷光体是YAG和红色磷光体的混合物以便在由蓝色LED 282提供能量时产生暖白色光。
如图46D所示,与先前所示的工艺类似地进行第二过模压工艺以便在模压磷光体透镜286上制成清晰的硅树脂透镜288。像另一实施例一样,内透镜286优选地比外透镜288软。外透镜288被定形以便提供光的希望的折射,从而实现实际上任意的发射模式并且同样完整地封装所述芯片。外透镜288在TVS芯片284上的部分对LED的光发射模式具有很小的影响。在一个实际的实施例中,这两个芯片的厚度典型地相对于外透镜的高度比图46D中所示小得多。例如,LED 282的厚度可以是120微米(其生长衬底被移除),模压磷光体透镜286在LED上可以具有100微米的厚度并且外透镜288在模压磷光体透镜286上可以具有1000微米的厚度。
模压磷光体透镜286的足迹(footprint)不必像半球形外透镜的足迹那样被圆整。磷光体透镜286的足迹可以是直线式的以便刚好覆盖该LED和TVS配对。
像在所有实施例中一样,外透镜可以包含一种或多种磷光体类型以便实现任何色温,例如暖白色。
尽管可以简单地在内硅树脂透镜上模压外硅树脂透镜,但是已经发现,内透镜的中间等离子体处理增加了这两个透镜之间的粘性。等离子体处理稍微蚀刻和粗糙化了透镜。使内透镜经受200瓦的等离子体功率几分钟(例如2-15分钟)足以确保这两个硅树脂透镜之间的粘性大于外透镜到模具的脱模薄膜的粘性。等离子体功率可以近似为200-600瓦。等离子体气体可以是任何适当的惰性气体(例如氩),并且可以在能够产生等离子体的任何合适的腔室中进行该处理。图43C示出了可选的等离子体289步骤。该等离子体步骤可以在其中制成两个或更多过模压透镜的任何实施例中执行。已经证明,提供清晰的硅树脂透镜作为外透镜增大了光输出功率24%,这归因于其折射率低于磷光体加载硅树脂的折射率。
在图46A-46D中,LED可以是任意颜色,例如蓝色、青色、绿色等等,并且可以利用非LED芯片来过模压多个LED。
图47A-47C示出了在不同颜色的多个LED上模压单个透镜。图47A为包含红色LED 292、绿色LED 293和蓝色LED 294的基板290的一部分的顶视图。金属迹线未示出。该基板晶片包含许多这样的组,每个组根据RGB LED的相对亮度水平产生具有任何希望的色温的白色光。
布置、颜色以及每种颜色之比不受限制。例如,LED组也可以包括白色LED,或者该组可以单独地或者与一个或多个绿色和蓝色LED一起包括2-3个红色LED,或者该组可以是2个白色LED加琥珀色LED。
在图47B中,模具296具有填充了液态硅树脂298以便在基板晶片上的每组RGB LED上制成单个透镜的压痕297。基板290相对于模具296被夹住,并且硅树脂被固化。
在图47C中,于是将基板晶片和模具296分离,从而在LED组上制成模压透镜300。在一个实施例中,透镜300包含一个或多个磷光体。然后,切分基板晶片,或者整个基板晶片可以形成LED显示单元。任意数量和颜色的LED可以由单个过模压透镜封装。
图48A-48C示出了在LED上过模压透镜并且然后将准直透镜贴在过模压透镜的平坦部分上。
在图48A中,基板晶片310已经在其上安装了LED 312阵列。每个LED管芯的底部电极通过使用金属球314超声键合到基板上的金属接触垫。也可以使用其他键合技术。接着,将基板晶片310夹在模具上,其中每个LED处于先前填充了液态硅树脂的模具压痕中。这些压痕呈图48A中所示的模压硅树脂透镜316的形状。其后,固化硅树脂。然后,将基板晶片310从模具中分离。每个模压透镜316封装了LED并且具有平坦的顶部。
