CA2072264A1 - Thin-film transistor manufacture - Google Patents

Thin-film transistor manufacture

Info

Publication number
CA2072264A1
CA2072264A1 CA002072264A CA2072264A CA2072264A1 CA 2072264 A1 CA2072264 A1 CA 2072264A1 CA 002072264 A CA002072264 A CA 002072264A CA 2072264 A CA2072264 A CA 2072264A CA 2072264 A1 CA2072264 A1 CA 2072264A1
Authority
CA
Canada
Prior art keywords
gate
conductive layer
film
substrate
drain
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002072264A
Other languages
English (en)
French (fr)
Inventor
Nigel David Young
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2072264A1 publication Critical patent/CA2072264A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02656Special treatments
    • H01L21/02664Aftertreatments
    • H01L21/02667Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • H01L21/02675Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
    • H01L21/02686Pulsed laser beam
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/02422Non-crystalline insulating materials, e.g. glass, polymers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02524Group 14 semiconducting materials
    • H01L21/02532Silicon, silicon germanium, germanium
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/0262Reduction or decomposition of gaseous compounds, e.g. CVD
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274Photolithographic processes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0312Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
    • H10D30/0314Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral top-gate TFTs comprising only a single gate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0321Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6704Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
    • H10D30/6713Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
    • H10D30/6715Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes characterised by the doping profiles, e.g. having lightly-doped source or drain extensions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6704Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
    • H10D30/6713Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
    • H10D30/6715Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes characterised by the doping profiles, e.g. having lightly-doped source or drain extensions
    • H10D30/6717Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes characterised by the doping profiles, e.g. having lightly-doped source or drain extensions the source and the drain regions being asymmetrical
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6731Top-gate only TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6741Group IV materials, e.g. germanium or silicon carbide
    • H10D30/6743Silicon
    • H10D30/6745Polycrystalline or microcrystalline silicon
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/15Silicon on sapphire SOS
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/942Masking
    • Y10S438/948Radiation resist
    • Y10S438/949Energy beam treating radiation resist on semiconductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Nonlinear Science (AREA)
  • Materials Engineering (AREA)
  • Mathematical Physics (AREA)
  • Thin Film Transistor (AREA)
CA002072264A 1991-06-28 1992-06-25 Thin-film transistor manufacture Abandoned CA2072264A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB919114018A GB9114018D0 (en) 1991-06-28 1991-06-28 Thin-film transistor manufacture
GB9114018.6 1991-06-28

Publications (1)

Publication Number Publication Date
CA2072264A1 true CA2072264A1 (en) 1992-12-29

Family

ID=10697510

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002072264A Abandoned CA2072264A1 (en) 1991-06-28 1992-06-25 Thin-film transistor manufacture

Country Status (8)

