CN101151292B - 聚酰亚胺树脂和可固化的树脂组合物 - Google Patents
聚酰亚胺树脂和可固化的树脂组合物 Download PDFInfo
- Publication number
- CN101151292B CN101151292B CN2006800104555A CN200680010455A CN101151292B CN 101151292 B CN101151292 B CN 101151292B CN 2006800104555 A CN2006800104555 A CN 2006800104555A CN 200680010455 A CN200680010455 A CN 200680010455A CN 101151292 B CN101151292 B CN 101151292B
- Authority
- CN
- China
- Prior art keywords
- polyimide resin
- compound
- weight part
- hydroxyl
- integer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920001721 polyimide Polymers 0.000 title claims abstract description 139
- 239000009719 polyimide resin Substances 0.000 title claims abstract description 131
- 239000011342 resin composition Substances 0.000 title 1
- -1 diisocyanate compound Chemical class 0.000 claims abstract description 148
- 239000000203 mixture Substances 0.000 claims abstract description 82
- 238000009413 insulation Methods 0.000 claims abstract description 43
- 238000006243 chemical reaction Methods 0.000 claims abstract description 22
- 150000001875 compounds Chemical class 0.000 claims description 44
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 42
- 239000003960 organic solvent Substances 0.000 claims description 24
- 239000004593 Epoxy Substances 0.000 claims description 23
- 125000005442 diisocyanate group Chemical group 0.000 claims description 18
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 14
- 239000012948 isocyanate Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 12
- 229910052799 carbon Inorganic materials 0.000 claims description 10
- 125000004432 carbon atom Chemical group C* 0.000 claims description 8
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 7
- 125000001931 aliphatic group Chemical group 0.000 claims description 7
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 5
- 125000001261 isocyanato group Chemical group *N=C=O 0.000 claims description 4
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 3
- 125000003118 aryl group Chemical group 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 150000000000 tetracarboxylic acids Chemical class 0.000 claims description 2
- 239000011541 reaction mixture Substances 0.000 abstract description 5
- 125000005587 carbonate group Chemical group 0.000 abstract 1
- 238000012986 modification Methods 0.000 description 38
- 230000004048 modification Effects 0.000 description 38
- 229920005989 resin Polymers 0.000 description 32
- 239000011347 resin Substances 0.000 description 32
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 30
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 28
- 239000000243 solution Substances 0.000 description 28
- 238000002360 preparation method Methods 0.000 description 26
- 239000002904 solvent Substances 0.000 description 25
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 24
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 15
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 14
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 14
- 229910052757 nitrogen Inorganic materials 0.000 description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 12
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 12
- 239000011521 glass Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 11
- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 11
- 239000002253 acid Substances 0.000 description 10
- 239000003795 chemical substances by application Substances 0.000 description 10
- 239000000126 substance Substances 0.000 description 10
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 description 9
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 9
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 9
- 239000000843 powder Substances 0.000 description 9
- DBXBTMSZEOQQDU-UHFFFAOYSA-N 3-hydroxyisobutyric acid Chemical compound OCC(C)C(O)=O DBXBTMSZEOQQDU-UHFFFAOYSA-N 0.000 description 8
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 8
- 239000004642 Polyimide Substances 0.000 description 8
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 8
- 150000003949 imides Chemical class 0.000 description 8
- 239000004922 lacquer Substances 0.000 description 8
- 239000012299 nitrogen atmosphere Substances 0.000 description 8
- 229920005862 polyol Polymers 0.000 description 8
- 150000003077 polyols Chemical class 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 7
- 239000002131 composite material Substances 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 239000000945 filler Substances 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 238000000465 moulding Methods 0.000 description 7
- 239000004417 polycarbonate Substances 0.000 description 7
- 229920000515 polycarbonate Polymers 0.000 description 7
- 238000005476 soldering Methods 0.000 description 7
- 229910002012 Aerosil® Inorganic materials 0.000 description 6
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 6
- 238000009835 boiling Methods 0.000 description 6
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 238000012423 maintenance Methods 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 5
- 150000004984 aromatic diamines Chemical class 0.000 description 5
- 150000002148 esters Chemical class 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 4
- FYYYKXFEKMGYLZ-UHFFFAOYSA-N 4-(1,3-dioxo-2-benzofuran-5-yl)-2-benzofuran-1,3-dione Chemical compound C=1C=C2C(=O)OC(=O)C2=CC=1C1=CC=CC2=C1C(=O)OC2=O FYYYKXFEKMGYLZ-UHFFFAOYSA-N 0.000 description 4
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 4
- 239000004962 Polyamide-imide Substances 0.000 description 4
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- WUGQZFFCHPXWKQ-UHFFFAOYSA-N Propanolamine Chemical compound NCCCO WUGQZFFCHPXWKQ-UHFFFAOYSA-N 0.000 description 4
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 239000002585 base Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 239000003153 chemical reaction reagent Substances 0.000 description 4
- 230000002950 deficient Effects 0.000 description 4
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 4
- 238000004821 distillation Methods 0.000 description 4
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 4
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 4
- 150000004693 imidazolium salts Chemical class 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 229920001568 phenolic resin Polymers 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- 229920002312 polyamide-imide Polymers 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- 229960001866 silicon dioxide Drugs 0.000 description 4
