TW232088B - - Google Patents
Info
- Publication number
- TW232088B TW232088B TW081103693A TW81103693A TW232088B TW 232088 B TW232088 B TW 232088B TW 081103693 A TW081103693 A TW 081103693A TW 81103693 A TW81103693 A TW 81103693A TW 232088 B TW232088 B TW 232088B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
- H01L21/02686—Pulsed laser beam
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02422—Non-crystalline insulating materials, e.g. glass, polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0312—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
- H10D30/0314—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral top-gate TFTs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0321—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6713—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
- H10D30/6715—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes characterised by the doping profiles, e.g. having lightly-doped source or drain extensions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6713—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
- H10D30/6715—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes characterised by the doping profiles, e.g. having lightly-doped source or drain extensions
- H10D30/6717—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes characterised by the doping profiles, e.g. having lightly-doped source or drain extensions the source and the drain regions being asymmetrical
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6731—Top-gate only TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6741—Group IV materials, e.g. germanium or silicon carbide
- H10D30/6743—Silicon
- H10D30/6745—Polycrystalline or microcrystalline silicon
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/15—Silicon on sapphire SOS
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/942—Masking
- Y10S438/948—Radiation resist
- Y10S438/949—Energy beam treating radiation resist on semiconductor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Nonlinear Science (AREA)
- Materials Engineering (AREA)
- Mathematical Physics (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB919114018A GB9114018D0 (en) | 1991-06-28 | 1991-06-28 | Thin-film transistor manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
TW232088B true TW232088B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1994-10-11 |
Family
ID=10697510
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW081103693A TW232088B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-06-28 | 1992-05-12 |
Country Status (8)
Families Citing this family (60)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3437863B2 (ja) * | 1993-01-18 | 2003-08-18 | 株式会社半導体エネルギー研究所 | Mis型半導体装置の作製方法 |
US5753542A (en) | 1985-08-02 | 1998-05-19 | Semiconductor Energy Laboratory Co., Ltd. | Method for crystallizing semiconductor material without exposing it to air |
JP2700277B2 (ja) * | 1990-06-01 | 1998-01-19 | 株式会社半導体エネルギー研究所 | 薄膜トランジスタの作製方法 |
US5930608A (en) | 1992-02-21 | 1999-07-27 | Semiconductor Energy Laboratory Co., Ltd. | Method of fabricating a thin film transistor in which the channel region of the transistor consists of two portions of differing crystallinity |
JP3173854B2 (ja) | 1992-03-25 | 2001-06-04 | 株式会社半導体エネルギー研究所 | 薄膜状絶縁ゲイト型半導体装置の作製方法及び作成された半導体装置 |
US5372836A (en) * | 1992-03-27 | 1994-12-13 | Tokyo Electron Limited | Method of forming polycrystalling silicon film in process of manufacturing LCD |
JPH06124913A (ja) * | 1992-06-26 | 1994-05-06 | Semiconductor Energy Lab Co Ltd | レーザー処理方法 |
CA2097388A1 (en) * | 1992-07-16 | 1994-01-17 | Susan Nord Bohlke | Topographical selective patterns |
CN100483651C (zh) | 1992-08-27 | 2009-04-29 | 株式会社半导体能源研究所 | 半导体器件的制造方法 |
JP3240719B2 (ja) * | 1992-12-10 | 2001-12-25 | ソニー株式会社 | 半導体薄膜結晶の成長方法 |
US5843225A (en) * | 1993-02-03 | 1998-12-01 | Semiconductor Energy Laboratory Co., Ltd. | Process for fabricating semiconductor and process for fabricating semiconductor device |
JP3497198B2 (ja) | 1993-02-03 | 2004-02-16 | 株式会社半導体エネルギー研究所 | 半導体装置および薄膜トランジスタの作製方法 |
US6997985B1 (en) | 1993-02-15 | 2006-02-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor, semiconductor device, and method for fabricating the same |
