JP2005509269A5 - - Google Patents

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Publication number
JP2005509269A5
JP2005509269A5 JP2002578564A JP2002578564A JP2005509269A5 JP 2005509269 A5 JP2005509269 A5 JP 2005509269A5 JP 2002578564 A JP2002578564 A JP 2002578564A JP 2002578564 A JP2002578564 A JP 2002578564A JP 2005509269 A5 JP2005509269 A5 JP 2005509269A5
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JP
Japan
Prior art keywords
temperature
solder bumps
fixture
substrate
metal protrusions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002578564A
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English (en)
Japanese (ja)
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JP2005509269A (ja
Filing date
Publication date
Priority claimed from US09/820,547 external-priority patent/US6713318B2/en
Application filed filed Critical
Publication of JP2005509269A publication Critical patent/JP2005509269A/ja
Publication of JP2005509269A5 publication Critical patent/JP2005509269A5/ja
Pending legal-status Critical Current

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JP2002578564A 2001-03-28 2002-03-22 洗浄不要フラックスを使用したフリップ・チップ相互接続 Pending JP2005509269A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/820,547 US6713318B2 (en) 2001-03-28 2001-03-28 Flip chip interconnection using no-clean flux
PCT/US2002/008903 WO2002080263A2 (en) 2001-03-28 2002-03-22 Flip chip interconnection using no-clean flux

Publications (2)

Publication Number Publication Date
JP2005509269A JP2005509269A (ja) 2005-04-07
JP2005509269A5 true JP2005509269A5 (enExample) 2005-12-22

Family

ID=25231108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002578564A Pending JP2005509269A (ja) 2001-03-28 2002-03-22 洗浄不要フラックスを使用したフリップ・チップ相互接続

Country Status (10)

Country Link
US (2) US6713318B2 (enExample)
EP (1) EP1374297B1 (enExample)
JP (1) JP2005509269A (enExample)
KR (1) KR100555395B1 (enExample)
CN (1) CN1295771C (enExample)
AT (1) ATE403231T1 (enExample)
AU (1) AU2002248684A1 (enExample)
DE (1) DE60227926D1 (enExample)
MY (1) MY122890A (enExample)
WO (1) WO2002080263A2 (enExample)

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CN108620764B (zh) * 2017-03-24 2022-03-08 苏州昭舜物联科技有限公司 低温软钎焊接用焊膏及制备方法
US10750614B2 (en) * 2017-06-12 2020-08-18 Invensas Corporation Deformable electrical contacts with conformable target pads
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US20190364669A1 (en) * 2018-05-25 2019-11-28 Nichia Corporation Method for manufacturing light emitting module
CN109712899A (zh) * 2018-12-27 2019-05-03 通富微电子股份有限公司 一种半导体封装方法及半导体封装器件
JP2021034502A (ja) * 2019-08-22 2021-03-01 スタンレー電気株式会社 発光装置、および、その製造方法
JP7145839B2 (ja) * 2019-12-18 2022-10-03 株式会社オリジン はんだ付け基板の製造方法及びはんだ付け装置
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