- HHVIBTZHLRERCL-UHFFFAOYSA-N sulfonyldimethane Chemical compound CS(C)(=O)=O HHVIBTZHLRERCL-UHFFFAOYSA-N 0.000 description 4
- ZUHZGEOKBKGPSW-UHFFFAOYSA-N tetraglyme Chemical compound COCCOCCOCCOCCOC ZUHZGEOKBKGPSW-UHFFFAOYSA-N 0.000 description 4
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 4
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 4
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- NSGXIBWMJZWTPY-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropane Chemical compound FC(F)(F)CC(F)(F)F NSGXIBWMJZWTPY-UHFFFAOYSA-N 0.000 description 3
- AKABKVXLWWIVIW-UHFFFAOYSA-N 1,1-diisocyanatohexane Chemical compound CCCCCC(N=C=O)N=C=O AKABKVXLWWIVIW-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 3
- 229940126062 Compound A Drugs 0.000 description 3
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 239000004202 carbamide Substances 0.000 description 3
- 235000013877 carbamide Nutrition 0.000 description 3
- 150000001896 cresols Chemical class 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 3
- 239000010445 mica Substances 0.000 description 3
- 229910052618 mica group Inorganic materials 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000005056 polyisocyanate Substances 0.000 description 3
- 229920001228 polyisocyanate Polymers 0.000 description 3
- LVTJOONKWUXEFR-FZRMHRINSA-N protoneodioscin Natural products O(C[C@@H](CC[C@]1(O)[C@H](C)[C@@H]2[C@]3(C)[C@H]([C@H]4[C@@H]([C@]5(C)C(=CC4)C[C@@H](O[C@@H]4[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@@H](O)[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@H](CO)O4)CC5)CC3)C[C@@H]2O1)C)[C@H]1[C@H](O)[C@H](O)[C@H](O)[C@@H](CO)O1 LVTJOONKWUXEFR-FZRMHRINSA-N 0.000 description 3
- 229920003987 resole Polymers 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- FUIQBJHUESBZNU-UHFFFAOYSA-N 2-[(dimethylazaniumyl)methyl]phenolate Chemical compound CN(C)CC1=CC=CC=C1O FUIQBJHUESBZNU-UHFFFAOYSA-N 0.000 description 2
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- POSWICCRDBKBMH-UHFFFAOYSA-N 3,3,5-trimethylcyclohexan-1-one Chemical compound CC1CC(=O)CC(C)(C)C1 POSWICCRDBKBMH-UHFFFAOYSA-N 0.000 description 2
- KSMVBYPXNKCPAJ-UHFFFAOYSA-N 4-Methylcyclohexylamine Chemical compound CC1CCC(N)CC1 KSMVBYPXNKCPAJ-UHFFFAOYSA-N 0.000 description 2
- ZMSQJSMSLXVTKN-UHFFFAOYSA-N 4-[2-(2-morpholin-4-ylethoxy)ethyl]morpholine Chemical compound C1COCCN1CCOCCN1CCOCC1 ZMSQJSMSLXVTKN-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- UJOBWOGCFQCDNV-UHFFFAOYSA-N 9H-carbazole Chemical compound C1=CC=C2C3=CC=CC=C3NC2=C1 UJOBWOGCFQCDNV-UHFFFAOYSA-N 0.000 description 2
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical compound CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229910002014 Aerosil® 130 Inorganic materials 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- SUAKHGWARZSWIH-UHFFFAOYSA-N N,N‐diethylformamide Chemical compound CCN(CC)C=O SUAKHGWARZSWIH-UHFFFAOYSA-N 0.000 description 2
- ZWXPDGCFMMFNRW-UHFFFAOYSA-N N-methylcaprolactam Chemical group CN1CCCCCC1=O ZWXPDGCFMMFNRW-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical class OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 2
- YVNRUPSDZZZUQJ-UHFFFAOYSA-N [O].NC1=CC=CC=C1 Chemical compound [O].NC1=CC=CC=C1 YVNRUPSDZZZUQJ-UHFFFAOYSA-N 0.000 description 2
- 230000001476 alcoholic effect Effects 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000010411 cooking Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- VEZUQRBDRNJBJY-UHFFFAOYSA-N cyclohexanone oxime Chemical compound ON=C1CCCCC1 VEZUQRBDRNJBJY-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 229940015043 glyoxal Drugs 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 2
- 150000002466 imines Chemical group 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 2
- AJFDBNQQDYLMJN-UHFFFAOYSA-N n,n-diethylacetamide Chemical compound CCN(CC)C(C)=O AJFDBNQQDYLMJN-UHFFFAOYSA-N 0.000 description 2
- WHIVNJATOVLWBW-UHFFFAOYSA-N n-butan-2-ylidenehydroxylamine Chemical compound CCC(C)=NO WHIVNJATOVLWBW-UHFFFAOYSA-N 0.000 description 2
- IXQGCWUGDFDQMF-UHFFFAOYSA-N o-Hydroxyethylbenzene Natural products CCC1=CC=CC=C1O IXQGCWUGDFDQMF-UHFFFAOYSA-N 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- XUWHAWMETYGRKB-UHFFFAOYSA-N piperidin-2-one Chemical compound O=C1CCCCN1 XUWHAWMETYGRKB-UHFFFAOYSA-N 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- 150000003222 pyridines Chemical class 0.000 description 2
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical compound O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 2
- FZENGILVLUJGJX-NSCUHMNNSA-N (E)-acetaldehyde oxime Chemical compound C\C=N\O FZENGILVLUJGJX-NSCUHMNNSA-N 0.000 description 1
- AWMNXQXKGOSXDN-GORDUTHDSA-N (e)-ethylideneurea Chemical compound C\C=N\C(N)=O AWMNXQXKGOSXDN-GORDUTHDSA-N 0.000 description 1
- AVQQQNCBBIEMEU-UHFFFAOYSA-N 1,1,3,3-tetramethylurea Chemical compound CN(C)C(=O)N(C)C AVQQQNCBBIEMEU-UHFFFAOYSA-N 0.000 description 1
- CFQPVBJOKYSPKG-UHFFFAOYSA-N 1,3-dimethylimidazol-2-one Chemical compound CN1C=CN(C)C1=O CFQPVBJOKYSPKG-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- GPRYKVSEZCQIHD-UHFFFAOYSA-N 1-(4-aminophenyl)ethanone Chemical compound CC(=O)C1=CC=C(N)C=C1 GPRYKVSEZCQIHD-UHFFFAOYSA-N 0.000 description 1
- MBDUIEKYVPVZJH-UHFFFAOYSA-N 1-ethylsulfonylethane Chemical compound CCS(=O)(=O)CC MBDUIEKYVPVZJH-UHFFFAOYSA-N 0.000 description 1
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- LTMRRSWNXVJMBA-UHFFFAOYSA-L 2,2-diethylpropanedioate Chemical compound CCC(CC)(C([O-])=O)C([O-])=O LTMRRSWNXVJMBA-UHFFFAOYSA-L 0.000 description 1
- JKTAIYGNOFSMCE-UHFFFAOYSA-N 2,3-di(nonyl)phenol Chemical compound CCCCCCCCCC1=CC=CC(O)=C1CCCCCCCCC JKTAIYGNOFSMCE-UHFFFAOYSA-N 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N 2,4-diaminotoluene Chemical compound CC1=CC=C(N)C=C1N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- WKFQMDFSDQFAIC-UHFFFAOYSA-N 2,4-dimethylthiolane 1,1-dioxide Chemical compound CC1CC(C)S(=O)(=O)C1 WKFQMDFSDQFAIC-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- HPVOTSMEHLZBJY-UHFFFAOYSA-N 2-(hydroxymethyl)pentanoic acid Chemical class CCCC(CO)C(O)=O HPVOTSMEHLZBJY-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- MXZROAOUCUVNHX-UHFFFAOYSA-N 2-Aminopropanol Chemical compound CCC(N)O MXZROAOUCUVNHX-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- JCBPETKZIGVZRE-UHFFFAOYSA-N 2-aminobutan-1-ol Chemical compound CCC(N)CO JCBPETKZIGVZRE-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical compound CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- JRBJSXQPQWSCCF-UHFFFAOYSA-N 3,3'-Dimethoxybenzidine Chemical compound C1=C(N)C(OC)=CC(C=2C=C(OC)C(N)=CC=2)=C1 JRBJSXQPQWSCCF-UHFFFAOYSA-N 0.000 description 1
