CN104465954A - Cob光源封装工艺 - Google Patents

Cob光源封装工艺 Download PDF

Info

Publication number
CN104465954A
CN104465954A CN201410808958.3A CN201410808958A CN104465954A CN 104465954 A CN104465954 A CN 104465954A CN 201410808958 A CN201410808958 A CN 201410808958A CN 104465954 A CN104465954 A CN 104465954A
Authority
CN
China
Prior art keywords
light source
cob light
different
cob
blue
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410808958.3A
Other languages
English (en)
Inventor
励春亚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201410808958.3A priority Critical patent/CN104465954A/zh
Publication of CN104465954A publication Critical patent/CN104465954A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

本发明公开了一种COB光源封装工艺，它涉及光源封装技术领域。其步骤为：1、蓝光芯片，通过固晶，焊线，COB光源使用荧光胶molding成型工艺，封装后形成白光光源；2、不同种类的蓝光芯片适配不同的荧光粉，可配置出不同色温、不同显色指数Ra，不同光效；3、COB光源使用荧光胶molding成型工艺。本发明产品发光角度大，光效高，具有极高性价比，产品可靠性及寿命提高。

Description

COB光源封装工艺
技术领域
本发明涉及的是光源封装技术领域，具体涉及一种COB光源封装工艺。
背景技术
COB光源被业内认为是集各种优点于一身，比如高密度封装体积小、容易配光、无需贴片、回流焊工序、组装方便等，也因此得到了商业照明等领域的认可与广泛应用，LED封装行业始终处于新材料和新工艺的快速更替中，传统的光源封装工艺的可靠性不高，成本高，而且光源的使用寿命也大大降低。
发明内容
针对现有技术上存在的不足，本发明目的是在于提供一种COB光源封装工艺，产品发光角度大，光效高，具有极高性价比，产品可靠性及寿命提高。
为了实现上述目的，本发明是通过如下的技术方案来实现：COB光源封装工艺，其步骤为：1、蓝光芯片，通过固晶，焊线，COB光源使用荧光胶molding成型工艺，封装后形成白光光源；2、不同种类的蓝光芯片适配不同的荧光粉，可配置出不同色温、不同显色指数Ra，不同光效；3、COB光源使用荧光胶molding成型工艺。
作为优选，所述的蓝光芯片为蓝光LED芯片。
本发明的有益效果：
1、COB光源使用荧光胶molding成型工艺，取消COB光源围坝工艺。
2、COB光源使用荧光胶molding成型工艺，发光面积更加精确，稳定。
3、COB光源使用荧光胶molding成型工艺，增加产品出光面，提高发光角度。
4、胶体耐高温，颜色一致性好，光线柔和，色温集中度高。
5、产品发光角度大，光效高。
6、具有极高性价比，产品可靠性及寿命提高。
具体实施方式
为使本发明实现的技术手段、创作特征、达成目的与功效易于明白了解，下面结合具体实施方式，进一步阐述本发明。
本具体实施方式采用以下技术方案：COB光源封装工艺，其步骤为：1、蓝光芯片，通过固晶，焊线，COB光源使用荧光胶molding成型工艺，封装后形成白光光源；2、不同种类的蓝光芯片适配不同的荧光粉，可配置出不同色温、不同显色指数Ra，不同光效；3、COB光源使用荧光胶molding成型工艺。
值得注意的是，所述的蓝光芯片为蓝光LED芯片。
本具体实施方式的COB光源使用荧光胶molding成型工艺，颜色一致性好，光线柔和，色温集中度高。不同种类的蓝光LED芯片适配不同的荧光粉，可配置出不同色温、不同显色指数Ra，不同光效等。
本具体实施方式的COB光源使用荧光胶molding成型工艺，取消COB光源围坝工艺。使用荧光胶molding成型工艺，发光面积更加精确，稳定，良率高。具有极高的性价比，产品可靠性及寿命得到进一步提高升
本具体实施方式的发蓝色光的芯片，适配不同的荧光粉，所激发的白色光源。COB光源使用荧光胶molding成型工艺。
以上显示和描述了本发明的基本原理和主要特征和本发明的优点。本行业的技术人员应该了解，本发明不受上述实施例的限制，上述实施例和说明书中描述的只是说明本发明的原理，在不脱离本发明精神和范围的前提下，本发明还会有各种变化和改进，这些变化和改进都落入要求保护的本发明范围内。本发明要求保护范围由所附的权利要求书及其等效物界定。

