ATE453247T1 - Integrierte nitridbasierte akustikwellenbauelemente und verfahren zu deren herstellung - Google Patents

Integrierte nitridbasierte akustikwellenbauelemente und verfahren zu deren herstellung

Info

Publication number
ATE453247T1
ATE453247T1 AT04716159T AT04716159T ATE453247T1 AT E453247 T1 ATE453247 T1 AT E453247T1 AT 04716159 T AT04716159 T AT 04716159T AT 04716159 T AT04716159 T AT 04716159T AT E453247 T1 ATE453247 T1 AT E453247T1
Authority
AT
Austria
Prior art keywords
nitride
nitride epitaxial
electronic device
production
acoustic wave
Prior art date
Application number
AT04716159T
Other languages
English (en)
Inventor
Adam William Saxler
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc filed Critical Cree Inc
Application granted granted Critical
Publication of ATE453247T1 publication Critical patent/ATE453247T1/de

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders; Supports
    • H03H9/0538Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0542Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02228Guided bulk acoustic wave devices or Lamb wave devices having interdigital transducers situated in parallel planes on either side of a piezoelectric layer
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02535Details of surface acoustic wave devices
    • H03H9/02543Characteristics of substrate, e.g. cutting angles
    • H03H9/02574Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02535Details of surface acoustic wave devices
    • H03H9/0296Surface acoustic wave [SAW] devices having both acoustic and non-acoustic properties
    • H03H9/02976Surface acoustic wave [SAW] devices having both acoustic and non-acoustic properties with semiconductor devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N39/00Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Element Separation (AREA)
  • Recrystallisation Techniques (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Magnetic Ceramics (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
AT04716159T 2003-03-03 2004-03-01 Integrierte nitridbasierte akustikwellenbauelemente und verfahren zu deren herstellung ATE453247T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/378,331 US7112860B2 (en) 2003-03-03 2003-03-03 Integrated nitride-based acoustic wave devices and methods of fabricating integrated nitride-based acoustic wave devices
PCT/US2004/006232 WO2004079904A2 (en) 2003-03-03 2004-03-01 Integrated nitride-based acoustic wave devices and methods of fabricating integrated nitride-based acoustic wave devices

Publications (1)

Publication Number Publication Date
ATE453247T1 true ATE453247T1 (de) 2010-01-15

Family

ID=32926467

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04716159T ATE453247T1 (de) 2003-03-03 2004-03-01 Integrierte nitridbasierte akustikwellenbauelemente und verfahren zu deren herstellung

Country Status (9)

Country Link
US (3) US7112860B2 (de)
EP (1) EP1599938B1 (de)
JP (1) JP4740836B2 (de)
KR (1) KR101065096B1 (de)
CN (1) CN100557966C (de)
AT (1) ATE453247T1 (de)
CA (1) CA2516916C (de)
DE (1) DE602004024764D1 (de)
WO (1) WO2004079904A2 (de)

Families Citing this family (170)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7112860B2 (en) * 2003-03-03 2006-09-26 Cree, Inc. Integrated nitride-based acoustic wave devices and methods of fabricating integrated nitride-based acoustic wave devices
US7898047B2 (en) * 2003-03-03 2011-03-01 Samsung Electronics Co., Ltd. Integrated nitride and silicon carbide-based devices and methods of fabricating integrated nitride-based devices
US7101742B2 (en) 2003-08-12 2006-09-05 Taiwan Semiconductor Manufacturing Company, Ltd. Strained channel complementary field-effect transistors and methods of manufacture
US7064359B2 (en) * 2003-08-20 2006-06-20 Matsushita Electric Industrial Co., Ltd. Switching semiconductor device and switching circuit
WO2006006587A1 (ja) * 2004-07-12 2006-01-19 Niigata University ガス検知方法およびガスセンサ
