JP2005500672A5 - - Google Patents

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Publication number
JP2005500672A5
JP2005500672A5 JP2002578572A JP2002578572A JP2005500672A5 JP 2005500672 A5 JP2005500672 A5 JP 2005500672A5 JP 2002578572 A JP2002578572 A JP 2002578572A JP 2002578572 A JP2002578572 A JP 2002578572A JP 2005500672 A5 JP2005500672 A5 JP 2005500672A5
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JP
Japan
Prior art keywords
metal
temperature
chip
substrate
solder bumps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002578572A
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English (en)
Japanese (ja)
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JP2005500672A (ja
Filing date
Publication date
Priority claimed from US09/821,331 external-priority patent/US6495397B2/en
Application filed filed Critical
Publication of JP2005500672A publication Critical patent/JP2005500672A/ja
Publication of JP2005500672A5 publication Critical patent/JP2005500672A5/ja
Pending legal-status Critical Current

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JP2002578572A 2001-03-28 2002-02-21 フラックスのないフリップ・チップ相互接続 Pending JP2005500672A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/821,331 US6495397B2 (en) 2001-03-28 2001-03-28 Fluxless flip chip interconnection
PCT/US2002/005087 WO2002080271A2 (en) 2001-03-28 2002-02-21 Fluxless flip chip interconnection

Publications (2)

Publication Number Publication Date
JP2005500672A JP2005500672A (ja) 2005-01-06
JP2005500672A5 true JP2005500672A5 (enExample) 2005-12-22

Family

ID=25233096

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002578572A Pending JP2005500672A (ja) 2001-03-28 2002-02-21 フラックスのないフリップ・チップ相互接続

Country Status (10)

Country Link
US (1) US6495397B2 (enExample)
EP (1) EP1386356B1 (enExample)
JP (1) JP2005500672A (enExample)
KR (1) KR100555354B1 (enExample)
CN (1) CN100440496C (enExample)
AT (1) ATE360888T1 (enExample)
AU (1) AU2002245476A1 (enExample)
DE (1) DE60219779T2 (enExample)
MY (1) MY122941A (enExample)
WO (1) WO2002080271A2 (enExample)

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