随后,通过硅树脂胶319、环氧树脂或者通过其他手段将预制菲涅尔透镜318贴在模压透镜316的平坦部分上。菲涅尔透镜318具有对光准直的非常精细的特征。为什么不能通过模具中的图案在模压透镜316中直接形成菲涅尔透镜的原因在于,脱模薄膜(其在模具上形成50微米的层)不能在模具中依这样的精细图案形成轮廓。如果模具由不粘物质制成并且不需要脱模层,那么可以在所述透镜中直接模压菲涅尔透镜。单独的菲涅尔透镜318可以通过冲压软化的塑料材料或者使用其他手段而制成。在一个实施例中,菲涅尔透镜318具有圆形的足迹。
模压透镜316的壁部分320包围每个菲涅尔透镜318并且与菲涅尔透镜318具有近似相同的高度。这个壁部分320具有成角度的侧面,其向上反射从菲涅尔透镜318侧面发射的任何光。此外,壁部分320保护菲涅尔透镜318不受撞击。向模压透镜提供壁部分是可选的,并且模压透镜可以是在顶部支撑另一透镜的任意形状。
然后,沿着锯线322锯切基板晶片310以便切分准直的光源。在一个实施例中,图48A-C的光源用作用于图16的蜂窝电话相机的微型闪光灯。可以使用其他类型的准直透镜。
模压透镜也可以包含磷光体,如图48B所示。在图48B中,LED发射蓝色光并且当模压透镜330时,不同类型的磷光体326、328分散到液态硅树脂中。在一个实施例中,这些磷光体提供至少红色和绿色成分给蓝色光以便产生白色光。在一个实施例中,这些磷光体包括用于暖白色光的红色磷光体和YAG磷光体。
图48C示出了其中利用磷光体334(例如YAG)保形地涂敷蓝色LED 312的实施例。所述涂敷可以通过使用电泳来完成。模压硅树脂透镜336包含红色磷光体338以便产生暖白色光。
图49A和图49B示出了使用硅树脂凝胶底层填料填充AlInGaNLED管芯下面的空隙,其中LED然后由硬的外透镜封装。在图49A中,将其生长衬底(例如蓝宝石)面向上方的LED 340安装到基板342上,使得LED 340上的金属触点344键合到基板342上的金属迹线346。这些金属迹线终止于基板342底部上的线焊盘或表面安装垫。然后,将诸如硅树脂凝胶之类的底层填料材料348注射到LED 340之下以便填充LED 340与基板342之间产生的空隙。然后,固化所述凝胶。该固化的凝胶保持相对较软。
然后,将受激准分子激光束施加到透明生长衬底上,其加热GaNLED表面并且在该表面处分离GaN以便产生镓和氮气。氮膨胀以使得蓝宝石衬底升离GaN LED,并且移除该蓝宝石衬底。在该工艺期间产生了巨大的向下压力,并且底层填料348在机械上支撑薄的LED层以防LED破损。底层填料348也有助于在操作LED期间将热从LED传导到基板。
然后,使用本文所描述的技术在LED上模压清晰或加载了磷光体的硬的硅树脂透镜350。底层填料348防止模具中的液态外透镜材料进入空隙。这降低了操作期间LED上的热应力,其否则可能导致LED升离基板。可以优化底层填料以便在不关心其光学特性的情况下实现其功能。
图49B示出了其中蓝宝石生长衬底354保留在LED层上的实施例。可以沿着LED 340和衬底354的侧面沉积底层填料356以便确保所有的空隙被填充并且当在操作期间LED被加热和冷却时降低LED/衬底与硬的外模压透镜358之间的压力。此外,如果底层填料不透明,那么沿着侧面的底层填料阻止侧发射,这在磷光体层位于衬底顶部上的情况下是有利的。像在所有实施例中一样,外透镜可以是加载了磷光体的。
在本文所描述的所有实施例中,可以采用底层填料硅树脂凝胶。此外,可以代替本文所描述的蓝色LED而使用发射UV光的LED,并且可以将蓝色磷光体分散到模压透镜中。
尽管已经显示和描述了本发明的特定实施例,但是对于本领域技术人员显然的是,可以在本发明的更广的方面不脱离本发明的情况下做出若干改变和修改,并且因此所附权利要求应当在其范围内包含落入本发明的真实精神和范围内的所有这样的改变和修改。