Country Link
US (1) US5264383A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
EP (1) EP0523768B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPH05190568A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
KR (1) KR100260063B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CA (1) CA2072264A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE69216311T2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
GB (1) GB9114018D0 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TW (1) TW232088B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3437863B2 (ja) * 1993-01-18 2003-08-18 株式会社半導体エネルギー研究所 Mis型半導体装置の作製方法
US5753542A (en) 1985-08-02 1998-05-19 Semiconductor Energy Laboratory Co., Ltd. Method for crystallizing semiconductor material without exposing it to air
JP2700277B2 (ja) * 1990-06-01 1998-01-19 株式会社半導体エネルギー研究所 薄膜トランジスタの作製方法
US5930608A (en) 1992-02-21 1999-07-27 Semiconductor Energy Laboratory Co., Ltd. Method of fabricating a thin film transistor in which the channel region of the transistor consists of two portions of differing crystallinity
JP3173854B2 (ja) 1992-03-25 2001-06-04 株式会社半導体エネルギー研究所 薄膜状絶縁ゲイト型半導体装置の作製方法及び作成された半導体装置
US5372836A (en) * 1992-03-27 1994-12-13 Tokyo Electron Limited Method of forming polycrystalling silicon film in process of manufacturing LCD
JPH06124913A (ja) * 1992-06-26 1994-05-06 Semiconductor Energy Lab Co Ltd レーザー処理方法
CA2097388A1 (en) * 1992-07-16 1994-01-17 Susan Nord Bohlke Topographical selective patterns
CN100483651C (zh) 1992-08-27 2009-04-29 株式会社半导体能源研究所 半导体器件的制造方法
JP3240719B2 (ja) * 1992-12-10 2001-12-25 ソニー株式会社 半導体薄膜結晶の成長方法
US5843225A (en) * 1993-02-03 1998-12-01 Semiconductor Energy Laboratory Co., Ltd. Process for fabricating semiconductor and process for fabricating semiconductor device
JP3497198B2 (ja) 1993-02-03 2004-02-16 株式会社半導体エネルギー研究所 半導体装置および薄膜トランジスタの作製方法
US6997985B1 (en) 1993-02-15 2006-02-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor, semiconductor device, and method for fabricating the same
US5985741A (en) 1993-02-15 1999-11-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of fabricating the same
US5639698A (en) * 1993-02-15 1997-06-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor, semiconductor device, and method for fabricating the same
US6875628B1 (en) * 1993-05-26 2005-04-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and fabrication method of the same
JP3450376B2 (ja) 1993-06-12 2003-09-22 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP3173926B2 (ja) 1993-08-12 2001-06-04 株式会社半導体エネルギー研究所 薄膜状絶縁ゲイト型半導体装置の作製方法及びその半導体装置
US6331717B1 (en) 1993-08-12 2001-12-18 Semiconductor Energy Laboratory Co. Ltd. Insulated gate semiconductor device and process for fabricating the same
JPH0766420A (ja) * 1993-08-31 1995-03-10 Matsushita Electric Ind Co Ltd 薄膜の加工方法
KR100299292B1 (ko) * 1993-11-02 2001-12-01 이데이 노부유끼 다결정실리콘박막형성방법및그표면처리장치
GB9401770D0 (en) * 1994-01-31 1994-03-23 Philips Electronics Uk Ltd Manufacture of electronic devices comprising thin-film circuits
US5604139A (en) * 1994-02-10 1997-02-18 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing a semiconductor device
US6723590B1 (en) 1994-03-09 2004-04-20 Semiconductor Energy Laboratory Co., Ltd. Method for laser-processing semiconductor device
KR100321541B1 (ko) * 1994-03-09 2002-06-20 야마자끼 순페이 능동 매트릭스 디스플레이 장치의 작동 방법
JPH07249591A (ja) * 1994-03-14 1995-09-26 Matsushita Electric Ind Co Ltd 半導体薄膜のレーザーアニール方法及び薄膜半導体素子
GB9406900D0 (en) * 1994-04-07 1994-06-01 Philips Electronics Uk Ltd Manufacture of electronic devices comprising thin -film transistors
KR100279217B1 (ko) * 1994-04-13 2001-02-01 야마자끼 순페이 반도체 장치 형성 방법, 결정성 반도체 막 형성 방법, 박막 트랜지스터 형성 방법 및 반도체 장치 제조 방법
US6974763B1 (en) 1994-04-13 2005-12-13 Semiconductor Energy Laboratory Co., Ltd. Method of forming semiconductor device by crystallizing amorphous silicon and forming crystallization promoting material in the same chamber
TW280037B (en) * 1994-04-22 1996-07-01 Handotai Energy Kenkyusho Kk Drive circuit of active matrix type display device and manufacturing method
JP3897826B2 (ja) * 1994-08-19 2007-03-28 株式会社半導体エネルギー研究所 アクティブマトリクス型の表示装置
US5915174A (en) 1994-09-30 1999-06-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for producing the same
US5600153A (en) * 1994-10-07 1997-02-04 Micron Technology, Inc. Conductive polysilicon lines and thin film transistors
US5773309A (en) * 1994-10-14 1998-06-30 The Regents Of The University Of California Method for producing silicon thin-film transistors with enhanced forward current drive
TW303526B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1994-12-27 1997-04-21 Matsushita Electric Ind Co Ltd
US5804838A (en) * 1995-05-26 1998-09-08 Micron Technology, Inc. Thin film transistors
KR100362187B1 (ko) * 1995-12-28 2003-03-06 주식회사 하이닉스반도체 박막트랜지스터제조방법
TW451284B (en) * 1996-10-15 2001-08-21 Semiconductor Energy Lab Semiconductor device and method of manufacturing the same
KR100248119B1 (ko) * 1997-05-01 2000-03-15 구자홍 박막트랜지스터 및 그 제조방법
US6501094B1 (en) 1997-06-11 2002-12-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising a bottom gate type thin film transistor
JPH11214700A (ja) 1998-01-23 1999-08-06 Semiconductor Energy Lab Co Ltd 半導体表示装置
JPH11338439A (ja) * 1998-03-27 1999-12-10 Semiconductor Energy Lab Co Ltd 半導体表示装置の駆動回路および半導体表示装置
JP3844613B2 (ja) 1998-04-28 2006-11-15 株式会社半導体エネルギー研究所 薄膜トランジスタ回路およびそれを用いた表示装置
GB9817745D0 (en) * 1998-08-15 1998-10-14 Philips Electronics Nv Manufacture of electronic devices comprising thin-film circuit elements
US6204521B1 (en) 1998-08-28 2001-03-20 Micron Technology, Inc. Thin film transistors
SE523918C2 (sv) * 1999-01-25 2004-06-01 Appliedsensor Sweden Ab Förfarande för framställning av integrerade sensorgrupper på ett gemensamt substrat samt en mask för användning vid förfarandet
KR100312260B1 (ko) * 1999-05-25 2001-11-03 구본준, 론 위라하디락사 액정표시장치 및 그 제조방법
US6780687B2 (en) * 2000-01-28 2004-08-24 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device having a heat absorbing layer
US6872607B2 (en) * 2000-03-21 2005-03-29 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device
US6831299B2 (en) * 2000-11-09 2004-12-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US7270724B2 (en) 2000-12-13 2007-09-18 Uvtech Systems, Inc. Scanning plasma reactor
US6773683B2 (en) * 2001-01-08 2004-08-10 Uvtech Systems, Inc. Photocatalytic reactor system for treating flue effluents
DE10137830A1 (de) * 2001-08-02 2003-02-27 Infineon Technologies Ag Verfahren zum Herstellen einer selbstjustierten Struktur auf einem Halbleiter-Wafer
US6667215B2 (en) 2002-05-02 2003-12-23 3M Innovative Properties Method of making transistors
NL1025475C2 (nl) * 2004-02-12 2005-08-15 C2V Werkwijze voor het vervaardigen van een inrichting en inrichting vervaardigd volgens zo een werkwijze.
US8008718B2 (en) * 2004-12-14 2011-08-30 Sharp Kabushiki Kaisha Semiconductor device and production method thereof
TWI396916B (zh) * 2009-07-17 2013-05-21 Chunghwa Picture Tubes Ltd 薄膜電晶體陣列基板之製作方法
JP5500907B2 (ja) * 2009-08-21 2014-05-21 株式会社日立製作所 半導体装置およびその製造方法
KR101084261B1 (ko) * 2010-03-17 2011-11-16 삼성모바일디스플레이주식회사 박막 트랜지스터, 이를 구비한 표시 장치, 및 그 제조 방법들
KR20230060581A (ko) * 2021-10-27 2023-05-08 삼성디스플레이 주식회사 박막 트랜지스터 어레이 기판 및 그 제조 방법

