JP2008192833A5 - - Google Patents

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Publication number
JP2008192833A5
JP2008192833A5 JP2007025861A JP2007025861A JP2008192833A5 JP 2008192833 A5 JP2008192833 A5 JP 2008192833A5 JP 2007025861 A JP2007025861 A JP 2007025861A JP 2007025861 A JP2007025861 A JP 2007025861A JP 2008192833 A5 JP2008192833 A5 JP 2008192833A5
Authority
JP
Japan
Prior art keywords
solder
manufacturing
semiconductor device
connection pad
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007025861A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008192833A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007025861A priority Critical patent/JP2008192833A/ja
Priority claimed from JP2007025861A external-priority patent/JP2008192833A/ja
Priority to KR1020080007383A priority patent/KR20080073213A/ko
Priority to US12/021,664 priority patent/US7901997B2/en
Priority to TW097104164A priority patent/TW200836309A/zh
Publication of JP2008192833A publication Critical patent/JP2008192833A/ja
Publication of JP2008192833A5 publication Critical patent/JP2008192833A5/ja
Pending legal-status Critical Current

Links

JP2007025861A 2007-02-05 2007-02-05 半導体装置の製造方法 Pending JP2008192833A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007025861A JP2008192833A (ja) 2007-02-05 2007-02-05 半導体装置の製造方法
KR1020080007383A KR20080073213A (ko) 2007-02-05 2008-01-24 반도체 장치의 제조 방법
US12/021,664 US7901997B2 (en) 2007-02-05 2008-01-29 Method of manufacturing semiconductor device
TW097104164A TW200836309A (en) 2007-02-05 2008-02-04 Method of manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007025861A JP2008192833A (ja) 2007-02-05 2007-02-05 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2008192833A JP2008192833A (ja) 2008-08-21
JP2008192833A5 true JP2008192833A5 (enExample) 2010-02-25

Family

ID=39676522

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007025861A Pending JP2008192833A (ja) 2007-02-05 2007-02-05 半導体装置の製造方法

Country Status (4)

Country Link
US (1) US7901997B2 (enExample)
JP (1) JP2008192833A (enExample)
KR (1) KR20080073213A (enExample)
TW (1) TW200836309A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8143096B2 (en) * 2008-08-19 2012-03-27 Stats Chippac Ltd. Integrated circuit package system flip chip
JP5615122B2 (ja) * 2010-10-12 2014-10-29 新光電気工業株式会社 電子部品装置及びその製造方法
TWI559826B (zh) * 2015-12-14 2016-11-21 財團法人工業技術研究院 接合結構及可撓式裝置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3121734B2 (ja) 1994-11-18 2001-01-09 新日本製鐵株式会社 半導体装置及び半導体装置バンプ用金属ボール
US20030001286A1 (en) * 2000-01-28 2003-01-02 Ryoichi Kajiwara Semiconductor package and flip chip bonding method therein
JP3829325B2 (ja) * 2002-02-07 2006-10-04 日本電気株式会社 半導体素子およびその製造方法並びに半導体装置の製造方法
US20040084206A1 (en) * 2002-11-06 2004-05-06 I-Chung Tung Fine pad pitch organic circuit board for flip chip joints and board to board solder joints and method
TWI254995B (en) * 2004-01-30 2006-05-11 Phoenix Prec Technology Corp Presolder structure formed on semiconductor package substrate and method for fabricating the same
JP2006100552A (ja) * 2004-09-29 2006-04-13 Rohm Co Ltd 配線基板および半導体装置
WO2007060812A1 (ja) * 2005-11-22 2007-05-31 Sony Corporation 半導体装置および半導体装置の製造方法
KR100722645B1 (ko) * 2006-01-23 2007-05-28 삼성전기주식회사 반도체 패키지용 인쇄회로기판 및 그 제조방법

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