TWI296383B (en) * 2004-09-14 2008-05-01 Ind Tech Res Inst Surface acoustic wave touch panel and system of the same
KR100616621B1 (ko) * 2004-09-24 2006-08-28 삼성전기주식회사 질화물계 반도체 장치 및 그 제조 방법
US6928878B1 (en) * 2004-09-28 2005-08-16 Rosemount Aerospace Inc. Pressure sensor
US8441030B2 (en) * 2004-09-30 2013-05-14 International Rectifier Corporation III-nitride multi-channel heterojunction interdigitated rectifier
JP4424288B2 (ja) * 2004-12-20 2010-03-03 セイコーエプソン株式会社 弾性表面波装置の製造方法および弾性表面波装置
JP4841844B2 (ja) * 2005-01-05 2011-12-21 三菱電機株式会社 半導体素子
EP1864338A4 (de) * 2005-02-04 2010-01-20 Seoul Opto Device Co Ltd Lichtemittierendes bauelement mit mehreren lichtemittierenden zellen und herstellungsverfahren dafür
JP2006269862A (ja) * 2005-03-25 2006-10-05 Oki Electric Ind Co Ltd 半導体装置形成用ウエハ、その製造方法、および電界効果型トランジスタ
JP4986406B2 (ja) * 2005-03-31 2012-07-25 住友電工デバイス・イノベーション株式会社 半導体装置の製造方法
JP4781757B2 (ja) * 2005-09-05 2011-09-28 日本電信電話株式会社 弾性表面波デバイスおよびその作製方法
KR100661602B1 (ko) * 2005-12-09 2006-12-26 삼성전기주식회사 수직 구조 질화갈륨계 led 소자의 제조방법
US7821034B2 (en) * 2006-01-09 2010-10-26 International Rectifier Corporation Integrated III-nitride devices
US8809907B2 (en) * 2006-03-14 2014-08-19 Northrop Grumman Systems Corporation Leakage barrier for GaN based HEMT active device
US7495370B1 (en) * 2006-05-04 2009-02-24 Lockheed Martin Corporation Hybrid transducer
JP4282708B2 (ja) * 2006-10-20 2009-06-24 株式会社東芝 窒化物系半導体装置
WO2008112185A1 (en) * 2007-03-09 2008-09-18 The Regents Of The University Of California Method to fabricate iii-n field effect transistors using ion implantation with reduced dopant activation and damage recovery temperature
US7851333B2 (en) * 2007-03-15 2010-12-14 Infineon Technologies Ag Apparatus comprising a device and method for producing it
US7982363B2 (en) * 2007-05-14 2011-07-19 Cree, Inc. Bulk acoustic device and method for fabricating
US7875537B2 (en) * 2007-08-29 2011-01-25 Cree, Inc. High temperature ion implantation of nitride based HEMTs
US7795642B2 (en) 2007-09-14 2010-09-14 Transphorm, Inc. III-nitride devices with recessed gates
US7915643B2 (en) 2007-09-17 2011-03-29 Transphorm Inc. Enhancement mode gallium nitride power devices
US7800132B2 (en) * 2007-10-25 2010-09-21 Northrop Grumman Systems Corporation High electron mobility transistor semiconductor device having field mitigating plate and fabrication method thereof
US8076699B2 (en) * 2008-04-02 2011-12-13 The Hong Kong Univ. Of Science And Technology Integrated HEMT and lateral field-effect rectifier combinations, methods, and systems
US8519438B2 (en) 2008-04-23 2013-08-27 Transphorm Inc. Enhancement mode III-N HEMTs
US7985986B2 (en) 2008-07-31 2011-07-26 Cree, Inc. Normally-off semiconductor devices
US8289065B2 (en) 2008-09-23 2012-10-16 Transphorm Inc. Inductive load power switching circuits
JP2010118556A (ja) * 2008-11-13 2010-05-27 Furukawa Electric Co Ltd:The 半導体装置および半導体装置の製造方法
US7898004B2 (en) 2008-12-10 2011-03-01 Transphorm Inc. Semiconductor heterostructure diodes
US8742459B2 (en) 2009-05-14 2014-06-03 Transphorm Inc. High voltage III-nitride semiconductor devices
US8304271B2 (en) * 2009-05-20 2012-11-06 Jenn Hwa Huang Integrated circuit having a bulk acoustic wave device and a transistor
US8390000B2 (en) 2009-08-28 2013-03-05 Transphorm Inc. Semiconductor devices with field plates
JP5471379B2 (ja) * 2009-12-04 2014-04-16 株式会社村田製作所 圧電デバイスの製造方法
JP2011124738A (ja) * 2009-12-10 2011-06-23 Murata Mfg Co Ltd 圧電デバイスの製造方法
US8389977B2 (en) 2009-12-10 2013-03-05 Transphorm Inc. Reverse side engineered III-nitride devices
CN102142452A (zh) * 2010-09-29 2011-08-03 苏州英诺迅科技有限公司 一种基于氮化镓材料的单异质结声电荷输运延迟线
CN102142451A (zh) * 2010-09-29 2011-08-03 苏州英诺迅科技有限公司 一种基于氮化镓材料的双异质结声电荷输运延迟线
US8742460B2 (en) 2010-12-15 2014-06-03 Transphorm Inc. Transistors with isolation regions
US8643062B2 (en) 2011-02-02 2014-02-04 Transphorm Inc. III-N device structures and methods
US8772842B2 (en) 2011-03-04 2014-07-08 Transphorm, Inc. Semiconductor diodes with low reverse bias currents