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2658400A1 (de) * 1976-12-23 1978-06-29 Ibm Deutschland Verfahren zur herstellung einer negativen maske auf einem substrat
US4242156A (en) * 1979-10-15 1980-12-30 Rockwell International Corporation Method of fabricating an SOS island edge passivation structure
US4393572A (en) * 1980-05-29 1983-07-19 Rca Corporation Method of making low leakage N-channel SOS transistors utilizing positive photoresist masking techniques
JPS58170067A (ja) * 1982-03-31 1983-10-06 Fujitsu Ltd 薄膜トランジスタの製造方法
US4727044A (en) * 1984-05-18 1988-02-23 Semiconductor Energy Laboratory Co., Ltd. Method of making a thin film transistor with laser recrystallized source and drain
FR2590409B1 (fr) * 1985-11-15 1987-12-11 Commissariat Energie Atomique Procede de fabrication d'un transistor en couches minces a grille auto-alignee par rapport au drain et a la source de celui-ci et transistor obtenu par le procede
JPS62119974A (ja) * 1985-11-19 1987-06-01 Sharp Corp 薄膜トランジスタの製造方法
JPS62152174A (ja) * 1985-12-25 1987-07-07 Matsushita Electric Ind Co Ltd 薄膜トランジスタの製造方法
JPH0622245B2 (ja) * 1986-05-02 1994-03-23 富士ゼロックス株式会社 薄膜トランジスタの製造方法
US4678542A (en) * 1986-07-25 1987-07-07 Energy Conversion Devices, Inc. Self-alignment process for thin film diode array fabrication
JPS6379379A (ja) * 1986-09-22 1988-04-09 Fujitsu Ltd 自児整合型薄膜トランジスタの製造方法
JPH0242761A (ja) * 1988-04-20 1990-02-13 Matsushita Electric Ind Co Ltd アクティブマトリクス基板の製造方法
GB8812235D0 (en) * 1988-05-24 1988-06-29 Jones B L Manufacturing electronic devices
NL8801379A (nl) * 1988-05-30 1989-12-18 Imec Inter Uni Micro Electr Werkwijze voor het vervaardigen van een dunne-filmtransistor en een dergelijke dunne-filmtransistor.
US5053353A (en) * 1988-11-21 1991-10-01 Harris Corporation Fabricating dielectric isolation of SOI island side wall for reducing leakage current
GB9113979D0 (en) * 1991-06-28 1991-08-14 Philips Electronic Associated Thin-film transistors and their manufacture