- LXJLFVRAWOOQDR-UHFFFAOYSA-N 3-(3-aminophenoxy)aniline Chemical compound NC1=CC=CC(OC=2C=C(N)C=CC=2)=C1 LXJLFVRAWOOQDR-UHFFFAOYSA-N 0.000 description 1
- JFEXPVDGVLNUSC-UHFFFAOYSA-N 3-(3-aminophenyl)sulfanylaniline Chemical compound NC1=CC=CC(SC=2C=C(N)C=CC=2)=C1 JFEXPVDGVLNUSC-UHFFFAOYSA-N 0.000 description 1
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 1
- JJYPMNFTHPTTDI-UHFFFAOYSA-N 3-methylaniline Chemical compound CC1=CC=CC(N)=C1 JJYPMNFTHPTTDI-UHFFFAOYSA-N 0.000 description 1
- MUNOBADFTHUUFG-UHFFFAOYSA-N 3-phenylaniline Chemical compound NC1=CC=CC(C=2C=CC=CC=2)=C1 MUNOBADFTHUUFG-UHFFFAOYSA-N 0.000 description 1
- IPWGAPCYYMTTLT-UHFFFAOYSA-N 3-propylaniline Chemical compound CCCC1=CC=CC(N)=C1 IPWGAPCYYMTTLT-UHFFFAOYSA-N 0.000 description 1
- ICNFHJVPAJKPHW-UHFFFAOYSA-N 4,4'-Thiodianiline Chemical compound C1=CC(N)=CC=C1SC1=CC=C(N)C=C1 ICNFHJVPAJKPHW-UHFFFAOYSA-N 0.000 description 1
- UITKHKNFVCYWNG-UHFFFAOYSA-N 4-(3,4-dicarboxybenzoyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 UITKHKNFVCYWNG-UHFFFAOYSA-N 0.000 description 1
- DVGXDSPMPDANGA-UHFFFAOYSA-N 4-(9h-fluoren-1-yl)aniline Chemical class C1=CC(N)=CC=C1C1=CC=CC2=C1CC1=CC=CC=C12 DVGXDSPMPDANGA-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical class C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- NFVPEIKDMMISQO-UHFFFAOYSA-N 4-[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC=C(O)C=C1 NFVPEIKDMMISQO-UHFFFAOYSA-N 0.000 description 1
- KXEPRLUGFAULQX-UHFFFAOYSA-N 4-[2,5-di(propan-2-yl)phenyl]aniline Chemical compound CC(C)C1=CC=C(C(C)C)C(C=2C=CC(N)=CC=2)=C1 KXEPRLUGFAULQX-UHFFFAOYSA-N 0.000 description 1
- JJCSPSSFSJVEFG-UHFFFAOYSA-N 4-[2,6-di(propan-2-yl)phenyl]aniline Chemical compound CC(C)C1=CC=CC(C(C)C)=C1C1=CC=C(N)C=C1 JJCSPSSFSJVEFG-UHFFFAOYSA-N 0.000 description 1
- IMLXLGZJLAOKJN-UHFFFAOYSA-N 4-aminocyclohexan-1-ol Chemical compound NC1CCC(O)CC1 IMLXLGZJLAOKJN-UHFFFAOYSA-N 0.000 description 1
- HTBBXIVJOSIHBY-UHFFFAOYSA-N 4-anthracen-1-ylaniline Chemical class C1=CC(N)=CC=C1C1=CC=CC2=CC3=CC=CC=C3C=C12 HTBBXIVJOSIHBY-UHFFFAOYSA-N 0.000 description 1
- OAPDPORYXWQVJE-UHFFFAOYSA-N 4-propylaniline Chemical compound CCCC1=CC=C(N)C=C1 OAPDPORYXWQVJE-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- IAZDPXIOMUYVGZ-WFGJKAKNSA-N Dimethyl sulfoxide Chemical compound [2H]C([2H])([2H])S(=O)C([2H])([2H])[2H] IAZDPXIOMUYVGZ-WFGJKAKNSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- WRQNANDWMGAFTP-UHFFFAOYSA-N Methylacetoacetic acid Chemical compound COC(=O)CC(C)=O WRQNANDWMGAFTP-UHFFFAOYSA-N 0.000 description 1
- SVYKKECYCPFKGB-UHFFFAOYSA-N N,N-dimethylcyclohexylamine Chemical compound CN(C)C1CCCCC1 SVYKKECYCPFKGB-UHFFFAOYSA-N 0.000 description 1
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical class CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 1
- 238000005481 NMR spectroscopy Methods 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- DWAQJAXMDSEUJJ-UHFFFAOYSA-M Sodium bisulfite Chemical compound [Na+].OS([O-])=O DWAQJAXMDSEUJJ-UHFFFAOYSA-M 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical group [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- HEDRZPFGACZZDS-MICDWDOJSA-N Trichloro(2H)methane Chemical compound [2H]C(Cl)(Cl)Cl HEDRZPFGACZZDS-MICDWDOJSA-N 0.000 description 1
- 229920006387 Vinylite Polymers 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 150000001241 acetals Chemical class 0.000 description 1
- PXAJQJMDEXJWFB-UHFFFAOYSA-N acetone oxime Chemical compound CC(C)=NO PXAJQJMDEXJWFB-UHFFFAOYSA-N 0.000 description 1
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001414 amino alcohols Chemical class 0.000 description 1
- QTQUJRIHTSIVOF-UHFFFAOYSA-N amino(phenyl)methanol Chemical compound NC(O)C1=CC=CC=C1 QTQUJRIHTSIVOF-UHFFFAOYSA-N 0.000 description 1
- 150000008064 anhydrides Chemical group 0.000 description 1
- GQZYJXVNALEKLC-UHFFFAOYSA-N aniline;ethanol Chemical compound CCO.NC1=CC=CC=C1 GQZYJXVNALEKLC-UHFFFAOYSA-N 0.000 description 1
- 239000012296 anti-solvent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- DMVOXQPQNTYEKQ-UHFFFAOYSA-N biphenyl-4-amine Chemical compound C1=CC(N)=CC=C1C1=CC=CC=C1 DMVOXQPQNTYEKQ-UHFFFAOYSA-N 0.000 description 1
- WQAQPCDUOCURKW-UHFFFAOYSA-N butanethiol Chemical compound CCCCS WQAQPCDUOCURKW-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 description 1
- SSJXIUAHEKJCMH-UHFFFAOYSA-N cyclohexane-1,2-diamine Chemical compound NC1CCCCC1N SSJXIUAHEKJCMH-UHFFFAOYSA-N 0.000 description 1
- GEQHKFFSPGPGLN-UHFFFAOYSA-N cyclohexane-1,3-diamine Chemical compound NC1CCCC(N)C1 GEQHKFFSPGPGLN-UHFFFAOYSA-N 0.000 description 1
- VKIRRGRTJUUZHS-UHFFFAOYSA-N cyclohexane-1,4-diamine Chemical compound NC1CCC(N)CC1 VKIRRGRTJUUZHS-UHFFFAOYSA-N 0.000 description 1
- 150000001934 cyclohexanes Chemical class 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- UKJLNMAFNRKWGR-UHFFFAOYSA-N cyclohexatrienamine Chemical group NC1=CC=C=C[CH]1 UKJLNMAFNRKWGR-UHFFFAOYSA-N 0.000 description 1
- KQWGXHWJMSMDJJ-UHFFFAOYSA-N cyclohexyl isocyanate Chemical class O=C=NC1CCCCC1 KQWGXHWJMSMDJJ-UHFFFAOYSA-N 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- CCAFPWNGIUBUSD-UHFFFAOYSA-N diethyl sulfoxide Chemical compound CCS(=O)CC CCAFPWNGIUBUSD-UHFFFAOYSA-N 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 1
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical class C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 1
- JMLPVHXESHXUSV-UHFFFAOYSA-N dodecane-1,1-diamine Chemical compound CCCCCCCCCCCC(N)N JMLPVHXESHXUSV-UHFFFAOYSA-N 0.000 description 1
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 1
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 description 1
- TZMFJUDUGYTVRY-UHFFFAOYSA-N ethyl methyl diketone Natural products CCC(=O)C(C)=O TZMFJUDUGYTVRY-UHFFFAOYSA-N 0.000 description 1
- 238000009432 framing Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- GNOIPBMMFNIUFM-UHFFFAOYSA-N hexamethylphosphoric triamide Chemical compound CN(C)P(=O)(N(C)C)N(C)C GNOIPBMMFNIUFM-UHFFFAOYSA-N 0.000 description 1
- 229940051250 hexylene glycol Drugs 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000006358 imidation reaction Methods 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- SQDFHQJTAWCFIB-UHFFFAOYSA-N n-methylidenehydroxylamine Chemical compound ON=C SQDFHQJTAWCFIB-UHFFFAOYSA-N 0.000 description 1