US8716141B2 (en) 2011-03-04 2014-05-06 Transphorm Inc. Electrode configurations for semiconductor devices
CN102184933A (zh) * 2011-04-12 2011-09-14 东南大学 一种自支撑氮化镓双异质结声电荷输运延迟线
US8470652B1 (en) 2011-05-11 2013-06-25 Hrl Laboratories, Llc Monolithic integration of group III nitride enhancement layers
JP2013004572A (ja) * 2011-06-13 2013-01-07 Mitsubishi Electric Corp 半導体装置の製造方法
KR101616156B1 (ko) * 2011-07-19 2016-04-27 한국전자통신연구원 질화물 전자소자 및 그 제조 방법
KR101781553B1 (ko) * 2011-08-22 2017-09-26 삼성전자주식회사 용량성 트랜스듀서와 그 제조 및 동작방법
US8901604B2 (en) 2011-09-06 2014-12-02 Transphorm Inc. Semiconductor devices with guard rings
US9257547B2 (en) 2011-09-13 2016-02-09 Transphorm Inc. III-N device structures having a non-insulating substrate
US8598937B2 (en) 2011-10-07 2013-12-03 Transphorm Inc. High power semiconductor electronic components with increased reliability
JP5678866B2 (ja) * 2011-10-31 2015-03-04 株式会社デンソー 半導体装置およびその製造方法
US8884308B2 (en) 2011-11-29 2014-11-11 Taiwan Semiconductor Manufacturing Company, Ltd. High electron mobility transistor structure with improved breakdown voltage performance
US9165766B2 (en) 2012-02-03 2015-10-20 Transphorm Inc. Buffer layer structures suited for III-nitride devices with foreign substrates
WO2013134432A1 (en) * 2012-03-06 2013-09-12 Soraa, Inc. Light emitting diodes with low refractive index material layers to reduce light guiding effects
US9093366B2 (en) 2012-04-09 2015-07-28 Transphorm Inc. N-polar III-nitride transistors
US9184275B2 (en) 2012-06-27 2015-11-10 Transphorm Inc. Semiconductor devices with integrated hole collectors
KR20140012445A (ko) * 2012-07-20 2014-02-03 삼성전자주식회사 질화물계 반도체 소자 및 이의 제조방법
JP2014086673A (ja) * 2012-10-26 2014-05-12 Mitsubishi Electric Corp モノリシック集積回路
JP6522521B2 (ja) 2013-02-15 2019-05-29 トランスフォーム インコーポレーテッド 半導体デバイスの電極及びその製造方法
US9087718B2 (en) 2013-03-13 2015-07-21 Transphorm Inc. Enhancement-mode III-nitride devices
US9245992B2 (en) 2013-03-15 2016-01-26 Transphorm Inc. Carbon doping semiconductor devices
CN103206636B (zh) * 2013-04-22 2015-05-20 贵州光浦森光电有限公司 一种led灯泡的生产方法
WO2015009514A1 (en) 2013-07-19 2015-01-22 Transphorm Inc. Iii-nitride transistor including a p-type depleting layer
US9590048B2 (en) * 2013-10-31 2017-03-07 Infineon Technologies Austria Ag Electronic device
JP2015126034A (ja) * 2013-12-25 2015-07-06 サンケン電気株式会社 電界効果型半導体素子
CN104600162B (zh) * 2014-03-24 2016-01-27 上海卓霖半导体科技有限公司 基于lao衬底的非极性蓝光led外延片的制备方法
US9571061B2 (en) 2014-06-06 2017-02-14 Akoustis, Inc. Integrated circuit configured with two or more single crystal acoustic resonator devices
US9673384B2 (en) 2014-06-06 2017-06-06 Akoustis, Inc. Resonance circuit with a single crystal capacitor dielectric material
US9537465B1 (en) 2014-06-06 2017-01-03 Akoustis, Inc. Acoustic resonator device with single crystal piezo material and capacitor on a bulk substrate
US9318593B2 (en) 2014-07-21 2016-04-19 Transphorm Inc. Forming enhancement mode III-nitride devices
US9912314B2 (en) 2014-07-25 2018-03-06 Akoustics, Inc. Single crystal acoustic resonator and bulk acoustic wave filter
US9805966B2 (en) 2014-07-25 2017-10-31 Akoustis, Inc. Wafer scale packaging
US9716581B2 (en) 2014-07-31 2017-07-25 Akoustis, Inc. Mobile communication device configured with a single crystal piezo resonator structure
US9917568B2 (en) 2014-08-26 2018-03-13 Akoustis, Inc. Membrane substrate structure for single crystal acoustic resonator device
US9536967B2 (en) 2014-12-16 2017-01-03 Transphorm Inc. Recessed ohmic contacts in a III-N device
US9536966B2 (en) 2014-12-16 2017-01-03 Transphorm Inc. Gate structures for III-N devices
GB2549734B (en) 2016-04-26 2020-01-01 Facebook Tech Llc A display
EP3345178B1 (de) * 2015-09-02 2021-03-10 Facebook Technologies, LLC Montage von halbleiterbauelementen
CN105244378B (zh) * 2015-11-17 2018-04-27 成都海威华芯科技有限公司 一种GaN器件及其制作方法
DE102015120654A1 (de) * 2015-11-27 2017-06-01 Snaptrack, Inc. Elektroakustischer Wandler mit verringerten Nichtlinearitäten zweiter Ordnung
