CN100335580C - 含有阻化化合物的抛光系统及其使用方法 - Google Patents

含有阻化化合物的抛光系统及其使用方法 Download PDF

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Publication number
CN100335580C
CN100335580C CNB008116393A CN00811639A CN100335580C CN 100335580 C CN100335580 C CN 100335580C CN B008116393 A CNB008116393 A CN B008116393A CN 00811639 A CN00811639 A CN 00811639A CN 100335580 C CN100335580 C CN 100335580C
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CN
China
Prior art keywords
polishing
acids
composition according
layer
substrate
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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CNB008116393A
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English (en)
Chinese (zh)
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CN1370209A (zh
Inventor
王淑敏
弗拉斯塔·布鲁西克考夫曼
史蒂文·K·格鲁姆宾
艾萨克·K·彻里安
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Cabot Corp
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Cabot Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents

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  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
CNB008116393A 1999-08-13 2000-08-10 含有阻化化合物的抛光系统及其使用方法 Expired - Lifetime CN100335580C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14881399P 1999-08-13 1999-08-13
US60/148,813 1999-08-13

Publications (2)

Publication Number Publication Date
CN1370209A CN1370209A (zh) 2002-09-18
CN100335580C true CN100335580C (zh) 2007-09-05

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
CNB008116377A Expired - Lifetime CN100368496C (zh) 1999-08-13 2000-08-10 抛光系统及其使用方法
CNB008116393A Expired - Lifetime CN100335580C (zh) 1999-08-13 2000-08-10 含有阻化化合物的抛光系统及其使用方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CNB008116377A Expired - Lifetime CN100368496C (zh) 1999-08-13 2000-08-10 抛光系统及其使用方法

Country Status (14)

Country Link
US (1) US6852632B2 (OSRAM)
EP (3) EP1226220B1 (OSRAM)
JP (5) JP4391715B2 (OSRAM)
KR (2) KR100590664B1 (OSRAM)
CN (2) CN100368496C (OSRAM)
AT (2) ATE292167T1 (OSRAM)
AU (2) AU6632100A (OSRAM)
CA (2) CA2378793A1 (OSRAM)
DE (2) DE60034474T2 (OSRAM)
HK (2) HK1046422A1 (OSRAM)
IL (2) IL147234A0 (OSRAM)
MY (2) MY129591A (OSRAM)
TW (2) TW570965B (OSRAM)
WO (2) WO2001012741A1 (OSRAM)

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