- OLAPPGSPBNVTRF-UHFFFAOYSA-N naphthalene-1,4,5,8-tetracarboxylic acid Chemical compound C1=CC(C(O)=O)=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1C(O)=O OLAPPGSPBNVTRF-UHFFFAOYSA-N 0.000 description 1
- DOBFTMLCEYUAQC-UHFFFAOYSA-N naphthalene-2,3,6,7-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=C2C=C(C(O)=O)C(C(=O)O)=CC2=C1 DOBFTMLCEYUAQC-UHFFFAOYSA-N 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 150000002924 oxiranes Chemical group 0.000 description 1
- 229960003540 oxyquinoline Drugs 0.000 description 1
- RZXMPPFPUUCRFN-UHFFFAOYSA-N p-toluidine Chemical compound CC1=CC=C(N)C=C1 RZXMPPFPUUCRFN-UHFFFAOYSA-N 0.000 description 1
- RGSFGYAAUTVSQA-UHFFFAOYSA-N pentamethylene Natural products C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- KRIOVPPHQSLHCZ-UHFFFAOYSA-N propiophenone Chemical compound CCC(=O)C1=CC=CC=C1 KRIOVPPHQSLHCZ-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- VTGOHKSTWXHQJK-UHFFFAOYSA-N pyrimidin-2-ol Chemical compound OC1=NC=CC=N1 VTGOHKSTWXHQJK-UHFFFAOYSA-N 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- CQRYARSYNCAZFO-UHFFFAOYSA-N salicyl alcohol Chemical compound OCC1=CC=CC=C1O CQRYARSYNCAZFO-UHFFFAOYSA-N 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229940079827 sodium hydrogen sulfite Drugs 0.000 description 1
- 235000010267 sodium hydrogen sulphite Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229960002317 succinimide Drugs 0.000 description 1
- FDDDEECHVMSUSB-UHFFFAOYSA-N sulfanilamide Chemical compound NC1=CC=C(S(N)(=O)=O)C=C1 FDDDEECHVMSUSB-UHFFFAOYSA-N 0.000 description 1
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 description 1
- 229940124530 sulfonamide Drugs 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 239000011593 sulfur Chemical group 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/65—Low-molecular-weight compounds having active hydrogen with high-molecular-weight compounds having active hydrogen
- C08G18/66—Compounds of groups C08G18/42, C08G18/48, or C08G18/52
- C08G18/6666—Compounds of group C08G18/48 or C08G18/52
- C08G18/6692—Compounds of group C08G18/48 or C08G18/52 with compounds of group C08G18/34
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/0804—Manufacture of polymers containing ionic or ionogenic groups
- C08G18/0819—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups
- C08G18/0823—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups containing carboxylate salt groups or groups forming them
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
- C08G18/3225—Polyamines
- C08G18/3234—Polyamines cycloaliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/34—Carboxylic acids; Esters thereof with monohydroxyl compounds
- C08G18/348—Hydroxycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/38—Low-molecular-weight compounds having heteroatoms other than oxygen
- C08G18/3819—Low-molecular-weight compounds having heteroatoms other than oxygen having nitrogen
- C08G18/3842—Low-molecular-weight compounds having heteroatoms other than oxygen having nitrogen containing heterocyclic rings having at least one nitrogen atom in the ring
- C08G18/3844—Low-molecular-weight compounds having heteroatoms other than oxygen having nitrogen containing heterocyclic rings having at least one nitrogen atom in the ring containing one nitrogen atom in the ring
- C08G18/3846—Low-molecular-weight compounds having heteroatoms other than oxygen having nitrogen containing heterocyclic rings having at least one nitrogen atom in the ring containing one nitrogen atom in the ring containing imide groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
- C08G18/44—Polycarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/54—Polycondensates of aldehydes
- C08G18/542—Polycondensates of aldehydes with phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/58—Epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/64—Macromolecular compounds not provided for by groups C08G18/42 - C08G18/63
- C08G18/6415—Macromolecular compounds not provided for by groups C08G18/42 - C08G18/63 having nitrogen
- C08G18/6438—Polyimides or polyesterimides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
- C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
- C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
- C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
- C08G18/7671—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups containing only one alkylene bisphenyl group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/80—Masked polyisocyanates
- C08G18/8061—Masked polyisocyanates masked with compounds having only one group containing active hydrogen
- C08G18/807—Masked polyisocyanates masked with compounds having only one group containing active hydrogen with nitrogen containing compounds
- C08G18/8077—Oximes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/40—Polyamides containing oxygen in the form of ether groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/44—Polyester-amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/16—Polyester-imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polyurethanes Or Polyureas (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Organic Insulating Materials (AREA)
- Paints Or Removers (AREA)
Abstract
本发明提供了一种包含聚酰亚胺树脂的可固化的聚酰亚胺树脂组合物,所述聚酰亚胺树脂通过包含二异氰酸酯化合物、含碳酸酯基的二醇化合物和具有两个末端羟烃基的酰亚胺化合物的反应混合物反应制得,用所述树脂组合物制得具有改进特性的固化的绝缘薄膜。
Description
发明领域
本发明涉及一种聚酰亚胺树脂和包含所述聚酰亚胺树脂的可固化的树脂组合物。更具体地讲,本发明涉及一种可有利地用于制造电子-电气装置的绝缘薄膜(例如保护性薄膜、焊接保护膜或夹层绝缘薄膜)的改性的聚酰亚胺树脂。
发明背景
为了制造柔性印刷电路板的保护性绝缘薄膜,通常使用聚酰亚胺树脂、聚氨酯树脂、聚酰胺酰亚胺树脂或环氧树脂。如果需要,在加入可固化的化合物后,这些树脂以可固化的树脂组合物形式使用。
优选保护性绝缘薄膜除了耐热性高、耐化学物质性高和耐溶剂性高以外,还柔性高、弯曲性高和翘曲性低。
美国专利6,335,417 B1描述了一种可制备耐热性高、挠曲性好和翘曲性低的制品的改性的聚酰亚胺树脂。该改性的聚酰亚胺树脂包含由包含聚丁二烯部分的聚酰亚胺单元和衍生自二异氰酸酯的残基的单元组成的重复单元。
JP-A-11-12500描述了一种具有碳酸酯键的可固化的改性的聚酰胺酰亚胺树脂。
JP-A-2002-145981描述了一种具有碳酸酯键的可固化的改性的聚酰亚胺树脂。通过在其主骨架中具有碳酸酯键的二异氰酸酯化合物与四羧酸二酐反应制备在该出版物中描述的改性的聚酰亚胺树脂。
本发明人注意到,具有酰胺键的可固化的改性的聚酰胺酰亚胺树脂(见述于JP-A-11-12500)吸湿性较高。高吸湿性降低了在电子装置上形成的改性的聚酰胺酰亚胺树脂的绝缘薄膜的绝缘性能。
根据本发明人的研究,JP-A-2002-145981中所述的具有碳酸酯键的改性的聚酰亚胺树脂在有机溶剂中的溶解度有限。此外,由该改性的聚酰亚胺树脂制备的绝缘薄膜在高温-高湿条件下的电阻不令人满意。
发明概述
本发明的一个目标为提供一种改性的聚酰亚胺树脂,所述树脂充分溶解于有机溶剂中、可制得电子-电气装置的绝缘薄膜(例如保护性薄膜、焊接保护膜或夹层绝缘薄膜)、耐热性高、柔性高、翘曲性低(或卷曲性低)、与模塑材料的粘附性好、耐化学物质性高、耐焊接性高和耐溶剂性高。
本发明的另一个目标为提供一种可固化的聚酰亚胺树脂组合物,所述组合物可制得电子-电气装置的绝缘薄膜(例如保护性薄膜、焊接保护膜或夹层绝缘薄膜)、耐热性高、柔性高、翘曲性低(或卷曲性低)、密封性好、耐化学物质性高、耐焊接性高和耐溶剂性高。
本发明人发现,通过在聚酰亚胺树脂的聚酰亚胺部分及其异氰酸酯部分之间掺入二价脂族或芳族烃基(特别是二价脂族烃基)可显著改进具有碳酸酯键的聚酰亚胺树脂的溶解度。在聚酰亚胺树脂的聚酰亚胺部分和异氰酸酯部分之间掺入二价脂族或芳族烃基可通过以下步骤进行:首先使含碳酸酯的二醇化合物(即具有两个末端羟基的碳酸酯化合物)分别与二异氰酸酯化合物和具有两个末端羟烃基的酰亚胺化合物反应,制备具有两个末端异氰酸基的碳酸酯化合物,随后具有两个末端异氰酸基的碳酸酯化合物与具有两个末端羟烃基的酰亚胺化合物反应。本发明人还发现,具有活性极性基团的二醇化合物与含碳酸酯的二醇化合物组合使用可有效改进使用所得到的改性的聚酰亚胺树脂制备的薄膜的薄膜特性。
