JP2012009713A5 - - Google Patents
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- Publication number
- JP2012009713A5 JP2012009713A5 JP2010145550A JP2010145550A JP2012009713A5 JP 2012009713 A5 JP2012009713 A5 JP 2012009713A5 JP 2010145550 A JP2010145550 A JP 2010145550A JP 2010145550 A JP2010145550 A JP 2010145550A JP 2012009713 A5 JP2012009713 A5 JP 2012009713A5
- Authority
- JP
- Japan
- Prior art keywords
- resin layer
- semiconductor chip
- substrate
- underfill resin
- back surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 29
- 239000011347 resin Substances 0.000 claims description 27
- 229920005989 resin Polymers 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 23
- 238000004519 manufacturing process Methods 0.000 claims 4
- 238000000034 method Methods 0.000 claims 1
- 238000004382 potting Methods 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010145550A JP2012009713A (ja) | 2010-06-25 | 2010-06-25 | 半導体パッケージおよび半導体パッケージの製造方法 |
| US13/168,126 US20110316151A1 (en) | 2010-06-25 | 2011-06-24 | Semiconductor package and method for manufacturing semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010145550A JP2012009713A (ja) | 2010-06-25 | 2010-06-25 | 半導体パッケージおよび半導体パッケージの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012009713A JP2012009713A (ja) | 2012-01-12 |
| JP2012009713A5 true JP2012009713A5 (enExample) | 2013-05-16 |
Family
ID=45351755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010145550A Pending JP2012009713A (ja) | 2010-06-25 | 2010-06-25 | 半導体パッケージおよび半導体パッケージの製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20110316151A1 (enExample) |
| JP (1) | JP2012009713A (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5980566B2 (ja) * | 2012-05-17 | 2016-08-31 | 新光電気工業株式会社 | 半導体装置及びその製造方法 |
| KR102103375B1 (ko) | 2013-06-18 | 2020-04-22 | 삼성전자주식회사 | 반도체 패키지 |
| JP6457400B2 (ja) | 2013-11-26 | 2019-01-23 | 東レエンジニアリング株式会社 | 実装装置および実装方法 |
| KR102351257B1 (ko) * | 2014-07-07 | 2022-01-17 | 삼성전자주식회사 | 잔류응력을 갖는 반도체 패키지 및 그 제조방법 |
| US10319607B2 (en) * | 2014-08-22 | 2019-06-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Package-on-package structure with organic interposer |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5535101A (en) * | 1992-11-03 | 1996-07-09 | Motorola, Inc. | Leadless integrated circuit package |
| JP3400877B2 (ja) * | 1994-12-14 | 2003-04-28 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
| US5855821A (en) * | 1995-12-22 | 1999-01-05 | Johnson Matthey, Inc. | Materials for semiconductor device assemblies |
| JP3539528B2 (ja) * | 1996-01-31 | 2004-07-07 | 日立化成工業株式会社 | 半導体装置およびその製造方法 |
| US5866953A (en) * | 1996-05-24 | 1999-02-02 | Micron Technology, Inc. | Packaged die on PCB with heat sink encapsulant |
| JP2973940B2 (ja) * | 1996-09-20 | 1999-11-08 | 日本電気株式会社 | 素子の樹脂封止構造 |
| US6104093A (en) * | 1997-04-24 | 2000-08-15 | International Business Machines Corporation | Thermally enhanced and mechanically balanced flip chip package and method of forming |
| JP2000277564A (ja) * | 1999-03-23 | 2000-10-06 | Casio Comput Co Ltd | 半導体装置及びその製造方法 |
| US6576495B1 (en) * | 2000-08-30 | 2003-06-10 | Micron Technology, Inc. | Microelectronic assembly with pre-disposed fill material and associated method of manufacture |
| JP3649169B2 (ja) * | 2001-08-08 | 2005-05-18 | 松下電器産業株式会社 | 半導体装置 |
| US6869831B2 (en) * | 2001-09-14 | 2005-03-22 | Texas Instruments Incorporated | Adhesion by plasma conditioning of semiconductor chip surfaces |
| JP4390541B2 (ja) * | 2003-02-03 | 2009-12-24 | Necエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
| JP2005311321A (ja) * | 2004-03-22 | 2005-11-04 | Sharp Corp | 半導体装置およびその製造方法、並びに、該半導体装置を備えた液晶モジュールおよび半導体モジュール |
| US7547978B2 (en) * | 2004-06-14 | 2009-06-16 | Micron Technology, Inc. | Underfill and encapsulation of semiconductor assemblies with materials having differing properties |
| JP2009049218A (ja) * | 2007-08-21 | 2009-03-05 | Nec Electronics Corp | 半導体装置及び半導体装置の製造方法 |
| JP5185062B2 (ja) * | 2008-10-21 | 2013-04-17 | パナソニック株式会社 | 積層型半導体装置及び電子機器 |
| JP2010263108A (ja) * | 2009-05-08 | 2010-11-18 | Elpida Memory Inc | 半導体装置及びその製造方法 |
-
2010
- 2010-06-25 JP JP2010145550A patent/JP2012009713A/ja active Pending
-
2011
- 2011-06-24 US US13/168,126 patent/US20110316151A1/en not_active Abandoned
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