CN101308819B - 半导体集成电路器件的制造方法及探针卡 - Google Patents

半导体集成电路器件的制造方法及探针卡 Download PDF

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Publication number
CN101308819B
CN101308819B CN2008101318035A CN200810131803A CN101308819B CN 101308819 B CN101308819 B CN 101308819B CN 2008101318035 A CN2008101318035 A CN 2008101318035A CN 200810131803 A CN200810131803 A CN 200810131803A CN 101308819 B CN101308819 B CN 101308819B
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China
Prior art keywords
wiring
probe
sheet
contact
contact terminals
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Expired - Lifetime
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CN2008101318035A
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Chinese (zh)
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CN101308819A (zh
Inventor
冈元正芳
松本秀幸
寄崎真吾
长谷部昭男
本山康博
岛濑朗
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Renesas Electronics Corp
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Renesas Technology Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
CN2008101318035A 2004-04-09 2005-04-08 半导体集成电路器件的制造方法及探针卡 Expired - Lifetime CN101308819B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004115048A JP4521611B2 (ja) 2004-04-09 2004-04-09 半導体集積回路装置の製造方法
JP115048/2004 2004-04-09

Related Parent Applications (1)

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CNB2005100635208A Division CN100435317C (zh) 2004-04-09 2005-04-08 半导体集成电路器件的制造方法及探针卡

Publications (2)

Publication Number Publication Date
CN101308819A CN101308819A (zh) 2008-11-19
CN101308819B true CN101308819B (zh) 2010-09-15

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Family Applications (3)

Application Number Title Priority Date Filing Date
CN2008101318035A Expired - Lifetime CN101308819B (zh) 2004-04-09 2005-04-08 半导体集成电路器件的制造方法及探针卡
CNB2005100635208A Expired - Lifetime CN100435317C (zh) 2004-04-09 2005-04-08 半导体集成电路器件的制造方法及探针卡
CN200810131804XA Expired - Lifetime CN101308820B (zh) 2004-04-09 2005-04-08 半导体集成电路器件的制造方法及探针卡

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CNB2005100635208A Expired - Lifetime CN100435317C (zh) 2004-04-09 2005-04-08 半导体集成电路器件的制造方法及探针卡
CN200810131804XA Expired - Lifetime CN101308820B (zh) 2004-04-09 2005-04-08 半导体集成电路器件的制造方法及探针卡

Country Status (5)

Country Link
US (2) US7271015B2 (https=)
JP (1) JP4521611B2 (https=)
KR (1) KR20060046627A (https=)
CN (3) CN101308819B (https=)
TW (1) TW200605253A (https=)