因此,本发明涉及一种包含以下重复单元(1)、(2)和(3)的聚酰亚胺树脂:
其中A为通过除去二异氰酸酯化合物的两个异氰酸基得到的二价残基;W为通过除去具有活性极性基团的二醇化合物的两个羟基得到的二价残基;R1和R2各自独立为二价脂族或芳族烃基;X为通过除去四羧酸化合物的所有羧基得到的四价残基;Y为通过除去二胺化合物的两个氨基得到的二价基团;n为1-40的整数,m为0-20的整数,s和u各自独立为1-100的整数,t为0-100的整数。
本发明还涉及一种制备包含上述重复单元(1)、(2)和(3)的本发明的聚酰亚胺树脂的方法,所述方法包括将式(4)的二异氰酸酯化合物与式(5)的酰亚胺化合物反应:
其中A、W、R1、R2、n、s和t各自具有如上定义的含义。
本发明还涉及一种可固化的聚酰亚胺树脂组合物,所述组合物包含100重量份本发明的聚酰亚胺树脂、1-50重量份环氧化合物和/或1-50重量份异氰酸酯化合物和有机溶剂。
本发明还涉及一种通过加热所述聚酰亚胺树脂组合物的溶液薄膜制造的固化的绝缘薄膜,所述组合物包含100重量份本发明的聚酰亚胺树脂、1-50重量份环氧化合物和/或1-50重量份异氰酸酯化合物和有机溶剂。
附图概述
图1为在合成实施例1中制得的在各末端具有羟基的酰亚胺化合物A的1H-NMR光谱。
图2为在合成实施例2中制得的在各末端具有羟基的酰亚胺化合物B的1H-NMR光谱。
图3为在合成实施例3中制得的在各末端具有羟基的酰亚胺化合物C的1H-NMR光谱。
发明详述
可通过上述式(4)的二异氰酸酯化合物与上述式(5)的酰亚胺化合物反应,制备本发明的聚酰亚胺树脂。
可通过二异氰酸酯化合物与在其骨架中具有碳酸酯键的二醇化合物(即含碳酸酯键的二醇化合物)反应制备式(4)的二异氰酸酯化合物。
所述二异氰酸酯化合物可为任何二异氰酸酯,例如脂族二异氰酸酯、脂环族二异氰酸酯或芳族二异氰酸酯。除了包含在异氰酸基中的碳原子以外,优选二异氰酸酯包含2-30个碳原子。二异氰酸酯化合物的实例有1,4-亚丁基二异氰酸酯、1,5-亚戊基二异氰酸酯、1,6-亚己基二异氰酸酯、2,2,4-三甲基-1,6-亚己基二异氰酸酯、赖氨酸二异氰酸酯、3-异氰酸基甲基-3,5,5-三甲基环己基异氰酸酯(即异佛尔酮二异氰酸酯)、1,3-双(异氰酸基甲基)环己烷、4,4′-二环己基甲烷二异氰酸酯、甲苯二异氰酸酯、4,4′-二苯基甲烷二异氰酸酯、1,5-萘二异氰酸酯、甲苯胺二异氰酸酯和亚二甲苯基二异氰酸酯。
所述二异氰酸酯化合物可为使用封端剂在异氰酸基封端的封端二异氰酸酯。
所述封端剂可为醇化合物、酚化合物、活性亚甲基化合物、硫醇化合物、酰胺化合物、酰亚胺化合物、咪唑化合物、脲化合物、肟化合物、胺化合物、亚胺化合物、亚硫酸氢盐或吡啶化合物。这些化合物可单独使用或组合使用。封端剂的实例有醇化合物,例如甲醇、乙醇、丙醇、丁醇、2-乙基己醇、甲基溶纤剂、丁基溶纤剂、甲基卡必醇、苄醇、环己醇;酚化合物,例如苯酚、甲酚、乙基苯酚、丁基苯酚、壬基苯酚、二壬基苯酚、苯乙烯改性的苯酚和羟基苯甲酸酯;活性亚甲基化合物,例如丙二酸二甲酯、丙二酸二乙酯、乙酰乙酸甲酯、乙酰乙酸乙酯和乙酰基丙酮;硫醇化合物,例如丁基硫醇和十二烷基硫醇;酰胺化合物,例如N-乙酰苯胺、乙酰胺、ε-己内酰胺、δ-戊内酰胺和γ-丁内酰胺;酰亚胺化合物,例如琥珀酰亚胺和马来酰亚胺;咪唑化合物,例如咪唑和2-甲基咪唑;脲化合物,例如脲、硫脲和亚乙基脲;肟化合物,例如甲醛肟、乙醛肟、丙酮肟、甲乙酮肟和环己酮肟;胺化合物,例如二苯胺、苯胺和咔唑;亚胺化合物,例如乙烯亚胺和聚乙烯亚胺;亚硫酸氢盐,例如亚硫酸氢钠;和吡啶化合物,例如2-羟基吡啶和2-羟基喹啉。
含碳酸酯键的二醇化合物具有下式(6)的结构:
将式(6)的含碳酸酯键的二醇化合物掺入本发明的聚酰亚胺树脂中,以赋予所述树脂柔性,因此优选式(6)的R1为脂族烃基。式(6)的二醇化合物的分子量优选数均分子量为500-10,000,更优选为1,000-5,000。式(6)的二醇化合物的实例有UH-CARB、UD-CARB和UC-CARB(均购自Ube Industries,Ltd.);PLACCEL CD-PL、PLACCELCD-h(均购自Daicel Chemical Industries,Ltd.);和KURARAYPOLYOL C系列(购自Kuraray Co.,Ltd.)。式(6)的二醇化合物可单独使用或组合使用。此外,式(6)的二醇化合物可与一种或多种其他二醇化合物组合使用。
为了制备本发明的聚酰亚胺树脂,优选还使用含活性极性基团的二醇化合物。优选所述二醇化合物含有具有活性氢原子的取代基,例如羧基或酚羟基。优选含有羧基或酚羟基、具有1-30个碳原子(特别是2-20个碳原子)的二醇化合物。具有羧基的二醇化合物的实例有2,2-双(羟甲基)丙酸和2,2-双(羟甲基)戊酸。具有酚羟基的二醇化合物的实例有2,6-双(羟甲基)苯酚和2,6-双(羟甲基)-对甲酚。优选具有活性极性基团的二醇化合物还包含环氧基团或异氰酸酯化合物。
如果具有活性极性基团的二醇化合物与含碳酸酯键的二醇化合物组合使用,优选后面的二醇化合物的量与前面的二醇化合物的量的摩尔比率为0.1-10,更优选为0.1-5。此外,优选总二醇化合物(即前面的二醇化合物加上后面的二醇化合物)的量与二异氰酸酯化合物的量的摩尔比率为0.5-2.5。
优选在惰性气氛(例如氮气)中,可在有机溶剂存在下或不存在溶剂下,于30-150℃下,优选30-120℃下反应1-15小时。
可通过四羧酸化合物、二胺化合物与具有一个羟基的单胺化合物反应,制备式(5)的酰亚胺化合物。在式(5)中,m为0-20的整数,优选为0-10,更优选为0-5,最优选为1-5。
优选所述四羧酸化合物为芳族四羧酸或脂环族四羧酸、其二酐或与低级醇的酯。芳族四羧酸的实例有2,3,3′,4′-联苯四羧酸、3,3′,4,4′-联苯四羧酸、2,2′,3,3′-联苯四羧酸、3,3′,4,4′-二苯醚四羧酸、3,3′,4,4′-二苯基砜四羧酸、3,3′,4,4′-二苯甲酮四羧酸、2,2-双(3,4-二羧基苯基)六氟丙烷、1,2,4,5-苯四酸、1,4-双(3,4-二羧基苯基)苯、2,2-双[4-(3,4-二羧基苯氧基)苯基]丙烷、2,3,6,7-萘-四羧酸、1,2,5,6-萘四羧酸、1,2,4,5-萘四羧酸、1,4,5,8-萘四羧酸和1,1-双(2,3-二羧基苯基)乙烷。脂环族四羧酸的实例有环戊烷四羧酸、1,2,4,5-环己烷四羧酸和3-甲基-4-环己烯-1,2,4,5-四羧酸。更优选所述四羧酸为2,3,3′,4′-联苯四羧酸、3,3′,4,4′-二苯醚四羧酸、2,2′,3,3′-联苯四羧酸、其二酐及其与低级醇的酯。最优选使用二酐。
所述二胺化合物可为任何类型的二胺化合物。可使用芳族、脂环族或脂族二胺。芳族二胺的实例有具有一个苯环的芳族二胺,例如1,4-二氨基苯、1,3-二氨基苯、2,4-二氨基甲苯、1,4-二氨基-2,5-二卤代苯;具有两个苯环的芳族二胺,例如双(4-氨基苯基)醚、双(3-氨基苯基醚、双(3-氨基苯基)砜、双(4-氨基苯基)甲烷、双(3-氨基苯基)甲烷、双(4-氨基苯基)硫醚、双(3-氨基苯基)硫醚、2,2-双(4-氨基苯基)丙烷、2,2-双(3-氨基苯基)丙烷、2,2-双(4-氨基苯基)六氟丙烷、邻联二茴香胺、邻-甲苯胺和甲苯胺磺酸;具有三个苯环的芳族二胺,例如1,4-双(4-氨基苯氧基)苯、1,4-双(3-氨基苯氧基)苯、1,4-双(4-氨基苯基)苯、1,4-双(3-氨基苯基)苯、α,α′-双(4-氨基苯基)-1,4-二异丙基苯和α,α′-双(4-氨基苯基)-1,3-二异丙基苯;和具有四个苯环的芳族二胺,例如2,2-双[4-(4-氨基苯氧基)苯基]丙烷、2,2-双[4-(4-氨基苯氧基)苯基]六氟丙烷、2,2-双-[4-(4-氨基苯氧基)苯基]砜、4,4′-(4-氨基苯氧基)联苯、9,9-双(4-氨基苯基)芴和5,10-双(4-氨基苯基)蒽。脂环族二胺的实例有异佛尔酮二胺、降冰片烯二胺、1,2-二氨基环己烷、1,3-二氨基环己烷、1,4-二氨基环己烷、双(4-氨基环己基)甲烷和双(4-氨基环己基)甲烷。脂族二胺的实例有1,6-己二胺和二氨基十二烷。
优选使用脂环族二胺是由于所得到的改性的聚酰亚胺树脂充分溶解于溶剂中、耐热性高且与其他材料的粘附性好。优选所述脂环族二胺具有3-20个碳原子。
具有一个羟基的单胺化合物为在其分子结构中包含一个氨基和一个羟基的化合物。具有1-10个碳原子和一个羟基的脂族单胺的实例有氨基乙醇、氨基丙醇和氨基丁醇;具有3-20个碳原子和一个羟基的脂环族单胺的实例有氨基环己醇;具有6-20个碳原子和一个羟基的芳族单胺的实例有氨基苯酚、氨基甲酚、4-羟基-4′-氨基二苯醚、4-羟基-4′-氨基联苯、氨基苄醇和氨基苯乙醇。
可通过四羧酸化合物、二胺化合物和具有一个羟基的单胺化合物在有机溶剂中反应,进行聚合和酰亚胺化(imidation),进行制备式(5)的酰亚胺化合物的反应。胺化合物(包括二胺化合物和具有一个羟基的单胺化合物)的摩尔用量与四羧酸化合物的酸酐基团的摩尔量(或相邻两个羧基的量)基本相同。反应进行的温度为约100℃以下,优选为80℃以下,以制备在各末端具有羟基、具有酰胺-酸键的化合物,随后在加入酰亚胺化-促进剂后于约0℃-140℃低温,或在140℃-250℃高温下继续反应,使得进行脱水-酰亚胺化反应,得到在各末端具有羟基的酰亚胺化合物。在脱水-酰亚胺化反应过程中,可通过与甲苯或二甲苯共沸蒸馏除去缩合反应产生的水。
可用于制备在各末端具有羟基的酰亚胺化合物的有机溶剂的实例有酰胺溶剂,例如N,N-二甲基甲酰胺、N,N-二甲基乙酰胺、N-甲基-2-吡咯烷酮和N-甲基己内酰胺;含硫溶剂,例如二甲基亚砜、六甲基磷酰胺、二甲基砜、环丁砜和二甲基环丁砜;酚溶剂,例如甲酚、苯酚和二甲苯酚;二甘醇二甲醚溶剂,例如二甘醇二甲醚、三甘醇二甲醚和四甘醇二甲醚;酮溶剂,例如异佛尔酮、环己酮和3,3,5-三甲基环己酮;和其他有机溶剂,例如吡啶、乙二醇、二烷和四甲基脲。还可使用芳族烃溶剂,例如苯、甲苯或二甲苯。有机溶剂可单独使用或组合使用。
根据引入反应体系中的单胺化合物与二胺化合物的摩尔比率,制备的在各末端具有羟基的酰亚胺化合物可为单体(其中式(5)中的m为0)或低聚物(其中式(5)中的m为1以上)。产品可为单体和低聚物的混合物或多种低聚物的混合物。混合物可原样使用或在分离单体或各低聚物后使用,用于制造所需的聚酰亚胺树脂。
在有机溶剂中制备的在各末端具有羟基的酰亚胺化合物可原样使用用于制造所需的聚酰亚胺树脂。或者,可将酰亚胺化合物溶液浓缩或稀释,用于制造所需的聚酰亚胺树脂。或者,例如通过向酰亚胺化合物溶液中掺入非溶剂(例如水),可从溶液中分离酰亚胺化合物。可干燥分离出的酰亚胺化合物。干酰亚胺化合物可再次溶解于合适的有机极性溶剂中,得到酰亚胺化合物溶液。
可通过同时将所有的活性化合物(即二异氰酸酯化合物、含碳酸酯基的二醇化合物或含碳酸酯基的二醇化合物与含活性极性基团的二醇化合物的混合物和式(5)的酰亚胺化合物)溶解于有机溶剂中,进行制备本发明的聚酰亚胺树脂的反应。但是,如前所述,优选二异氰酸酯化合物首先与含碳酸酯基的二醇化合物或含碳酸酯基的二醇化合物与含活性极性基团的二醇化合物的混合物在有机溶剂中反应,制备具有上述式(4)的二价异氰酸酯化合物。
随后式(4)的二价异氰酸酯化合物与式(5)的酰亚胺化合物反应,制备所需的本发明的聚酰亚胺树脂。
用于制备改性的聚酰亚胺树脂的有机溶剂的实例与可用于制备在各末端具有羟基的酰亚胺化合物的那些溶剂相同。
对于每100重量份在各末端具有羟基的酰亚胺化合物,通常有机溶剂的用量为30-500重量份,优选为60-200重量份。
优选所得到的改性的聚酰亚胺树脂存在于有机溶剂中的浓度为3%重量以上,更优选为5-60%重量。聚酰亚胺树脂溶液的粘度(通过E型旋转粘度计,于25℃下测定)优选为1-10,000Pa·s,更优选为1-600Pa·s。
所得到的改性的聚酰亚胺树脂的数均分子量优选为3,000-50,000,更优选为4,000-40,000,最优选为4,000-30,000。
本发明的改性的聚酰亚胺树脂可与环氧化合物和有机溶剂混合,得到本发明的可固化的聚酰亚胺树脂组合物。每100重量份聚酰亚胺树脂,环氧化合物的用量优选为1-50重量份,更优选为2-40重量份,最优选为5-35重量份。本发明的可固化的聚酰亚胺树脂组合物还可包含1-50重量份(每100重量份聚酰亚胺树脂)异氰酸酯化合物。本发明的可固化的聚酰亚胺树脂组合物还可包含1-20重量份,优选1-15重量份,更优选1-10重量份(每100重量份聚酰亚胺树脂)在各末端具有羟基的聚碳酸酯化合物。掺入聚碳酸酯化合物有效赋予所得到的组合物对用于制造电子-电气装置的模塑材料(或密封材料)增加的粘附性。本发明的可固化的聚酰亚胺树脂组合物还可包含0.1-18重量份,优选0.3-15重量份,更优选0.5-10重量份(每100重量份改性的聚酰亚胺树脂)具有两个以上酚羟基的化合物。掺入具有两个以上酚羟基的化合物有效赋予所得到的组合物对用于制造电子-电气装置的各向异性导电材料增加的粘附性。
优选所述环氧化合物为液体或固体环氧树脂,环氧当量为100-4,000,分子量为300-10,000。可用于本发明的环氧化合物的实例有双酚A型或双酚F型环氧树脂,例如Epikote 806、Epikote 825、Epikote828、Epikote 1001、Epikote 1002、Epikote 1003、Epikote 1004、Epikote1055、Epikote 1004AF、Epikote 1007、Epikote 1009和Epikote 1010(均购自Japan Epoxy Resin Co.,Ltd.);具有三个以上官能团的环氧树脂,例如Epikote 152、Epikote 154、Epikote 180系列、Epikote 157系列、Epikote 1032系列(均购自Japan Epoxy Resin Co.,Ltd.);SUMIEPOXYELM 100(购自Sumitomo Chemical Industry Co.,Ltd.)、EHPE 3150(购自Daicel Chemical Industries,Ltd.)和MTO0163(购自Ciba-Geigy);末端环氧化的低聚物,例如HICAR ETBN 1300×40(购自UbeIndustries,Ltd.)和DENALEX R-45EPT(购自Nagase ChemteXCorporation);环氧化的聚丁二烯,例如POLYBUTADIENE E-1000-8、E-1800-6.5(购自Nippon Petrochemical Co.,Ltd.)和EPOLEADPB3600(购自Daicel Chemical Industries,Ltd.);和脂环族环氧树脂,例如CELLOXIDE 2021P、CELLOXIDE 2080、EPOLEAD GT400、EHPE(购自Daicel Chemical Industries,Ltd.)。
