JP2008192833A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP2008192833A
JP2008192833A JP2007025861A JP2007025861A JP2008192833A JP 2008192833 A JP2008192833 A JP 2008192833A JP 2007025861 A JP2007025861 A JP 2007025861A JP 2007025861 A JP2007025861 A JP 2007025861A JP 2008192833 A JP2008192833 A JP 2008192833A
Authority
JP
Japan
Prior art keywords
solder
connection
semiconductor device
bump
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007025861A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008192833A5 (enExample
Inventor
Takashi Ozawa
隆史 小澤
Seiji Sato
聖二 佐藤
Masao Nakazawa
昌夫 中沢
Miki Imai
三喜 今井
Masatoshi Nakamura
正寿 中村
Katsura Kondo
桂 今藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2007025861A priority Critical patent/JP2008192833A/ja
Priority to KR1020080007383A priority patent/KR20080073213A/ko
Priority to US12/021,664 priority patent/US7901997B2/en
Priority to TW097104164A priority patent/TW200836309A/zh
Publication of JP2008192833A publication Critical patent/JP2008192833A/ja
Publication of JP2008192833A5 publication Critical patent/JP2008192833A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0475—Molten solder just before placing the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2007025861A 2007-02-05 2007-02-05 半導体装置の製造方法 Pending JP2008192833A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007025861A JP2008192833A (ja) 2007-02-05 2007-02-05 半導体装置の製造方法
KR1020080007383A KR20080073213A (ko) 2007-02-05 2008-01-24 반도체 장치의 제조 방법
US12/021,664 US7901997B2 (en) 2007-02-05 2008-01-29 Method of manufacturing semiconductor device
TW097104164A TW200836309A (en) 2007-02-05 2008-02-04 Method of manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007025861A JP2008192833A (ja) 2007-02-05 2007-02-05 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2008192833A true JP2008192833A (ja) 2008-08-21
JP2008192833A5 JP2008192833A5 (enExample) 2010-02-25

Family

ID=39676522

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007025861A Pending JP2008192833A (ja) 2007-02-05 2007-02-05 半導体装置の製造方法

Country Status (4)

Country Link
US (1) US7901997B2 (enExample)
JP (1) JP2008192833A (enExample)
KR (1) KR20080073213A (enExample)
TW (1) TW200836309A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012084681A (ja) * 2010-10-12 2012-04-26 Shinko Electric Ind Co Ltd 電子部品装置及びその製造方法と配線基板

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8143096B2 (en) * 2008-08-19 2012-03-27 Stats Chippac Ltd. Integrated circuit package system flip chip
TWI559826B (zh) * 2015-12-14 2016-11-21 財團法人工業技術研究院 接合結構及可撓式裝置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005217388A (ja) * 2004-01-30 2005-08-11 Phoenix Precision Technology Corp 半導体パッケージ基板のプリ半田構造及びその製法
JP2006100552A (ja) * 2004-09-29 2006-04-13 Rohm Co Ltd 配線基板および半導体装置
JP2007201469A (ja) * 2006-01-23 2007-08-09 Samsung Electro Mech Co Ltd 半導体パッケージ用プリント基板及びその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3121734B2 (ja) 1994-11-18 2001-01-09 新日本製鐵株式会社 半導体装置及び半導体装置バンプ用金属ボール
US20030001286A1 (en) * 2000-01-28 2003-01-02 Ryoichi Kajiwara Semiconductor package and flip chip bonding method therein
JP3829325B2 (ja) * 2002-02-07 2006-10-04 日本電気株式会社 半導体素子およびその製造方法並びに半導体装置の製造方法
US20040084206A1 (en) * 2002-11-06 2004-05-06 I-Chung Tung Fine pad pitch organic circuit board for flip chip joints and board to board solder joints and method
JP4827851B2 (ja) * 2005-11-22 2011-11-30 ソニー株式会社 半導体装置および半導体装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005217388A (ja) * 2004-01-30 2005-08-11 Phoenix Precision Technology Corp 半導体パッケージ基板のプリ半田構造及びその製法
JP2006100552A (ja) * 2004-09-29 2006-04-13 Rohm Co Ltd 配線基板および半導体装置
JP2007201469A (ja) * 2006-01-23 2007-08-09 Samsung Electro Mech Co Ltd 半導体パッケージ用プリント基板及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012084681A (ja) * 2010-10-12 2012-04-26 Shinko Electric Ind Co Ltd 電子部品装置及びその製造方法と配線基板

Also Published As

Publication number Publication date
KR20080073213A (ko) 2008-08-08
US7901997B2 (en) 2011-03-08
US20080188040A1 (en) 2008-08-07
TW200836309A (en) 2008-09-01

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