CN108604597B (zh) 2016-01-15 2021-09-17 创世舫电子有限公司 具有al(1-x)sixo栅极绝缘体的增强模式iii-氮化物器件
US9885888B2 (en) * 2016-02-08 2018-02-06 International Business Machines Corporation Integrated microwave-to-optical single-photon transducer with strain-induced electro-optic material
WO2017153911A1 (en) * 2016-03-10 2017-09-14 RG Innovations PTE LTD. Microelectronic sensor for use in hypersensitive microphones
US11424728B2 (en) 2016-03-11 2022-08-23 Akoustis, Inc. Piezoelectric acoustic resonator manufactured with piezoelectric thin film transfer process
US10615773B2 (en) * 2017-09-11 2020-04-07 Akoustis, Inc. Wireless communication infrastructure system configured with a single crystal piezo resonator and filter structure
US11451213B2 (en) 2016-03-11 2022-09-20 Akoustis, Inc. 5G n79 Wi-Fi acoustic triplexer circuit
CN105609499B (zh) * 2016-03-11 2018-12-25 成都海威华芯科技有限公司 一种GaN集成器件
US10581398B2 (en) 2016-03-11 2020-03-03 Akoustis, Inc. Method of manufacture for single crystal acoustic resonator devices using micro-vias
US11558023B2 (en) 2016-03-11 2023-01-17 Akoustis, Inc. Method for fabricating an acoustic resonator device
US10217930B1 (en) 2016-03-11 2019-02-26 Akoustis, Inc. Method of manufacture for single crystal acoustic resonator devices using micro-vias
US10355659B2 (en) 2016-03-11 2019-07-16 Akoustis, Inc. Piezoelectric acoustic resonator manufactured with piezoelectric thin film transfer process
US11316496B2 (en) 2016-03-11 2022-04-26 Akoustis, Inc. Method and structure for high performance resonance circuit with single crystal piezoelectric capacitor dielectric material
US10979024B2 (en) 2016-03-11 2021-04-13 Akoustis, Inc. 5.2 GHz Wi-Fi coexistence acoustic wave resonator RF filter circuit
US11184079B2 (en) 2016-03-11 2021-11-23 Akoustis, Inc. Front end module for 5.5 GHz Wi-Fi acoustic wave resonator RF filter circuit
US11689186B2 (en) 2016-03-11 2023-06-27 Akoustis, Inc. 5.5 GHz Wi-Fi 5G coexistence acoustic wave resonator RF filter circuit
US11070184B2 (en) 2016-03-11 2021-07-20 Akoustis, Inc. Piezoelectric acoustic resonator manufactured with piezoelectric thin film transfer process
US11411168B2 (en) 2017-10-16 2022-08-09 Akoustis, Inc. Methods of forming group III piezoelectric thin films via sputtering
US11683021B2 (en) 2016-03-11 2023-06-20 Akoustis, Inc. 4.5G 3.55-3.7 GHz band bulk acoustic wave resonator RF filter circuit
US10523180B2 (en) 2016-03-11 2019-12-31 Akoustis, Inc. Method and structure for single crystal acoustic resonator devices using thermal recrystallization
US10979022B2 (en) 2016-03-11 2021-04-13 Akoustis, Inc. 5.2 GHz Wi-Fi acoustic wave resonator RF filter circuit
US11063576B2 (en) 2016-03-11 2021-07-13 Akoustis, Inc. Front end module for 5.6 GHz Wi-Fi acoustic wave resonator RF filter circuit
US10985732B2 (en) 2016-03-11 2021-04-20 Akoustis, Inc. 5.6 GHz Wi-Fi acoustic wave resonator RF filter circuit
US11177868B2 (en) 2016-03-11 2021-11-16 Akoustis, Inc. Front end module for 6.5 GHz Wi-Fi acoustic wave resonator RF filter circuit
US11677372B2 (en) 2016-03-11 2023-06-13 Akoustis, Inc. Piezoelectric acoustic resonator with dielectric protective layer manufactured with piezoelectric thin film transfer process
US11411169B2 (en) 2017-10-16 2022-08-09 Akoustis, Inc. Methods of forming group III piezoelectric thin films via removal of portions of first sputtered material
US11736177B2 (en) 2016-03-11 2023-08-22 Akoustis Inc. Front end modules for 5.6 GHz and 6.6 GHz Wi-Fi acoustic wave resonator RF filter circuits
US11581866B2 (en) 2016-03-11 2023-02-14 Akoustis, Inc. RF acoustic wave resonators integrated with high electron mobility transistors including a shared piezoelectric/buffer layer and methods of forming the same
US10979023B2 (en) 2016-03-11 2021-04-13 Akoustis, Inc. 5.9 GHz c-V2X and DSRC acoustic wave resonator RF filter circuit
US11476825B2 (en) 2016-03-11 2022-10-18 Akoustis, Inc. 5.5 GHz Wi-Fi coexistence acoustic wave resonator RF filter circuit