多价异氰酸酯化合物(可封端)的实例有BARNOCK D-500(封端的甲苯二异氰酸酯)、BARNOCK D-550(封端的1,6-亚己基二异氰酸酯),均购自Dai-Nippon Ink and Chemicals;TAKENATE B-830(封端的甲苯二异氰酸酯)、TAKENATE B-815N(封端的4,4′-亚甲基-双(环己基异氰酸酯))、TAKENATE B-842N(封端的1,3-双(异氰酸基甲基)环己烷)、TAKENATE B-846N(封端的1,3-双(异氰酸基甲基)环己烷)、TAKENATE 847N(封端的异佛尔酮二异氰酸酯)、TAKENATE B-882N(封端的1,6-亚己基二异氰酸酯),均购自Mitsui-Takeda ChemicalCo.,Ltd.;DURANATE MF-B60X(封端的1,6-亚己基二异氰酸酯)、DURANATE MF-K60X(封端的1,6-亚己基二异氰酸酯)、DURANATEME2-B80(封端的1,6-亚己基二异氰酸酯),均购自Asahi Kasei Co.;ELASTRON BN-P17(封端的4,4′-二苯基甲烷二异氰酸酯)、ELASTRON BN-04、ELASTRON BN-08、ELASTRON BN-44、ELASTRON BN-45(均为具有3-5个官能团的封端的聚氨酯改性的多异氰酸酯),均为含水乳液形式(封端的聚氨酯改性的多异氰酸酯可以干燥的粉末形式从含水溶液中分离),购自Dai-ichi Kogyo SeiyakuCo.,Ltd。
在各末端具有羟基的聚碳酸酯化合物的分子量优选为500-10,000,更优选为500-5,000。在各末端具有羟基的聚碳酸酯化合物的实例有ENATACOL UH-CARB、UD-CARB、UC-CARB,均购自Ube Industries,Ltd.;PLACCEL CD-PL、PLACCEL CH-H,均购自Daicel Company,Ltd.;和Kuraray Polyol C,购自Kuraray Co.,Ltd。在各末端具有羟基的聚碳酸酯化合物可单独使用或组合使用。
具有两个以上酚羟基的化合物的实例有氢醌、4,4′-二羟基联苯和苯酚树脂例如线形酚醛树脂和甲酚-线型酚醛树脂。苯酚树脂的实例有线形酚醛树脂树脂H-1、H-2、H-3、H-4和H-5;三苯酚甲烷型邻甲酚-线型酚醛树脂树脂MER-130和MEH-7500;四苯酚型的MET-7600;萘酚型的MEH-7700;苯酚芳烷基型的MEH-7800和MEH-7851;三苯酚型的R-3;和双酚-线型酚醛树脂型的MEP-6039和MEP 6309E;和液体线形酚醛树脂型的MEH-8000H、MEH-8005、MEH-8010、MEH-8015和MEH-82085。这些苯酚树脂购自MeiwaPlastic Industries,Ltd。
本发明的聚酰亚胺树脂组合物还可包含乙烯基树脂,例如聚乙烯基醚、聚乙烯醇缩乙醛和聚乙烯醇缩丁醛;丙烯酸类树脂,例如丙烯酸酯树脂和甲基丙烯酸酯树脂;和二醇,例如聚乙二醇、聚丙二醇和聚丁二醇。每100重量份改性的聚酰亚胺树脂,包含在聚酰亚胺树脂组合物中的这些添加剂可为0.1-50重量份。
优选本发明的聚酰亚胺树脂组合物还包含固化剂(例如固化催化剂),用于促进聚酰亚胺树脂与环氧化合物或封端的多价异氰酸酯化合物之间交联。每100重量份环氧化合物或封端的多价异氰酸酯化合物,包含的固化剂的量优选为0.01-25重量份,更优选为0.1-15重量份。所述固化剂可为咪唑化合物或叔胺化合物中的一种。咪唑化合物的实例有2-甲基咪唑、2-乙基-4-甲基咪唑、2-苯基咪唑、2-苯基-4-甲基咪唑和2,3-二氢-1H-吡咯并(pyroro)[1,2-a]苯并咪唑。叔胺化合物的实例有1,8-二氮杂双环[5.4.0]-7-十一碳烯(称为DBU)、N,N-二甲基苄胺、N,N,N′,N′-四甲基己二胺、三亚乙基二胺(TEDA)、2-二甲基氨基甲基苯酚(DMP-10)、2,4,6-三(二甲基氨基甲基)苯酚(DMP-30)、二吗啉代二乙基醚(DMDEE)、1,4-二甲基哌嗪和环己基二甲胺。
组成本发明的聚酰亚胺树脂组合物的溶剂的实例可为那些用于制备改性的聚酰亚胺树脂的方法中使用的溶剂。优选的实例有含氮原子的溶剂,例如N,N-二甲基乙酰胺、N,N-二乙基乙酰胺、N,N-二甲基甲酰胺、N,N-二乙基甲酰胺、N-甲基-2-吡咯烷酮、1,3-二甲基-2-咪唑啉酮和N-甲基己内酰胺;含硫原子的溶剂,例如二甲基亚砜、二乙基亚砜、二甲基砜、二乙基砜和六甲基磺酰胺(sulforamide);含氧原子的溶剂,包括酚类溶剂,例如甲酚、苯酚和二甲苯酚;二甘醇二甲醚溶剂,例如二甘醇二甲醚、三甘醇二甲醚和四甘醇二甲醚;酮溶剂,例如丙酮、苯乙酮、苯丙酮、环己酮和异佛尔酮;醚溶剂,例如乙二醇、二烷和四氢呋喃;和内酯溶剂,例如γ-丁内酯。最优选N-甲基-2-吡咯烷酮、二甲基亚砜、N,N-二甲基甲酰胺、N,N-二乙基甲酰胺、N,N-二甲基乙酰胺、N,N-二乙基乙酰胺、γ-丁内酯、三甘醇二甲醚和异佛尔酮。
优选所述有机溶剂的沸点为140-220℃,更优选高于180℃,最优选高于200℃。
优选的有机溶剂的实例有三甘醇二甲醚(沸点216℃)、γ-丁内酯(沸点204℃)和异佛尔酮(沸点213℃)。上述沸点范围内的有机溶剂的挥发性小,使得可容易地进行溶液组合物(即油墨组合物)的丝网印刷。由于在各末端具有羟基的含碳酸酯键的化合物(即式(6)的二醇化合物)和在各末端具有羟基的酰亚胺化合物(即式(5)的酰亚胺化合物)易溶于γ-丁内酯和异佛尔酮,因此更优选γ-丁内酯和异佛尔酮。此外,由于异佛尔酮几乎不吸水且沸点高、挥发性低,因此使用异佛尔酮作为溶剂的聚酰亚胺组合物溶液可方便地用于丝网印刷。
优选本发明的聚酰亚胺树脂组合物还包含精细填料。优选所述精细填料的平均直径为0.001-15μm,更优选为0.005-10μm。精细填料的实例有无机精细填料,例如二氧化硅超细粉、滑石粉、硫酸钡和云母;和有机精细填料,例如交联的NBR精细粉末。
每100重量份改性的聚酰亚胺树脂,精细填料的用量为5-150重量份,优选为10-125重量份。优选无机填料。特别优选二氧化硅超细粉与滑石粉、云母或硫酸钡的组合。在这种情况下,对于每100重量份改性的聚酰亚胺树脂,使用1-50重量份,优选5-40重量份二氧化硅超细粉和5-130重量份滑石粉、云母和硫酸钡中的至少一种。以这种方式加入精细填料可特别有效地赋予所得到的绝缘薄膜良好的可印性和绝缘特性。
每100重量份聚酰亚胺树脂,本发明的聚酰亚胺树脂组合物还可包含0.1-100重量份颜料,例如有色有机颜料或有色无机颜料。
每100重量份聚酰亚胺树脂,本发明的聚酰亚胺树脂组合物还可包含0.1-30重量份消泡剂和流平剂。
所述聚酰亚胺树脂组合物为溶液组合物形式。通过将改性的聚酰亚胺树脂、环氧化合物和其他任选的添加剂在有机溶剂中混合,可容易地制备溶液组合物。或者,可将环氧化合物和其他任选的添加剂掺入其中已存在制备好的聚酰亚胺树脂的反应溶液中。反应溶液可原样使用,或通过加入适当的有机溶剂稀释后使用。
本发明的溶液组合物(即聚酰亚胺树脂组合物)的溶液粘度通常为5-1,000Pa·s(25℃),优选为10-100Pa·s,更优选为10-60Pa·s,这是由于具有上述溶液粘度范围的溶液组合物可方便地在丝网印刷中用作油墨组合物,得到具有良好特性的固化的绝缘薄膜。
本发明的聚酰亚胺树脂组合物可有利地在装有芯片元件例如IC芯片的电子-电气装置上形成绝缘薄膜(即保护性薄膜)。
例如通过丝网印刷将聚酰亚胺树脂组合物涂布于排列在绝缘片材上具有布线图的导电金属薄膜上,形成3-60μm厚(干燥后的厚度)的树脂组合物层。随后将这样形成的树脂组合物层于50-100℃下加热5-60分钟以除去溶剂,随后于100-210℃,优选110-200℃下加热5-120分钟,优选10-60分钟,以固化所述树脂组合物,使得可制备弹性模量为10-500MPa的固化的聚酰亚胺树脂组合物薄膜(即绝缘薄膜)。这样制备的绝缘薄膜柔性高、弯曲性高、耐热性高、耐翘曲性高、耐焊接性高、耐化学物质性高、耐溶剂(例如丙酮、异丙醇、甲乙酮和N-甲基-2-吡咯烷酮)性高、与导电金属、底材和模塑材料的粘附性好以及电特性好。
本发明的聚酰亚胺树脂组合物的优势还在于可在较低温度(例如50-210℃,特别是60-160℃)下固化,得到具有令人满意的特性的绝缘薄膜。因此,本发明的聚酰亚胺树脂组合物可用作夹层粘合剂,将多层布线板的底材组合连接。
通过以下实施例来进一步描述本发明。
在以下实施例中,通过下述方法测定物理数据和其他性能。
[1H-NMR光谱]
在氘代二甲基亚砜或氘代氯仿中,通过核磁共振波谱仪(AL-300,购自JEOL,Ltd.)得到1H-NMR光谱。
[溶液粘度]
采用TV-20粘度计(购自Tohki Sangyo Co.,Ltd.),于25℃和10rpm(旋转)下测定溶液粘度。
[GPC]
采用LC-10(GPC柱KF-80Mx2,Kf-802,购自ShimazuCorporation,Ltd.),在四氢呋喃中测定数均分子量。使用聚苯乙烯作为标准物。
[拉伸模量]
将聚酰亚胺树脂组合物固化,得到厚度为约100μm的固化的片材。将固化的片材切成测条(宽:1cm,长:7cm)。将测条于25℃、50%RH和滑动横梁速度为50mm/分钟和卡盘间距为5cm下测定拉伸模量。
[评价绝缘性]
制备由聚酰亚胺薄膜(厚度:25μm)和铜薄膜(厚度:9μm)组成,其上形成20μm/20μm(line/space)梳形电路图的电路板。将改性的聚酰亚胺组合物涂布于电路图上,首先加热至80℃下保持30分钟,随后加热至120℃下保持90分钟,得到固化的绝缘薄膜。在高温-高湿条件(85℃,85%RH)下,将60V偏压施加于绝缘薄膜,100小时后测定电阻。
[评价固化的绝缘薄膜]
将聚酰亚胺树脂组合物涂布于电解铜薄膜(厚度:35μm)的光滑表面上,得到约50μm的涂布层。将已涂布的聚酰亚胺树脂组合物层首先加热至80℃下保持30分钟,随后加热至120℃下保持90分钟,得到约20μm厚的固化的绝缘薄膜。
随后用所得到的绝缘薄膜测试与密封材料的粘附性、弯曲性、耐焊接性和耐有机溶剂性。细节如下所述。
(1)与模塑材料的粘附性
将IC芯片模塑材料CEL-C-5020(密封材料,购自Hitachi ChemicalCo.,Ltd.)滴在固化的绝缘薄膜上,得到圆形层(厚度:约1mm,直径:约0.5cm)。随后将圆形层加热至150℃下保持1小时,使其固化。
将具有固化的模塑材料层的测试样手动弯曲,观察构成的各层是否有任何分离。如果分离的发生是由于绝缘薄膜中的内聚破坏或是发生在铜薄膜和绝缘薄膜之间,记为“合格”。其他的,记为“不合格”。
(2)弯曲性
将固化的绝缘薄膜反向弯曲,观察弯曲区域。如果未观察到变化,则记为“合格”,如果在弯曲区域有裂纹,则记为“不合格”。
(3)耐焊性
将松香蜡(SUNFLUX SF-270,购自Sanwa Chemical IndustryCo.,Ltd.)涂布于固化的绝缘薄膜上。随后将已涂布的绝缘薄膜与焊接浴(加热至260℃)接触10秒。观察这样处理过的绝缘薄膜。如果在绝缘薄膜上未观察到变化,则记为“好”。如果在绝缘薄膜上观察到一些粗糙的表面,则记为“合格”。如果绝缘薄膜熔融或变形,则记为“不合格”。
(4)耐溶剂性
于25℃下,将铜薄膜上的绝缘薄膜在丙酮中浸渍1小时,在300-500g负载和摩擦角45°条件下,使用其中吸收丙酮的棉棒涂布器摩擦绝缘薄膜的游离表面,直至暴露铜表面。记录直至暴露铜表面的摩擦次数。
[评价耐高温-高湿性-加压蒸煮测试(PCT)]
将改性的聚酰亚胺树脂组合物涂布于电解铜薄膜的粗糙表面(厚度:35μm)上,得到约50μm厚的组合物薄膜。将该组合物薄膜首先加热至80℃下保持30分钟,随后加热至160℃下保持60分钟,得到20μm厚的绝缘薄膜。将该绝缘薄膜进行加压蒸煮测试(121℃,100%RH,100小时)。随后观察这样处理过的绝缘薄膜。未变化的绝缘薄膜记为“合格”,而有颜色变化的绝缘薄膜记为“不合格”。
用于各实施例各化合物、环氧树脂、固化剂和添加剂如下所述。
[四羧酸化合物]
2,3,3′,4′-联苯四羧酸二酐
3,3′,4,4′-二苯基砜四羧酸二酐
[二胺化合物]
异佛尔酮二胺
[氨基醇]
3-氨基丙醇
[具有活性极性基团的二醇]
2,2-双(羟甲基)丙酸
[在各末端具有羟基的聚碳酸酯]
KURARAY POLYOL C-2015(平均分子量:2,000,购自KurarayCo.,Ltd.)
[二异氰酸酯化合物]
4,4′-二苯基甲烷二异氰酸酯
[溶剂]
二甲基乙酰胺
甲苯
异佛尔酮
γ-丁内酯
[环氧树脂]
EPOLEAD PB 3600(环氧当量:194,购自Daicel Corporation,Ltd.)
CELLOXIDE 2021P(环氧当量:126,购自Daicel ChemicalIndustries,Ltd.)
[封端的多异氰酸酯化合物]
BARNOCK D-550(封端的1,6-亚己基二异氰酸酯,封端剂:甲乙酮肟,购自Dai-Nippon Ink and Chemicals)
TAKENATE B 830(购自Mitsui-Takeda Chemical Company,Ltd.)
DURANATE ME 20-B80E(购自Asahi Kasei Co.)
[酚醛树脂]
H-1(线形酚醛树脂,购自Meiwa Plastic Industries,Ltd.)
H-3(线形酚醛树脂,购自Meiwa Plastic Industries,Ltd.)
MEH-7851(线形酚醛树脂,购自Meiwa Plastic Industries,Ltd.)
[固化剂]
2-乙基-4-甲基咪唑
1,8-二氮杂双环[5.4.0]-7-十一碳烯
[二氧化硅超细粉]
AEROSIL 50(BET表面积:50m2/g,购自Nippon Aerosil Co.,Ltd.)
AEROSIL 130(BET表面积:130m2/g,购自Nippon Aerosil Co.,Ltd.)
AEROSIL R972(BET表面积:110m2/g,购自Nippon Aerosil Co.,Ltd.)
[滑石粉]
SG 200(平均大小:1.0μm,购自Japan Talc Co.,Ltd.)
SG 95(购自Japan Talc Co.,Ltd.)
[合成实施例1-制备在各末端具有羟基的酰亚胺化合物A]
在配备氮气入口、迪安-斯达克接收器和冷却器的500ml体积的可拆式玻璃烧瓶中放置58.8g(0.20mol)2,3,3′,4′-联苯四羧酸二酐、30g(0.40mol)3-氨基丙醇和200ml二甲基乙酰胺。在氮气气氛下将各化合物于100℃下搅拌1小时。向该混合物中加入50ml甲苯,随后将所得到的混合物于180℃下加热4小时,通过与甲苯一起共沸蒸馏将在酰亚胺化反应过程中产生的水除去。将反应混合物倒入2L水中,随后过滤收集所得到的沉淀物,水洗,减压干燥,制得43.16g粉末形式的酰亚胺化合物。该酰亚胺化合物的1H-NMR光谱示于图1。由该1H-NMR光谱证实,该酰亚胺化合物为在各末端具有羟基的酰亚胺化合物(式(5)中的m为0)。
[合成实施例2-制备在各末端具有羟基的酰亚胺化合物B]
在配备氮气入口、迪安-斯达克接收器和冷却器的500ml体积的可拆式玻璃烧瓶中放置58.8g(0.20mol)2,3,3′,4′-联苯四羧酸二酐、17.0g(0.10mol)异佛尔酮二胺、15.0g(0.20mol)3-氨基丙醇和200ml二甲基乙酰胺。在氮气气氛下将各化合物于100℃下搅拌1小时。向该混合物中加入50ml甲苯,随后将所得到的混合物于180℃下加热4小时,通过与甲苯一起共沸蒸馏将在酰亚胺化反应过程中产生的水除去。将反应混合物倒入2L水中,随后过滤收集所得到的沉淀物,水洗,减压干燥,制得78.8g粉末形式的酰亚胺化合物。该酰亚胺化合物的1H-NMR光谱示于图2。由图2的1H-NMR光谱观察到的归属于丙醇的2-位亚甲基部分的峰(1.65-1.85ppm)和归属于联苯四羧酸酰亚胺的亚苯基部分的峰(7.50-8.20ppm)的积分强度的比率证实,该酰亚胺化合物为在各末端具有羟基的酰亚胺化合物(式(5)中的m为1(平均)),也就是说,在各末端具有羟基的酰亚胺低聚物。