US5985741A (en) | 1993-02-15 | 1999-11-16 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of fabricating the same |
US5639698A (en) * | 1993-02-15 | 1997-06-17 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor, semiconductor device, and method for fabricating the same |
US6875628B1 (en) * | 1993-05-26 | 2005-04-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and fabrication method of the same |
JP3450376B2 (ja) | 1993-06-12 | 2003-09-22 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
JP3173926B2 (ja) | 1993-08-12 | 2001-06-04 | 株式会社半導体エネルギー研究所 | 薄膜状絶縁ゲイト型半導体装置の作製方法及びその半導体装置 |
US6331717B1 (en) | 1993-08-12 | 2001-12-18 | Semiconductor Energy Laboratory Co. Ltd. | Insulated gate semiconductor device and process for fabricating the same |
JPH0766420A (ja) * | 1993-08-31 | 1995-03-10 | Matsushita Electric Ind Co Ltd | 薄膜の加工方法 |
KR100299292B1 (ko) * | 1993-11-02 | 2001-12-01 | 이데이 노부유끼 | 다결정실리콘박막형성방법및그표면처리장치 |
GB9401770D0 (en) * | 1994-01-31 | 1994-03-23 | Philips Electronics Uk Ltd | Manufacture of electronic devices comprising thin-film circuits |
US5604139A (en) * | 1994-02-10 | 1997-02-18 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a semiconductor device |
US6723590B1 (en) | 1994-03-09 | 2004-04-20 | Semiconductor Energy Laboratory Co., Ltd. | Method for laser-processing semiconductor device |
KR100321541B1 (ko) * | 1994-03-09 | 2002-06-20 | 야마자끼 순페이 | 능동 매트릭스 디스플레이 장치의 작동 방법 |
JPH07249591A (ja) * | 1994-03-14 | 1995-09-26 | Matsushita Electric Ind Co Ltd | 半導体薄膜のレーザーアニール方法及び薄膜半導体素子 |
GB9406900D0 (en) * | 1994-04-07 | 1994-06-01 | Philips Electronics Uk Ltd | Manufacture of electronic devices comprising thin -film transistors |
KR100279217B1 (ko) * | 1994-04-13 | 2001-02-01 | 야마자끼 순페이 | 반도체 장치 형성 방법, 결정성 반도체 막 형성 방법, 박막 트랜지스터 형성 방법 및 반도체 장치 제조 방법 |
US6974763B1 (en) | 1994-04-13 | 2005-12-13 | Semiconductor Energy Laboratory Co., Ltd. | Method of forming semiconductor device by crystallizing amorphous silicon and forming crystallization promoting material in the same chamber |
TW280037B (en) * | 1994-04-22 | 1996-07-01 | Handotai Energy Kenkyusho Kk | Drive circuit of active matrix type display device and manufacturing method |
JP3897826B2 (ja) * | 1994-08-19 | 2007-03-28 | 株式会社半導体エネルギー研究所 | アクティブマトリクス型の表示装置 |
US5915174A (en) | 1994-09-30 | 1999-06-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for producing the same |
US5600153A (en) * | 1994-10-07 | 1997-02-04 | Micron Technology, Inc. | Conductive polysilicon lines and thin film transistors |
US5773309A (en) * | 1994-10-14 | 1998-06-30 | The Regents Of The University Of California | Method for producing silicon thin-film transistors with enhanced forward current drive |
TW303526B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1994-12-27 | 1997-04-21 | Matsushita Electric Ind Co Ltd | |
US5804838A (en) * | 1995-05-26 | 1998-09-08 | Micron Technology, Inc. | Thin film transistors |
KR100362187B1 (ko) * | 1995-12-28 | 2003-03-06 | 주식회사 하이닉스반도체 | 박막트랜지스터제조방법 |
TW451284B (en) * | 1996-10-15 | 2001-08-21 | Semiconductor Energy Lab | Semiconductor device and method of manufacturing the same |
KR100248119B1 (ko) * | 1997-05-01 | 2000-03-15 | 구자홍 | 박막트랜지스터 및 그 제조방법 |
US6501094B1 (en) | 1997-06-11 | 2002-12-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device comprising a bottom gate type thin film transistor |
JPH11214700A (ja) | 1998-01-23 | 1999-08-06 | Semiconductor Energy Lab Co Ltd | 半導体表示装置 |
JPH11338439A (ja) * | 1998-03-27 | 1999-12-10 | Semiconductor Energy Lab Co Ltd | 半導体表示装置の駆動回路および半導体表示装置 |
JP3844613B2 (ja) | 1998-04-28 | 2006-11-15 | 株式会社半導体エネルギー研究所 | 薄膜トランジスタ回路およびそれを用いた表示装置 |
GB9817745D0 (en) * | 1998-08-15 | 1998-10-14 | Philips Electronics Nv | Manufacture of electronic devices comprising thin-film circuit elements |
US6204521B1 (en) | 1998-08-28 | 2001-03-20 | Micron Technology, Inc. | Thin film transistors |
SE523918C2 (sv) * | 1999-01-25 | 2004-06-01 | Appliedsensor Sweden Ab | Förfarande för framställning av integrerade sensorgrupper på ett gemensamt substrat samt en mask för användning vid förfarandet |
KR100312260B1 (ko) * | 1999-05-25 | 2001-11-03 | 구본준, 론 위라하디락사 | 액정표시장치 및 그 제조방법 |