US20210257993A1 (en) 2016-03-11 2021-08-19 Akoustis, Inc. Acoustic wave resonator rf filter circuit device
US11356071B2 (en) 2016-03-11 2022-06-07 Akoustis, Inc. Piezoelectric acoustic resonator with improved TCF manufactured with piezoelectric thin film transfer process
US10673513B2 (en) 2016-03-11 2020-06-02 Akoustis, Inc. Front end module for 5.2 GHz Wi-Fi acoustic wave resonator RF filter circuit
US11418169B2 (en) 2016-03-11 2022-08-16 Akoustis, Inc. 5G n41 2.6 GHz band acoustic wave resonator RF filter circuit
US10979026B2 (en) 2016-03-11 2021-04-13 Akoustis, Inc. 5.5 GHz Wi-fi 5G coexistence acoustic wave resonator RF filter circuit
US11394451B2 (en) 2016-03-11 2022-07-19 Akoustis, Inc. Front end module for 6.1 GHz Wi-Fi acoustic wave resonator RF filter circuit
US10979025B2 (en) 2016-03-11 2021-04-13 Akoustis, Inc. 5G band n79 acoustic wave resonator RF filter circuit
US11832521B2 (en) 2017-10-16 2023-11-28 Akoustis, Inc. Methods of forming group III-nitride single crystal piezoelectric thin films using ordered deposition and stress neutral template layers
US10224401B2 (en) 2016-05-31 2019-03-05 Transphorm Inc. III-nitride devices including a graded depleting layer
TWI728130B (zh) * 2016-06-19 2021-05-21 英商Iqe有限公司 用於射頻濾波器應用的磊晶 AlN/cREO 結構
EP3482495B1 (de) * 2016-07-11 2020-04-15 Epitronic Holdings Pte. Ltd. Oberflächenwellen-rfid-sensor für hämodynamische wearables
CN106130501B (zh) * 2016-07-29 2018-12-11 中国电子科技集团公司第十三研究所 Ⅲ族氮化物薄膜体声波谐振器和滤波器
US10676349B1 (en) 2016-08-12 2020-06-09 Sitime Corporation MEMS resonator
US11895920B2 (en) 2016-08-15 2024-02-06 Akoustis, Inc. Methods of forming group III piezoelectric thin films via removal of portions of first sputtered material
CN109891748A (zh) * 2016-08-22 2019-06-14 艾皮乔尼克控股有限公司 用于材料和结构感测的表面声波rfid传感器
US10110188B2 (en) 2016-11-02 2018-10-23 Akoustis, Inc. Structure and method of manufacture for acoustic resonator or filter devices using improved fabrication conditions and perimeter structure modifications
CN106603032B (zh) * 2016-12-27 2019-08-02 成都海威华芯科技有限公司 一种AlN SAW光电集成器件的制作方法
US10431580B1 (en) * 2017-01-12 2019-10-01 Akoustis, Inc. Monolithic single chip integrated radio frequency front end module configured with single crystal acoustic filter devices
DE102017101877B4 (de) 2017-01-31 2022-02-03 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Einzelphotonenquelle, Verfahren zur Herstellung einer Einzelphotonenquelle und Methode zur kontrollierten Erzeugung von Photonen
TWI679747B (zh) * 2017-02-28 2019-12-11 穩懋半導體股份有限公司 聲波元件與變容二極體整合結構暨聲波元件、變容二極體與功率放大器整合結構及其製造方法
CN106898547A (zh) * 2017-03-31 2017-06-27 成都海威华芯科技有限公司 一种GaN声电集成器件的制作方法
DE102017112659B4 (de) * 2017-06-08 2020-06-10 RF360 Europe GmbH Elektrischer Bauelementwafer und elektrisches Bauelement
CN109427975B (zh) * 2017-08-23 2021-01-22 京东方科技集团股份有限公司 柔性基板及其制备方法、检测弯曲的方法以及柔性显示装置
US10332876B2 (en) * 2017-09-14 2019-06-25 Infineon Technologies Austria Ag Method of forming compound semiconductor body
US11856858B2 (en) 2017-10-16 2023-12-26 Akoustis, Inc. Methods of forming doped crystalline piezoelectric thin films via MOCVD and related doped crystalline piezoelectric thin films
WO2019082806A1 (ja) * 2017-10-23 2019-05-02 京セラ株式会社 弾性波素子
CN108111142B (zh) * 2018-01-24 2020-11-10 清华大学 一种基于碳化硅衬底/氧化锌或掺杂氧化锌薄膜的声表面波器件及其制备方法
US11557716B2 (en) 2018-02-20 2023-01-17 Akoustis, Inc. Method and structure of single crystal electronic devices with enhanced strain interface regions by impurity introduction
JP7316757B2 (ja) 2018-02-23 2023-07-28 ローム株式会社 半導体装置
CN109103328B (zh) * 2018-03-23 2023-06-20 北京航天微电科技有限公司 一种声表面波芯片及其制作方法
CN208014728U (zh) * 2018-03-29 2018-10-26 昆山工研院新型平板显示技术中心有限公司 显示装置及其发光二极管芯片
US10868216B2 (en) 2018-03-29 2020-12-15 Kunshan New Flat Panel Display Technology Center Co., Ltd. Display devices, light emitting diode chips and methods for manufacturing the same
CN108628038B (zh) * 2018-06-28 2021-02-26 京东方科技集团股份有限公司 发光晶体管及其发光方法、阵列基板和显示装置
US10516043B1 (en) * 2018-07-19 2019-12-24 Cree, Inc. Monolithic microwave integrated circuits having both enhancement-mode and depletion mode transistors