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CN100508154C (zh) 2004-11-18 2009-07-01 株式会社瑞萨科技 半导体集成电路器件的制造方法
CN100585826C (zh) 2005-03-11 2010-01-27 株式会社瑞萨科技 半导体集成电路器件的制造方法
JP2006343182A (ja) * 2005-06-08 2006-12-21 Renesas Technology Corp 半導体集積回路装置の製造方法
JP4800007B2 (ja) 2005-11-11 2011-10-26 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法およびプローブカード
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WO2009130793A1 (ja) * 2008-04-25 2009-10-29 株式会社アドバンテスト 試験システムおよびプローブ装置
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JP2011149938A (ja) * 2010-01-22 2011-08-04 Kodi-S Co Ltd フィルムタイプのプローブユニット及びその製造方法
CN101846696B (zh) * 2010-03-19 2012-10-03 华映光电股份有限公司 探针及其制作方法
US8323992B2 (en) 2010-09-09 2012-12-04 Renesas Electronics Corporation Method of manufacturing semiconductor integrated circuit device
JP5707222B2 (ja) * 2011-05-20 2015-04-22 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
KR101765656B1 (ko) * 2010-12-23 2017-08-08 삼성디스플레이 주식회사 구동 집적회로 및 이를 포함하는 표시장치
JP2013246153A (ja) 2012-05-29 2013-12-09 Micronics Japan Co Ltd プローブカード
CN103575294B (zh) * 2012-07-27 2016-02-24 中国航空工业第六一八研究所 硅微陀螺芯片探针卡
KR101439343B1 (ko) 2013-04-18 2014-09-16 주식회사 아이에스시 포고핀용 탐침부재
KR101439342B1 (ko) * 2013-04-18 2014-09-16 주식회사 아이에스시 포고핀용 탐침부재
TWI503554B (zh) * 2013-06-04 2015-10-11 Mpi Corp 探針卡與其之製作方法
US10451652B2 (en) * 2014-07-16 2019-10-22 Teradyne, Inc. Coaxial structure for transmission of signals in test equipment
KR20180014781A (ko) * 2015-05-29 2018-02-09 알&디 설킷트스 인크. 집적 회로 테스트 환경에서 프로브 카드 어셈블리의 개선된 전력 공급 과도 성능(전력 무결성)
WO2017022035A1 (ja) * 2015-07-31 2017-02-09 日本電子材料株式会社 プローブカード
JP6556612B2 (ja) * 2015-12-04 2019-08-07 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
TWI583963B (zh) * 2016-04-18 2017-05-21 旺矽科技股份有限公司 探針卡
CN108663648A (zh) * 2017-03-27 2018-10-16 富泰华工业（深圳）有限公司 调校探针位置的测试板及测试方法
CN111913019A (zh) * 2017-09-15 2020-11-10 中华精测科技股份有限公司 探针卡装置的圆形探针
JP7237474B2 (ja) * 2018-06-18 2023-03-13 京セラ株式会社 セラミック配線基板およびプローブ基板
IT201800006903A1 (it) * 2018-07-04 2020-01-04 Scheda di misura per applicazioni ad alta frequenza
KR102605620B1 (ko) * 2018-09-13 2023-11-23 삼성전자주식회사 프로브 카드 검사용 웨이퍼, 프로브 카드 검사 시스템 및 프로브 카드 검사 방법
US10893605B2 (en) * 2019-05-28 2021-01-12 Seagate Technology Llc Textured test pads for printed circuit board testing
CN110412321B (zh) * 2019-07-17 2021-08-13 上海华力微电子有限公司 触点单元结构及其构成的矩阵探针卡
CN112305395B (zh) * 2020-11-06 2021-05-28 法特迪精密科技（苏州）有限公司 一种探针结构及其安装方法、闭路方法、抗干扰方法
CN116953485B (zh) * 2023-08-08 2024-06-25 苏州法特迪科技股份有限公司 一种高温老化测试插座调节方法

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CN1248064A (zh) * 1998-09-14 2000-03-22 世大积体电路股份有限公司 形成相邻于信号线的屏蔽线的方法
US6305230B1 (en) * 1997-05-09 2001-10-23 Hitachi, Ltd. Connector and probing system

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US5180977A (en) * 1991-12-02 1993-01-19 Hoya Corporation Usa Membrane probe contact bump compliancy system
US5604446A (en) * 1994-09-09 1997-02-18 Tokyo Electron Limited Probe apparatus
CN1169035A (zh) * 1996-02-22 1997-12-31 冲电气工业株式会社 具有在存储器区域上定线的门阵列互连的集成电路
US6305230B1 (en) * 1997-05-09 2001-10-23 Hitachi, Ltd. Connector and probing system
CN1248064A (zh) * 1998-09-14 2000-03-22 世大积体电路股份有限公司 形成相邻于信号线的屏蔽线的方法

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Also Published As

Publication number Publication date
KR20060046627A (ko) 2006-05-17
CN100435317C (zh) 2008-11-19
US20050227383A1 (en) 2005-10-13
US7517707B2 (en) 2009-04-14
TW200605253A (en) 2006-02-01
TWI351730B (https=) 2011-11-01
CN1681106A (zh) 2005-10-12
US7271015B2 (en) 2007-09-18
JP4521611B2 (ja) 2010-08-11
CN101308820B (zh) 2010-06-02
CN101308820A (zh) 2008-11-19
CN101308819A (zh) 2008-11-19
US20070190671A1 (en) 2007-08-16
JP2005302917A (ja) 2005-10-27

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