Also Published As

Publication number Publication date
EP0523768A3 (en) 1993-06-16
US5264383A (en) 1993-11-23
EP0523768B1 (en) 1997-01-02
EP0523768A2 (en) 1993-01-20
KR100260063B1 (ko) 2000-07-01
JPH05190568A (ja) 1993-07-30
TW232088B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1994-10-11
DE69216311D1 (de) 1997-02-13
GB9114018D0 (en) 1991-08-14
DE69216311T2 (de) 1997-06-12
KR930001504A (ko) 1993-01-16

Similar Documents

Publication Publication Date Title
US5264383A (en) Method of manufacturing a thin film transistor
US5696011A (en) Method for forming an insulated gate field effect transistor
JP4493741B2 (ja) 半導体装置の作製方法
KR970002004B1 (ko) 반도체장치와 그 제작방법
US5585647A (en) Integrated circuit device having an insulating substrate, and a liquid crystal display device having an insulating substrate
US6051453A (en) Process for fabricating semiconductor device
US7572685B2 (en) Method of manufacturing thin film transistor
JP2001007342A (ja) 半導体装置およびその作製方法
JPH0758339A (ja) 半導体装置およびその作製方法
CN1638022A (zh) 多晶硅膜的形成方法
EP0860022B1 (en) Electronic device manufacture
JP2000150904A (ja) 半導体素子からなる半導体回路を備えた半導体装置およびその作製方法
JPH0659278A (ja) 液晶表示装置及びその製造方法
JP2734359B2 (ja) 薄膜トランジスタ及びその製造方法
JPH07263698A (ja) 薄膜トランジスタ及びその製造方法
JP3361670B2 (ja) 半導体装置およびその製造方法
JP3281756B2 (ja) 半導体装置及びそれを用いた液晶パネル
JP2871262B2 (ja) 薄膜トランジスタの製造方法
JPH09172186A (ja) 薄膜トランジスタの製造方法
JPH1187724A (ja) 半導体素子の製造方法
JP3393834B2 (ja) 半導体装置の作製方法
JPH08339972A (ja) 薄膜トランジスタの製造方法およびそれを用いた液晶表示装置
JP2000150888A (ja) 薄膜トランジスタの形成方法及び薄膜トランジスタ
JP3167497B2 (ja) 薄膜トランジスタの製造方法
JPS63158875A (ja) 薄膜トランジスタの製造方法

Legal Events

Date Code Title Description
FZDE Discontinued