[合成实施例3-制备在各末端具有羟基的酰亚胺化合物C]
在配备氮气入口、迪安-斯达克接收器和冷却器的500ml体积的可拆式玻璃烧瓶中放置58.8g(0.20mol)2,3,3′,4′-联苯四羧酸二酐、25.55g(0.15mol)异佛尔酮二胺、7.51g(0.1mol)3-氨基丙醇和200ml二甲基乙酰胺。在氮气气氛下将各化合物于100℃下搅拌1小时。向该混合物中加入50ml甲苯,随后将所得到的混合物于180℃下加热4小时,通过与甲苯一起共沸蒸馏将在酰亚胺化反应过程中产生的水除去。将反应混合物倒入2L水中,随后过滤收集所得到的沉淀物,水洗,减压干燥,制得72.0g粉末形式的酰亚胺化合物。该酰亚胺化合物的1H-NMR光谱示于图3。由图3的1H-NMR光谱观察到的归属于丙醇的2-位亚甲基部分的峰(1.65-1.85ppm)和归属于联苯四羧酸酰亚胺的亚苯基部分的峰(7.50-8.20ppm)的积分强度的比率证实,该酰亚胺化合物为在各末端具有羟基的酰亚胺化合物(式(5)中的m为3(平均)),也就是说,在各末端具有羟基的酰亚胺低聚物。
[实施例1]
(1)制备改性的聚酰亚胺树脂
在配备氮气入口的300ml体积的玻璃烧瓶中放置29.94g(15.00mmol)KURARAY POLYOL C-2015、1.01g(7.50mmol)2,2-双(羟甲基)丙酸、8.53g(34.09mmol)4,4′-二苯基甲烷二异氰酸酯和13.7g异佛尔酮。在氮气气氛下将各化合物于80℃下搅拌1.5小时。向该混合物中加入6.13g(15.00mmol)在合成实施例1中制备的酰亚胺化合物A和31.9g异佛尔酮。随后将所得到的混合物于80℃下搅拌1.5小时,得到聚酰亚胺树脂溶液。这样制备的聚酰亚胺树脂溶液的聚合物浓度为50%重量,溶液粘度为61Pa·s。通过GPC测定该聚酰亚胺树脂的数均分子量为26,000。随后使用异佛尔酮稀释该聚酰亚胺树脂溶液,得到聚合物浓度为40%重量的透明稳定的聚酰亚胺树脂溶液。
(2)评价改性的聚酰亚胺树脂
在玻璃容器中放置如上制得的聚酰亚胺树脂溶液、10重量份(每100重量份聚酰亚胺树脂)环氧树脂(PB 3600)、20重量份封端的异氰酸酯(D 550)和0.8重量份胺固化剂(2E4MZ)。将各化合物搅拌并均匀混合。向所得到的溶液中加入10重量份AEROSIL 130和5重量份AEROSIL 50,随后将所得到的混合物搅拌并捏合,得到聚酰亚胺树脂组合物。随后通过旋转粘度计法测定该聚酰亚胺树脂组合物的粘度。
评价由所得到的聚酰亚胺树脂组合物制备的薄膜的拉伸模量、电绝缘性、与模塑材料的粘附性、弯曲性、耐焊性、耐溶剂性和PCT性能。结果见述于表1。
[实施例2]
(1)制备改性的聚酰亚胺树脂
在配备氮气入口的300ml体积的玻璃烧瓶中放置10.0g(5.01mmol)KURARAY POLYOL C-2015、0.168g(1.25mmol)2,2-双(羟甲基)丙酸和2.56g(10.25mmol)4,4′-二苯基甲烷二异氰酸酯。在氮气气氛下将各化合物于80℃下搅拌1.5小时。向该混合物中加入4.19g(5.01mmol)在合成实施例2中制备的酰亚胺化合物B和25.38g异佛尔酮。随后将所得到的混合物于80℃下搅拌1.5小时,得到透明稳定的聚酰亚胺树脂溶液。这样制备的聚酰亚胺树脂溶液的聚合物浓度为40%重量,溶液粘度为24Pa·s。通过GPC测定该聚酰亚胺树脂的数均分子量为6,400。
(2)评价改性的聚酰亚胺树脂
重复实施例1-(2)的方法,制备薄膜并进行各种评价。结果见述于表1。
[实施例3-制备改性的聚酰亚胺树脂]
在配备氮气入口的300ml体积的玻璃烧瓶中放置10.0g(5.01mmol)KURARAY POLYOL C-2015、0.336g(2.51mmol)2,2-双(羟甲基)丙酸和2.85g(11.39mmol)4,4′-二苯基甲烷二异氰酸酯。在氮气气氛下将各化合物于80℃下搅拌1.5小时。向该混合物中加入4.19g(5.01mmol)在合成实施例2中制备的酰亚胺化合物B和26.07g异佛尔酮。随后将所得到的混合物于80℃下搅拌1.5小时,得到透明稳定的聚酰亚胺树脂溶液。这样制备的聚酰亚胺树脂溶液的聚合物浓度为40%重量,溶液粘度为29Pa·s。通过GPC测定该聚酰亚胺树脂的数均分子量为6,500。
(2)评价改性的聚酰亚胺树脂
重复实施例1-(2)的方法,制备薄膜并进行各种评价。结果见述于表1。
[实施例4-制备改性的聚酰亚胺树脂]
在配备氮气入口的300ml体积的玻璃烧瓶中放置50.00g(25mmol)KURARAY POLYOL C-2015、3.35g(25mmol)2,2-双(羟甲基)丙酸、15.64g(62.5mmol)4,4′-二苯基甲烷二异氰酸酯和69.76g γ-丁内酯。在氮气气氛下将各化合物于60℃下搅拌3.5小时。向该混合物中加入20.92g(25mmol)在合成实施例2中制备的酰亚胺化合物B和20.92gγ-丁内酯。随后将所得到的混合物于80℃下搅拌10小时,得到聚酰亚胺溶液。这样制备的聚酰亚胺树脂溶液的聚合物浓度为55%重量,溶液粘度为490Pa·s。通过GPC测定该聚酰亚胺树脂的数均分子量为6,800。
(2)评价改性的聚酰亚胺树脂
在玻璃容器中放置如上制得的聚酰亚胺树脂溶液、10重量份(每100重量份聚酰亚胺树脂)环氧树脂(CELLOXIDE 2021P)、30重量份封端的异氰酸酯(ME 20-B)、15重量份TAKENATE B830、10重量份酚醛树脂(MEH-7851)和1重量份固化剂(DBU)。将各化合物搅拌并均匀混合。向所得到的溶液中加入7重量份AEROSIL R972和5重量份滑石粉(SG 2000),随后将所得到的混合物搅拌并捏合,得到聚酰亚胺树脂组合物。随后通过旋转粘度计法测定该聚酰亚胺树脂组合物的粘度。
采用与实施例1-(2)相同的方式评价由所得到的聚酰亚胺树脂组合物制备的薄膜。结果见述于表1。
[实施例5]
(1)制备改性的聚酰亚胺树脂
在配备氮气入口的300ml体积的玻璃烧瓶中放置25.00g(12.5mmol)KURARAY POLYOL C-2015、0.43g(3.15mmol)2,2-双(羟甲基)丙酸、6.38g(25.5mmol)4,4′-二苯基甲烷二异氰酸酯和31.8gγ-丁内酯。在氮气气氛下将各化合物于60℃下搅拌3.5小时。向该混合物中加入38.94g(23mmol)在合成实施例3中制备的酰亚胺化合物C和58.3gγ-丁内酯。随后将所得到的混合物于80℃下搅拌10小时。这样制备的聚酰亚胺树脂溶液的聚合物浓度为44%重量,溶液粘度为31Pa·s。通过GPC测定该聚酰亚胺树脂的数均分子量为5,200。
(2)评价改性的聚酰亚胺树脂
在玻璃容器中放置如上制得的聚酰亚胺树脂溶液、10重量份(每100重量份聚酰亚胺树脂)环氧树脂(EPOLEAD PB3600)、30重量份封端的异氰酸酯(BARNOCK D-550)、15重量份TAKENATE B830、10重量份酚醛树脂(H-1)和0.8重量份的固化剂(2E4MZ)。将各化合物搅拌并均匀混合。向所得到的溶液中加入7重量份AEROSIL R972和5重量份滑石粉(SG 95),随后将所得到的混合物搅拌并捏合,得到聚酰亚胺树脂组合物。随后通过旋转粘度计法测定该聚酰亚胺树脂组合物的粘度。
采用与实施例1-(2)相同的方式评价由所得到的聚酰亚胺树脂组合物制备的薄膜。结果见述于表1。
[比较实施例1-JP-A-2002-145981的实施例1]
(1)制备改性的聚酰亚胺树脂
在配备氮气入口的5升体积的玻璃烧瓶中放置1000.0g 1,6-己二醇型的聚碳酸酯二醇化合物、250.27g 4,4′-二苯基甲烷二异氰酸酯和833.51gγ-丁内酯,随后将该混合物加热至140℃。将该混合物于140℃下保持5小时进行反应。向该反应混合物中加入358.29g 3,3′,4,4′-二苯基砜四羧酸二酐、125.14g 4,4′-二苯基甲烷二异氰酸酯和584.97gγ-丁内酯,随后将该混合物加热至160℃。将该混合物于160℃下保持5小时进行反应,得到改性的聚酰亚胺溶液。粘度为400Pa·s。
所得到的聚酰亚胺溶液稍微混浊,在1天内变成凝胶溶液。
表1
实施例 | 粘度(Pa.s) | 弹性模量 | 电绝缘性(Ω) |
实施例1 | 25 | 14 | 6×10<sup>10</sup> |
实施例2 | 35 | 134 | 1×10<sup>11</sup> |
实施例3 | 37 | 220 | 1×10<sup>11</sup> |
实施例4 | 48 | 430 | 3×10<sup>10</sup> |
实施例5 | 49 | 710 | 1×10<sup>11</sup> |
评论:在与模塑材料的粘附性、弯曲性、耐焊性、耐有机溶剂性(>50)和PCT测试中,所有的改性的聚酰亚胺树脂性能良好(即合格)。
[实施例6]
重复实施例1-(1)的方法,不同之处在于不使用2,2-双(羟甲基)丙酸,且KURARAY POLYOL C-2015的用量为22.5mmol,得到聚酰亚胺树脂溶液。这样制备的聚酰亚胺树脂溶液透明且稳定。
Claims (10)
2.权利要求1的聚酰亚胺树脂,其中t为1-100的整数。
3.权利要求1的聚酰亚胺树脂,其中A为具有2-30个碳原子的二价脂族或芳族烃基。
4.权利要求1的聚酰亚胺树脂,其中所述二醇化合物的活性极性基团为羧基或酚羟基。
5.权利要求1的聚酰亚胺树脂,其中所述四羧酸化合物为芳族四羧酸二酐。
6.权利要求1的聚酰亚胺树脂,其中所述二胺化合物为芳族或脂族二胺。
7.权利要求1的聚酰亚胺树脂,其中s和t满足以下条件:
t/s=0.1-10
(s+t)/p=0.5-2.5
其中p为所述二异氰酸酯化合物的摩尔量。
9.一种可固化的聚酰亚胺树脂组合物,所述组合物包含100重量份权利要求1的聚酰亚胺树脂、1-50重量份环氧化合物和/或1-50重量份异氰酸酯化合物和有机溶剂。
10.一种固化的绝缘薄膜,所述薄膜通过加热所述聚酰亚胺树脂组合物的溶液薄膜制造,所述组合物包含100重量份权利要求1的聚酰亚胺树脂、1-50重量份环氧化合物和/或1-50重量份异氰酸酯化合物和有机溶剂。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005091908 | 2005-03-28 | ||
JP091908/2005 | 2005-03-28 | ||
PCT/JP2006/307016 WO2006104243A1 (en) | 2005-03-28 | 2006-03-28 | Polyimide resin and curable resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101151292A CN101151292A (zh) | 2008-03-26 |
CN101151292B true CN101151292B (zh) | 2010-09-29 |
Family
ID=37053492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006800104555A Expired - Fee Related CN101151292B (zh) | 2005-03-28 | 2006-03-28 | 聚酰亚胺树脂和可固化的树脂组合物 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8188209B2 (zh) |
JP (1) | JP5135698B2 (zh) |
KR (1) | KR101271989B1 (zh) |
CN (1) | CN101151292B (zh) |
TW (1) | TWI389936B (zh) |
WO (1) | WO2006104243A1 (zh) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5228320B2 (ja) * | 2006-12-13 | 2013-07-03 | 住友ベークライト株式会社 | 樹脂組成物、支持基材付き絶縁材およびフレキシブルプリント回路板用金属張積層板 |
CN101657482B (zh) * | 2007-04-19 | 2014-04-16 | Kaneka株式会社 | 新型聚酰亚胺前体组合物及其利用 |
JP5303860B2 (ja) * | 2007-05-10 | 2013-10-02 | Dic株式会社 | 熱硬化性ポリイミド樹脂組成物 |
TWI453253B (zh) * | 2007-10-18 | 2014-09-21 | Ajinomoto Kk | Resin composition |
WO2009084656A1 (ja) * | 2007-12-28 | 2009-07-09 | Ube Industries, Ltd. | 耐燃性ポリウレタンイミド樹脂、その樹脂組成物および硬化膜 |
KR101581387B1 (ko) * | 2008-06-02 | 2015-12-30 | 가부시키가이샤 가네카 | 신규한 수지 조성물 및 그 이용 |
JP5621190B2 (ja) * | 2008-12-15 | 2014-11-05 | 宇部興産株式会社 | 変性ポリイミド樹脂組成物 |
WO2010071107A1 (ja) * | 2008-12-15 | 2010-06-24 | 宇部興産株式会社 | 熱硬化性変性ポリイミド樹脂組成物 |
CN102349180B (zh) * | 2009-03-31 | 2014-04-09 | 宇部兴产株式会社 | 电极用粘合剂树脂前体溶液组合物 |
JP5755401B2 (ja) * | 2009-04-30 | 2015-07-29 | 株式会社ピーアイ技術研究所 | 変性ポリイミドの製造方法及び変性ポリイミド |
JP5515394B2 (ja) * | 2009-04-30 | 2014-06-11 | 株式会社ピーアイ技術研究所 | 感光性変性ポリイミド樹脂組成物及びその用途 |
CN102471460B (zh) * | 2009-07-06 | 2015-10-21 | 昭和电工株式会社 | 布线板的保护膜用热固性组合物 |
JP5720088B2 (ja) * | 2009-09-16 | 2015-05-20 | 宇部興産株式会社 | 変性ウレタン樹脂硬化性組成物、及びその硬化物 |
TW201120081A (en) * | 2009-09-30 | 2011-06-16 | Ube Industries | Denatured urethane resin hardening composition and hardened matter thereof |