WO2020046995A1 (en) 2018-08-27 2020-03-05 Akoustis, Inc. High power bulk acoustic wave resonator filter devices
JP7163965B2 (ja) * 2018-09-20 2022-11-01 株式会社村田製作所 弾性波装置
US11309450B2 (en) 2018-12-20 2022-04-19 Analog Devices, Inc. Hybrid semiconductor photodetector assembly
US11302835B2 (en) 2019-01-08 2022-04-12 Analog Devices, Inc. Semiconductor photodetector assembly
US11463069B2 (en) 2019-03-25 2022-10-04 Skyworks Solutions, Inc. Acoustic wave filters with isolation
WO2021055265A1 (en) * 2019-09-20 2021-03-25 The Government Of The United States Of America, As Represented By The Secretary Of The Navy Multifunctional integrated acoustic devices and systems using epitaxial materials
JP7392734B2 (ja) * 2019-11-06 2023-12-06 株式会社村田製作所 弾性波装置
US11618968B2 (en) 2020-02-07 2023-04-04 Akoustis, Inc. Apparatus including horizontal flow reactor with a central injector column having separate conduits for low-vapor pressure metalorganic precursors and other precursors for formation of piezoelectric layers on wafers
CN111653565B (zh) * 2020-03-11 2023-03-17 厦门市三安集成电路有限公司 一种高阻抗半导体电阻器结构及其制备方法
CN111446329A (zh) * 2020-03-20 2020-07-24 苏州巧云信息科技有限公司 一种新型红外探测器及其制备方法
US11437367B2 (en) * 2020-04-21 2022-09-06 Qualcomm Incorporated Heterogeneous integrated wideband high electron mobility transistor power amplifier with a single-crystal acoustic resonator/filter
CN114070235A (zh) * 2020-08-06 2022-02-18 联华电子股份有限公司 半导体模块及其制造方法
US11496108B2 (en) 2020-08-17 2022-11-08 Akoustis, Inc. RF BAW resonator filter architecture for 6.5GHz Wi-Fi 6E coexistence and other ultra-wideband applications
CN112071869B (zh) * 2020-08-28 2022-09-30 深圳市奥伦德元器件有限公司 用于固态继电器的光伏驱动器及其制备方法
CN115000169A (zh) * 2020-08-28 2022-09-02 英诺赛科(珠海)科技有限公司 半导体装置结构
US11848662B2 (en) 2020-09-11 2023-12-19 Raytheon Company Tunable monolithic group III-nitride filter banks
US11901880B2 (en) 2021-01-18 2024-02-13 Akoustis, Inc. 5 and 6 GHz Wi-Fi coexistence acoustic wave resonator RF diplexer circuit
CN113794460B (zh) * 2021-09-17 2024-02-23 中国科学技术大学 纳米声子晶体及其制备方法
CN113904645B (zh) * 2021-10-26 2023-07-25 中国科学院上海微系统与信息技术研究所 一种氮化铝/碳化硅复合声波谐振器的制备方法及谐振器
TWI802380B (zh) * 2022-04-21 2023-05-11 立積電子股份有限公司 聲波裝置及其製造方法
CN115001429B (zh) * 2022-08-03 2022-11-25 迈感微电子(上海)有限公司 一种滤波器的制备方法
US20240128336A1 (en) * 2022-10-14 2024-04-18 Wolfspeed, Inc. Methods of forming semiconductor structures and resulting semiconductor structures
CN117580438B (zh) * 2023-12-28 2024-04-05 苏州达波新材科技有限公司 一种基于第三代半导体的集成器件及其制作方法
CN117690925B (zh) * 2024-02-01 2024-05-14 浙江大学 GaN基器件的单片集成结构及其制备方法

Family Cites Families (82)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US34861A (en) * 1862-04-01 Improved washing-machine
US3955160A (en) * 1975-04-30 1976-05-04 Rca Corporation Surface acoustic wave device
JPS58197910A (ja) 1982-05-14 1983-11-17 Hitachi Ltd 弾性表面波素子
JPS62260420A (ja) * 1986-04-28 1987-11-12 シ−メンス、アクチエンゲゼルシヤフト 集積nmos回路装置
US5011549A (en) 1987-10-26 1991-04-30 North Carolina State University Homoepitaxial growth of Alpha-SiC thin films and semiconductor devices fabricated thereon
US4912064A (en) 1987-10-26 1990-03-27 North Carolina State University Homoepitaxial growth of alpha-SiC thin films and semiconductor devices fabricated thereon
US4866005A (en) 1987-10-26 1989-09-12 North Carolina State University Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide
US4912063A (en) 1987-10-26 1990-03-27 North Carolina State University Growth of beta-sic thin films and semiconductor devices fabricated thereon
US4884001A (en) 1988-12-13 1989-11-28 United Technologies Corporation Monolithic electro-acoustic device having an acoustic charge transport device integrated with a transistor
US4946547A (en) 1989-10-13 1990-08-07 Cree Research, Inc. Method of preparing silicon carbide surfaces for crystal growth
US5210051A (en) 1990-03-27 1993-05-11 Cree Research, Inc. High efficiency light emitting diodes from bipolar gallium nitride