Claims (9)
1.一种用于制成发光二极管(LED)结构的工艺,包括:
在基板(238)上提供发射蓝色光的LED(236);
将平坦的预制磷光体板(228)贴到LED上,该预制磷光体板包含发射黄色光的YAG磷光体,其中来自该LED的通过该磷光体板泄漏的蓝色光与所述黄色光的组合产生白色光;
提供具有与中间透镜(258)相应的压痕(248)的模具(250);
利用包含磷光体(254)的液态透镜材料(252)填充压痕,该磷光体在由通过所述磷光体板泄漏的蓝色光激励时产生至少红色光;
在填充步骤之后,将至少磷光体板和所述LED的一部分浸没到模具中的液态透镜材料中;以及
固化液态透镜材料,以便在所述磷光体板和LED上制成磷光体加载透镜(258)。
2.权利要求1的工艺,其中所述液态透镜材料(252)封装所述LED(236)和磷光体板(228)。
3.权利要求1的工艺,还包括通过将所述磷光体加载透镜和LED浸没到模具压痕中的液态透镜材料(252)中并且然后固化该液态透镜材料来在所述磷光体加载透镜(258)和LED(236)上模压清晰透镜(260)。
4.权利要求1的工艺,还包括确定所述磷光体板(228)贴于其上的LED(236)的色温-视角关系,并且然后对所述模具压痕定形(264)以增大该色温-视角关系的均匀性。
5.权利要求1的工艺,其中来自所述LED(236)、磷光体板(228)和磷光体加载透镜(258)的光的组合产生白色光。
6.权利要求1的工艺,其中将所述LED(236)连同多个相同的LED一起安装到基板(238)上,其中将至少所述磷光体板浸没到所述模具中的液态透镜材料中的步骤包括同时将该基板上的所有LED浸没到关联的模具压痕中的液态透镜材料中。
7.一种发光二极管(LED)结构,包括:
基板(238)上发射蓝色光的LED(236);
贴到该LED上的平坦的预制磷光体板(228),该预制磷光体板包含发射黄色光的YAG磷光体,其中来自该LED的通过该磷光体板泄漏的蓝色光与所述黄色光的组合产生白色光;
在所述磷光体板和LED上的模压的磷光体加载透镜(258),其在由通过所述磷光体板泄漏的蓝色光激励时产生至少红色光;以及
在所述LED和磷光体加载透镜上模压的不含磷光体的清晰透镜(260)。
8.权利要求7的结构,其中与所述磷光体板(228)结合的LED(236)具有一定的色温-视角关系,并且其中对所述磷光体加载透镜定形(264)以便增大该色温-视角关系的均匀性。
9.权利要求7的结构,其中来自所述LED(236)、磷光体板(228)和磷光体加载透镜(258)的光的组合产生白色光。
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US20110057205A1 (en) | 2011-03-10 |
US7858408B2 (en) | 2010-12-28 |
CN101636851A (zh) | 2010-01-27 |
US20080048200A1 (en) | 2008-02-28 |
JP2010519757A (ja) | 2010-06-03 |
EP2115789A2 (en) | 2009-11-11 |
KR20090127296A (ko) | 2009-12-10 |
WO2008104936A3 (en) | 2008-12-04 |
TW200901514A (en) | 2009-01-01 |
WO2008104936A2 (en) | 2008-09-04 |
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