CN100440496C - 无焊剂倒装芯片互连 - Google Patents

无焊剂倒装芯片互连 Download PDF

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Publication number
CN100440496C
CN100440496C CNB028109333A CN02810933A CN100440496C CN 100440496 C CN100440496 C CN 100440496C CN B028109333 A CNB028109333 A CN B028109333A CN 02810933 A CN02810933 A CN 02810933A CN 100440496 C CN100440496 C CN 100440496C
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China
Prior art keywords
temperature
metal
chip
substrate
bumps
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Expired - Fee Related
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CNB028109333A
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English (en)
Chinese (zh)
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CN1513206A (zh
Inventor
J·库波塔
K·塔卡哈施
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Intel Corp
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Intel Corp
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Publication of CN1513206A publication Critical patent/CN1513206A/zh
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Publication of CN100440496C publication Critical patent/CN100440496C/zh
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
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    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes) consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Coils Or Transformers For Communication (AREA)
CNB028109333A 2001-03-28 2002-02-21 无焊剂倒装芯片互连 Expired - Fee Related CN100440496C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/821,331 US6495397B2 (en) 2001-03-28 2001-03-28 Fluxless flip chip interconnection
US09/821,331 2001-03-28

Publications (2)

Publication Number Publication Date
CN1513206A CN1513206A (zh) 2004-07-14
CN100440496C true CN100440496C (zh) 2008-12-03

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CNB028109333A Expired - Fee Related CN100440496C (zh) 2001-03-28 2002-02-21 无焊剂倒装芯片互连

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US (1) US6495397B2 (enExample)
EP (1) EP1386356B1 (enExample)
JP (1) JP2005500672A (enExample)
KR (1) KR100555354B1 (enExample)
CN (1) CN100440496C (enExample)
AT (1) ATE360888T1 (enExample)
AU (1) AU2002245476A1 (enExample)
DE (1) DE60219779T2 (enExample)
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DE60219779D1 (de) 2007-06-06
KR20040055734A (ko) 2004-06-26
EP1386356B1 (en) 2007-04-25
HK1061741A1 (en) 2004-09-30
WO2002080271A2 (en) 2002-10-10
CN1513206A (zh) 2004-07-14
EP1386356A2 (en) 2004-02-04
MY122941A (en) 2006-05-31
ATE360888T1 (de) 2007-05-15
US20020140094A1 (en) 2002-10-03
WO2002080271A3 (en) 2003-11-27
KR100555354B1 (ko) 2006-02-24
US6495397B2 (en) 2002-12-17
JP2005500672A (ja) 2005-01-06
DE60219779T2 (de) 2007-12-27

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