US6780687B2 (en) * | 2000-01-28 | 2004-08-24 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device having a heat absorbing layer |
US6872607B2 (en) * | 2000-03-21 | 2005-03-29 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device |
US6831299B2 (en) * | 2000-11-09 | 2004-12-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US7270724B2 (en) | 2000-12-13 | 2007-09-18 | Uvtech Systems, Inc. | Scanning plasma reactor |
US6773683B2 (en) * | 2001-01-08 | 2004-08-10 | Uvtech Systems, Inc. | Photocatalytic reactor system for treating flue effluents |
DE10137830A1 (de) * | 2001-08-02 | 2003-02-27 | Infineon Technologies Ag | Verfahren zum Herstellen einer selbstjustierten Struktur auf einem Halbleiter-Wafer |
US6667215B2 (en) | 2002-05-02 | 2003-12-23 | 3M Innovative Properties | Method of making transistors |
NL1025475C2 (nl) * | 2004-02-12 | 2005-08-15 | C2V | Werkwijze voor het vervaardigen van een inrichting en inrichting vervaardigd volgens zo een werkwijze. |
US8008718B2 (en) * | 2004-12-14 | 2011-08-30 | Sharp Kabushiki Kaisha | Semiconductor device and production method thereof |
TWI396916B (zh) * | 2009-07-17 | 2013-05-21 | Chunghwa Picture Tubes Ltd | 薄膜電晶體陣列基板之製作方法 |
JP5500907B2 (ja) * | 2009-08-21 | 2014-05-21 | 株式会社日立製作所 | 半導体装置およびその製造方法 |
KR101084261B1 (ko) * | 2010-03-17 | 2011-11-16 | 삼성모바일디스플레이주식회사 | 박막 트랜지스터, 이를 구비한 표시 장치, 및 그 제조 방법들 |
KR20230060581A (ko) * | 2021-10-27 | 2023-05-08 | 삼성디스플레이 주식회사 | 박막 트랜지스터 어레이 기판 및 그 제조 방법 |
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JPS58170067A (ja) * | 1982-03-31 | 1983-10-06 | Fujitsu Ltd | 薄膜トランジスタの製造方法 |
US4727044A (en) * | 1984-05-18 | 1988-02-23 | Semiconductor Energy Laboratory Co., Ltd. | Method of making a thin film transistor with laser recrystallized source and drain |
FR2590409B1 (fr) * | 1985-11-15 | 1987-12-11 | Commissariat Energie Atomique | Procede de fabrication d'un transistor en couches minces a grille auto-alignee par rapport au drain et a la source de celui-ci et transistor obtenu par le procede |
JPS62119974A (ja) * | 1985-11-19 | 1987-06-01 | Sharp Corp | 薄膜トランジスタの製造方法 |
JPS62152174A (ja) * | 1985-12-25 | 1987-07-07 | Matsushita Electric Ind Co Ltd | 薄膜トランジスタの製造方法 |
JPH0622245B2 (ja) * | 1986-05-02 | 1994-03-23 | 富士ゼロックス株式会社 | 薄膜トランジスタの製造方法 |
US4678542A (en) * | 1986-07-25 | 1987-07-07 | Energy Conversion Devices, Inc. | Self-alignment process for thin film diode array fabrication |
JPS6379379A (ja) * | 1986-09-22 | 1988-04-09 | Fujitsu Ltd | 自児整合型薄膜トランジスタの製造方法 |
JPH0242761A (ja) * | 1988-04-20 | 1990-02-13 | Matsushita Electric Ind Co Ltd | アクティブマトリクス基板の製造方法 |
GB8812235D0 (en) * | 1988-05-24 | 1988-06-29 | Jones B L | Manufacturing electronic devices |
NL8801379A (nl) * | 1988-05-30 | 1989-12-18 | Imec Inter Uni Micro Electr | Werkwijze voor het vervaardigen van een dunne-filmtransistor en een dergelijke dunne-filmtransistor. |
US5053353A (en) * | 1988-11-21 | 1991-10-01 | Harris Corporation | Fabricating dielectric isolation of SOI island side wall for reducing leakage current |
GB9113979D0 (en) * | 1991-06-28 | 1991-08-14 | Philips Electronic Associated | Thin-film transistors and their manufacture |
-
1991
- 1991-06-28 GB GB919114018A patent/GB9114018D0/en active Pending
-
1992
- 1992-05-12 TW TW081103693A patent/TW232088B/zh active
- 1992-06-19 DE DE69216311T patent/DE69216311T2/de not_active Expired - Fee Related
- 1992-06-19 EP EP92201808A patent/EP0523768B1/en not_active Expired - Lifetime
- 1992-06-23 US US07/902,642 patent/US5264383A/en not_active Expired - Fee Related
- 1992-06-25 KR KR1019920011070A patent/KR100260063B1/ko not_active Expired - Fee Related
- 1992-06-25 CA CA002072264A patent/CA2072264A1/en not_active Abandoned
- 1992-06-25 JP JP4167813A patent/JPH05190568A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0523768A3 (en) | 1993-06-16 |
CA2072264A1 (en) | 1992-12-29 |
US5264383A (en) | 1993-11-23 |
EP0523768B1 (en) | 1997-01-02 |
EP0523768A2 (en) | 1993-01-20 |
KR100260063B1 (ko) | 2000-07-01 |
JPH05190568A (ja) | 1993-07-30 |
DE69216311D1 (de) | 1997-02-13 |
GB9114018D0 (en) | 1991-08-14 |
DE69216311T2 (de) | 1997-06-12 |
KR930001504A (ko) | 1993-01-16 |