US5292501A (en) 1990-06-25 1994-03-08 Degenhardt Charles R Use of a carboxy-substituted polymer to inhibit plaque formation without tooth staining
US5200022A (en) 1990-10-03 1993-04-06 Cree Research, Inc. Method of improving mechanically prepared substrate surfaces of alpha silicon carbide for deposition of beta silicon carbide thereon and resulting product
US5155062A (en) 1990-12-20 1992-10-13 Cree Research, Inc. Method for silicon carbide chemical vapor deposition using levitated wafer system
US5270554A (en) * 1991-06-14 1993-12-14 Cree Research, Inc. High power high frequency metal-semiconductor field-effect transistor formed in silicon carbide
US5265267A (en) * 1991-08-29 1993-11-23 Motorola, Inc. Integrated circuit including a surface acoustic wave transformer and a balanced mixer
JPH05183381A (ja) 1991-12-27 1993-07-23 Nippon Steel Corp 高周波回路基板および高周波回路素子
US5389799A (en) * 1992-06-12 1995-02-14 Kabushiki Kaisha Toshiba Semiconductor device
DE4219523A1 (de) * 1992-06-15 1993-12-16 Daimler Benz Ag Monolithisch integrierter Millimeterwellenschaltkreis und Verfahren zu dessen Herstellung
JPH0770736B2 (ja) 1993-03-26 1995-07-31 株式会社ミリウェイブ 可変容量回路
JPH06303088A (ja) * 1993-04-13 1994-10-28 Nippon Steel Corp 高周波回路素子
US5393993A (en) 1993-12-13 1995-02-28 Cree Research, Inc. Buffer structure between silicon carbide and gallium nitride and resulting semiconductor devices
US5523589A (en) * 1994-09-20 1996-06-04 Cree Research, Inc. Vertical geometry light emitting diode with group III nitride active layer and extended lifetime
US5592501A (en) 1994-09-20 1997-01-07 Cree Research, Inc. Low-strain laser structures with group III nitride active layers
US5576589A (en) * 1994-10-13 1996-11-19 Kobe Steel Usa, Inc. Diamond surface acoustic wave devices
JPH10284762A (ja) 1995-02-16 1998-10-23 Asahi Chem Ind Co Ltd 表面弾性波を増幅するための積層構造及び増幅器
US5739554A (en) 1995-05-08 1998-04-14 Cree Research, Inc. Double heterojunction light emitting diode with gallium nitride active layer
US6217662B1 (en) 1997-03-24 2001-04-17 Cree, Inc. Susceptor designs for silicon carbide thin films
CN1131548C (zh) * 1997-04-04 2003-12-17 松下电器产业株式会社 半导体装置
JP3047852B2 (ja) 1997-04-04 2000-06-05 松下電器産業株式会社 半導体装置
KR100644470B1 (ko) 1997-07-28 2006-11-13 가부시끼가이샤 도시바 탄성표면파 필터 및 그의 제조방법
US6063186A (en) 1997-12-17 2000-05-16 Cree, Inc. Growth of very uniform silicon carbide epitaxial layers
TW398084B (en) 1998-06-05 2000-07-11 Hewlett Packard Co Multilayered indium-containing nitride buffer layer for nitride epitaxy
US6316793B1 (en) 1998-06-12 2001-11-13 Cree, Inc. Nitride based transistors on semi-insulating silicon carbide substrates
KR100316383B1 (ko) * 1998-10-30 2002-02-19 윤덕용 모노리딕직접회로위에박막또는후막단결정압전소자를집적한단일칩라디오구조및그제조방법
JP3996282B2 (ja) * 1998-11-11 2007-10-24 三洋電機株式会社 炭化珪素半導体装置の製造方法
US6518637B1 (en) * 1999-04-08 2003-02-11 Wayne State University Cubic (zinc-blende) aluminum nitride
US6396080B2 (en) 1999-05-18 2002-05-28 Cree, Inc Semi-insulating silicon carbide without vanadium domination
US6218680B1 (en) 1999-05-18 2001-04-17 Cree, Inc. Semi-insulating silicon carbide without vanadium domination
US6265727B1 (en) 1999-06-09 2001-07-24 Cree Lighting Company Solar blind photodiode having an active region with a larger bandgap than one or both if its surrounding doped regions
JP2001007379A (ja) 1999-06-24 2001-01-12 Sharp Corp 窒化ガリウム系化合物半導体受光素子
US6300706B1 (en) * 1999-07-14 2001-10-09 The United States Of America As Represented By The Secretary Of The Army Compound semiconductor monolithic frequency sources and actuators
JP4850993B2 (ja) 2000-01-25 2012-01-11 古河電気工業株式会社 半導体装置およびその製造方法
US6596079B1 (en) * 2000-03-13 2003-07-22 Advanced Technology Materials, Inc. III-V nitride substrate boule and method of making and using the same
JP2001267555A (ja) * 2000-03-22 2001-09-28 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
GB2366104B (en) * 2000-05-01 2002-10-23 Murata Manufacturing Co Surface acoustic wave device, shear bulk wave transducer, and longitudinal bulk wave transducer