JP5782764B2 (ja) * | 2010-03-26 | 2015-09-24 | 宇部興産株式会社 | 変性ポリイミド樹脂の製造方法 |
CN102858848B (zh) * | 2010-04-20 | 2014-11-26 | 三菱瓦斯化学株式会社 | 聚酰胺化合物 |
KR101775570B1 (ko) | 2010-12-20 | 2017-09-07 | 삼성전자주식회사 | 폴리이미드 전구체 조성물, 폴리이미드의 제조 방법, 상기 제조 방법에 따라 제조한 폴리이미드 및 상기 폴리이미드를 포함하는 필름 |
WO2012098734A1 (ja) * | 2011-01-18 | 2012-07-26 | 旭化成イーマテリアルズ株式会社 | 樹脂組成物、硬化物、樹脂フィルム及び配線板 |
JP6006716B2 (ja) | 2011-03-03 | 2016-10-12 | 株式会社カネカ | 新規な絶縁膜及び絶縁膜付きプリント配線板 |
WO2012165457A1 (ja) * | 2011-05-31 | 2012-12-06 | 東洋紡株式会社 | カルボキシル基含有ポリイミド、熱硬化性樹脂組成物及びフレキシブル金属張積層体 |
JP5849452B2 (ja) * | 2011-06-17 | 2016-01-27 | 宇部興産株式会社 | 電極用バインダー樹脂組成物、電極合剤ペースト、及び電極 |
EP2794716B1 (en) | 2011-12-19 | 2017-02-08 | DuPont Teijin Films U.S. Limited Partnership | Copolyesterimides of poly(alkylene naphthalate)s having high glass transition temperature and film made therefrom |
KR102001704B1 (ko) * | 2011-12-21 | 2019-07-18 | 듀폰 테이진 필름즈 유.에스. 리미티드 파트너쉽 | 높은 유리 전이 온도를 갖는 폴리(알킬렌 테레프탈레이트)의 코폴리에스테르이미드 및 이로부터 제조된 필름 |
JP5578192B2 (ja) * | 2012-04-20 | 2014-08-27 | 宇部興産株式会社 | 変性ポリイミド樹脂組成物 |
WO2013183293A1 (ja) * | 2012-06-07 | 2013-12-12 | 三井化学株式会社 | ポリイミド樹脂組成物、フィルム、接着剤、及び部品 |
KR101586812B1 (ko) * | 2013-04-12 | 2016-01-26 | 주식회사 아모그린텍 | 연성인쇄회로기판의 제조방법 및 이에 의해 제조된 연성인쇄회로기판 |
CN105265029B (zh) * | 2013-04-30 | 2018-02-02 | 阿莫绿色技术有限公司 | 柔性印刷电路板及其制造方法 |
GB201310837D0 (en) | 2013-06-18 | 2013-07-31 | Dupont Teijin Films Us Ltd | Polyester film -IV |
KR102079256B1 (ko) | 2013-09-13 | 2020-02-20 | 삼성디스플레이 주식회사 | 표시장치 및 이의 제조방법 |
GB201317705D0 (en) | 2013-10-07 | 2013-11-20 | Dupont Teijin Films Us Ltd | Copolyesters |
GB201411044D0 (en) | 2014-06-20 | 2014-08-06 | Dupont Teijin Films Us Ltd | Copolyestermides and films made therefrom |
JP6320340B2 (ja) * | 2015-03-31 | 2018-05-09 | 富士フイルム株式会社 | 磁気記録媒体および磁気信号再生装置 |
JPWO2017085797A1 (ja) * | 2015-11-18 | 2018-07-12 | 株式会社日立製作所 | 静止誘導電器の鉄心接合構造及び鉄心接合方法 |
CN108368336B (zh) | 2015-12-25 | 2021-09-10 | 日保丽公司 | 固化性组合物、固化物、外涂膜、覆盖柔性配线板及其制造方法 |
CN109071954B (zh) * | 2016-04-22 | 2021-11-02 | 日保丽公司 | 固化性组合物、使用该组合物的固化膜及外涂膜 |
JP6769425B2 (ja) * | 2017-11-21 | 2020-10-14 | 三菱マテリアル株式会社 | 絶縁皮膜形成用樹脂、ワニス、電着液、絶縁導体の製造方法 |
EP4321516A1 (en) * | 2021-04-09 | 2024-02-14 | Mitsubishi Gas Chemical Company, Inc. | Bisimide phenol compound |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001240650A (ja) * | 2000-03-01 | 2001-09-04 | Ube Ind Ltd | ポリイミド系絶縁膜用組成物、絶縁膜および絶縁膜の形成法 |
JP2002145981A (ja) * | 2000-11-07 | 2002-05-22 | Hitachi Chem Co Ltd | ポリイミド樹脂組成物及び被膜形成材 |
JP2003335944A (ja) * | 2002-05-21 | 2003-11-28 | Hitachi Chem Co Ltd | ポリイミド樹脂ペースト及びそれを含む被膜形成材料 |
JP2004211064A (ja) * | 2002-12-16 | 2004-07-29 | Ube Ind Ltd | ポリイミドシロキサン絶縁膜用組成物、絶縁膜、および、絶縁膜の形成方法 |
JP2005002192A (ja) * | 2003-06-11 | 2005-01-06 | Hitachi Chem Co Ltd | ポリイミド樹脂ペースト及びそれを含む被膜形成材料 |
JP2005036025A (ja) * | 2003-07-15 | 2005-02-10 | Hitachi Chem Co Ltd | ポリイミド樹脂組成物、それを用いた被膜形成材料、および電子部品 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5097010A (en) * | 1990-02-05 | 1992-03-17 | Battelle Memorial Institute | Thermally-reversible isocyanate polymers |
JPH07330856A (ja) * | 1994-06-10 | 1995-12-19 | Sekisui Chem Co Ltd | 熱可塑性ポリウレタン及びその製造方法 |
JP3243963B2 (ja) * | 1995-03-17 | 2002-01-07 | 宇部興産株式会社 | ポリイミドシロキサン組成物 |
MXPA04000820A (es) * | 2001-07-27 | 2004-05-21 | Merquinsa Mercados Quimicos S | Termoplastico de poliuretano ionomerico. |
JP4218282B2 (ja) * | 2002-08-21 | 2009-02-04 | 宇部興産株式会社 | ポリイミドシロキサン系絶縁膜用組成物、絶縁膜、および、絶縁膜の形成方法 |
JP4650176B2 (ja) * | 2004-09-10 | 2011-03-16 | 宇部興産株式会社 | ポリブタジエンを含んだ変性ポリイミド樹脂、その組成物及び硬化絶縁膜 |
-
2006
- 2006-03-28 TW TW095110914A patent/TWI389936B/zh not_active IP Right Cessation
- 2006-03-28 KR KR1020077023932A patent/KR101271989B1/ko not_active IP Right Cessation
- 2006-03-28 JP JP2006088251A patent/JP5135698B2/ja active Active
- 2006-03-28 US US11/884,348 patent/US8188209B2/en not_active Expired - Fee Related
- 2006-03-28 WO PCT/JP2006/307016 patent/WO2006104243A1/en active Application Filing
- 2006-03-28 CN CN2006800104555A patent/CN101151292B/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001240650A (ja) * | 2000-03-01 | 2001-09-04 | Ube Ind Ltd | ポリイミド系絶縁膜用組成物、絶縁膜および絶縁膜の形成法 |
JP2002145981A (ja) * | 2000-11-07 | 2002-05-22 | Hitachi Chem Co Ltd | ポリイミド樹脂組成物及び被膜形成材 |
JP2003335944A (ja) * | 2002-05-21 | 2003-11-28 | Hitachi Chem Co Ltd | ポリイミド樹脂ペースト及びそれを含む被膜形成材料 |
JP2004211064A (ja) * | 2002-12-16 | 2004-07-29 | Ube Ind Ltd | ポリイミドシロキサン絶縁膜用組成物、絶縁膜、および、絶縁膜の形成方法 |
JP2005002192A (ja) * | 2003-06-11 | 2005-01-06 | Hitachi Chem Co Ltd | ポリイミド樹脂ペースト及びそれを含む被膜形成材料 |
JP2005036025A (ja) * | 2003-07-15 | 2005-02-10 | Hitachi Chem Co Ltd | ポリイミド樹脂組成物、それを用いた被膜形成材料、および電子部品 |
Non-Patent Citations (2)
Title |
---|
JP 2005002192 A,全文. |
JP平8-253677(A) 1996.10.01 |
Also Published As
Publication number | Publication date |
---|---|
CN101151292A (zh) | 2008-03-26 |
TW200700463A (en) | 2007-01-01 |
KR20070116259A (ko) | 2007-12-07 |
US20100113689A1 (en) | 2010-05-06 |
US8188209B2 (en) | 2012-05-29 |
JP5135698B2 (ja) | 2013-02-06 |
TWI389936B (zh) | 2013-03-21 |
WO2006104243A1 (en) | 2006-10-05 |
KR101271989B1 (ko) | 2013-06-05 |
JP2006307183A (ja) | 2006-11-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101151292B (zh) | 聚酰亚胺树脂和可固化的树脂组合物 | |
CN1980970B (zh) | 改性聚酰亚胺树脂和可固化的树脂组合物 | |
JP4650176B2 (ja) | ポリブタジエンを含んだ変性ポリイミド樹脂、その組成物及び硬化絶縁膜 | |
JP4016226B2 (ja) | 変成ポリイミド樹脂及びこれを含有する熱硬化性樹脂組成物 | |
CN102459417B (zh) | 改性聚酰亚胺的制备方法及改性聚酰亚胺 | |
EP2159247B1 (en) | Solvent-free polymide silicone resin compositions and cured products thereof | |
KR101317259B1 (ko) | 배선판의 보호막용 열경화성 조성물 | |
JP4211569B2 (ja) | ポリイミドシロキサン絶縁膜用組成物、絶縁膜、および、絶縁膜の形成方法 | |
KR100428875B1 (ko) | 폴리이미드계 절연막용 조성물, 절연막 및 절연막 형성방법 | |
CN100569857C (zh) | 聚酰亚胺硅氧烷溶液组合物 | |
EP1496078B1 (en) | Polyamideimide resin, method for producing polyamideimide resin, polyamideimide resin composition containing the same, film-forming material and adhesive for electronic parts made thereof | |
TW200418922A (en) | Electronic device packaging and curable resin composition | |
GB2205571A (en) | Polyamide-imide resin pastes | |
JP4622480B2 (ja) | ポリイミドシロキサン絶縁膜用組成物、絶縁膜、および、絶縁膜の形成方法 | |
JPH11246760A (ja) | ポリアミドイミド樹脂ペースト及びそれを含む被膜形成材料 | |
JP2897186B2 (ja) | ポリアミドイミド重合体の製造法 | |
JP4872335B2 (ja) | 配線基板の実装方法 | |
JPH10265670A (ja) | ポリアミドイミド樹脂組成物及び耐熱性塗料 | |
JP4915400B2 (ja) | 電子部品の実装方法 | |
JPH08208788A (ja) | ポリカルボジイミド共重合体及びその製造方法 | |
JPH1112500A (ja) | 変性ポリアミドイミド樹脂ペースト及びこれを用いた電子部品 | |
KR20090053929A (ko) | 수지 조성물 및 그를 포함하는 피막 형성 재료 | |
JPH0543756B2 (zh) | ||
JPH0476078A (ja) | ポリパラバン酸コーティング剤 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100929 Termination date: 20180328 |