Claims (2)

1.COB光源封装工艺，其特征在于，其步骤为：1、蓝光芯片，通过固晶，焊线，COB光源使用荧光胶molding成型工艺，封装后形成白光光源；2、不同种类的蓝光芯片适配不同的荧光粉，可配置出不同色温、不同显色指数Ra，不同光效；3、COB光源使用荧光胶molding成型工艺。
2.根据权利要求1所述的COB光源封装工艺，其特征在于，所述的蓝光芯片为蓝光LED芯片。
CN201410808958.3A 2014-12-14 2014-12-14 Cob光源封装工艺 Pending CN104465954A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410808958.3A CN104465954A (zh) 2014-12-14 2014-12-14 Cob光源封装工艺

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410808958.3A CN104465954A (zh) 2014-12-14 2014-12-14 Cob光源封装工艺

Publications (1)

Publication Number Publication Date
CN104465954A true CN104465954A (zh) 2015-03-25

Family

ID=52911676

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410808958.3A Pending CN104465954A (zh) 2014-12-14 2014-12-14 Cob光源封装工艺

Country Status (1)

Country Link
CN (1) CN104465954A (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080084699A1 (en) * 2005-06-24 2008-04-10 Park Jun S Light Emitting Device Package and Manufacture Method of Light Emitting Device Package
CN101636851A (zh) * 2007-02-26 2010-01-27 皇家菲利浦电子有限公司 具有透镜中的磷光体片和过模压磷光体的led
CN201853734U (zh) * 2009-08-14 2011-06-01 琉明斯光电科技股份有限公司 具广角照射光形的表面黏着led封胶体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080084699A1 (en) * 2005-06-24 2008-04-10 Park Jun S Light Emitting Device Package and Manufacture Method of Light Emitting Device Package
CN101636851A (zh) * 2007-02-26 2010-01-27 皇家菲利浦电子有限公司 具有透镜中的磷光体片和过模压磷光体的led
CN201853734U (zh) * 2009-08-14 2011-06-01 琉明斯光电科技股份有限公司 具广角照射光形的表面黏着led封胶体

Similar Documents

Publication Publication Date Title
CN103322525B (zh) Led灯及其灯丝
CN104456165A (zh) 一种全角度高照度发光灯丝灯泡及其制造方法
CN203733792U (zh) Led灯丝
CN103972364A (zh) 一种led光源的制造方法
TWI509844B (zh) Applied to the backlight of the LED light-emitting structure
CN103050615B (zh) 一种高显色性白光led器件
CN102832317B (zh) 红光led封装方法
CN104393145A (zh) 一种低热阻、高亮度、陶瓷基白光led
CN104241501A (zh) 全向植物生长灯led灯丝及其制造方法
CN103700651A (zh) 高显色led灯丝
CN104347606B (zh) 发光二极管封装结构及光源模块
CN203413560U (zh) Led灯及其灯丝
CN102810618B (zh) 半导体封装结构
CN203733830U (zh) Led灯封装结构
CN104465954A (zh) Cob光源封装工艺
CN206490057U (zh) 一种同驱、全色温、同亮度倒装cob光源
CN203644774U (zh) Led灯泡
CN204026266U (zh) 异形360°发光灯泡
CN204227147U (zh) 一种大角度照射的led灯
CN203553164U (zh) 高显色led灯丝
CN203774375U (zh) 一种高显色指数贴片式led
CN203927510U (zh) 一种远程激发技术结构led光源
CN204285044U (zh) 一种多层立体光源
CN204927326U (zh) 一种采用倒装芯片的高光效高显指led灯管
CN105789194A (zh) 一种全新的cob光源封装装置及工艺

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
EXSB Decision made by sipo to initiate substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20150325

WD01 Invention patent application deemed withdrawn after publication