US6686616B1 (en) 2000-05-10 2004-02-03 Cree, Inc. Silicon carbide metal-semiconductor field effect transistors
US6274899B1 (en) * 2000-05-19 2001-08-14 Motorola, Inc. Capacitor electrode having conductive regions adjacent a dielectric post
US20020000584A1 (en) * 2000-06-28 2002-01-03 Motorola, Inc. Semiconductor structure and device including a monocrystalline conducting layer and method for fabricating the same
US6555946B1 (en) * 2000-07-24 2003-04-29 Motorola, Inc. Acoustic wave device and process for forming the same
CN1254026C (zh) * 2000-11-21 2006-04-26 松下电器产业株式会社 通信系统用仪器
US6548333B2 (en) 2000-12-01 2003-04-15 Cree, Inc. Aluminum gallium nitride/gallium nitride high electron mobility transistors having a gate contact on a gallium nitride based cap segment
US6563118B2 (en) * 2000-12-08 2003-05-13 Motorola, Inc. Pyroelectric device on a monocrystalline semiconductor substrate and process for fabricating same
US6569250B2 (en) 2001-01-08 2003-05-27 Cree, Inc. Gas-driven rotation apparatus and method for forming silicon carbide layers
US6828879B2 (en) * 2001-02-16 2004-12-07 Sanyo Electric Co., Ltd. Longitudinal coupled multiple mode surface acoustic wave filter
JP3648462B2 (ja) 2001-04-27 2005-05-18 沖電気工業株式会社 弾性表面波分波器
US6849882B2 (en) 2001-05-11 2005-02-01 Cree Inc. Group-III nitride based high electron mobility transistor (HEMT) with barrier/spacer layer
US6706114B2 (en) 2001-05-21 2004-03-16 Cree, Inc. Methods of fabricating silicon carbide crystals
EP2267784B1 (de) * 2001-07-24 2020-04-29 Cree, Inc. AlGaN/GaN HEMT MIT ISOLIERTEM GATE
US20030022412A1 (en) * 2001-07-25 2003-01-30 Motorola, Inc. Monolithic semiconductor-piezoelectric device structures and electroacoustic charge transport devices
US20030021515A1 (en) * 2001-07-25 2003-01-30 Motorola, Inc. Semiconductor structure employing a multi-path wave guide to concurrently route signals
US20030030119A1 (en) * 2001-08-13 2003-02-13 Motorola, Inc. Structure and method for improved piezo electric coupled component integrated devices
JP3733420B2 (ja) 2002-03-01 2006-01-11 独立行政法人産業技術総合研究所 窒化物半導体材料を用いたヘテロ接合電界効果型トランジスタ
US6797069B2 (en) 2002-04-08 2004-09-28 Cree, Inc. Gas driven planetary rotation apparatus and methods for forming silicon carbide layers
US6936869B2 (en) * 2002-07-09 2005-08-30 International Rectifier Corporation Heterojunction field effect transistors using silicon-germanium and silicon-carbon alloys
US7898047B2 (en) 2003-03-03 2011-03-01 Samsung Electronics Co., Ltd. Integrated nitride and silicon carbide-based devices and methods of fabricating integrated nitride-based devices
US7112860B2 (en) 2003-03-03 2006-09-26 Cree, Inc. Integrated nitride-based acoustic wave devices and methods of fabricating integrated nitride-based acoustic wave devices
US7064359B2 (en) 2003-08-20 2006-06-20 Matsushita Electric Industrial Co., Ltd. Switching semiconductor device and switching circuit
US7045404B2 (en) 2004-01-16 2006-05-16 Cree, Inc. Nitride-based transistors with a protective layer and a low-damage recess and methods of fabrication thereof
US7202528B2 (en) 2004-12-01 2007-04-10 Semisouth Laboratories, Inc. Normally-off integrated JFET power switches in wide bandgap semiconductors and methods of making
EP1734647B1 (de) 2004-08-26 2008-10-22 Matsushita Electric Industrial Co., Ltd. Halbleiterbauelement und modul damit
KR100616621B1 (ko) 2004-09-24 2006-08-28 삼성전기주식회사 질화물계 반도체 장치 및 그 제조 방법
JP2006100645A (ja) 2004-09-30 2006-04-13 Furukawa Electric Co Ltd:The GaN系半導体集積回路
US7265399B2 (en) 2004-10-29 2007-09-04 Cree, Inc. Asymetric layout structures for transistors and methods of fabricating the same
JP2006148546A (ja) 2004-11-19 2006-06-08 Eudyna Devices Inc 増幅回路及びその制御方法、並びに増幅回路モジュール
US20070018199A1 (en) 2005-07-20 2007-01-25 Cree, Inc. Nitride-based transistors and fabrication methods with an etch stop layer
US7548112B2 (en) 2005-07-21 2009-06-16 Cree, Inc. Switch mode power amplifier using MIS-HEMT with field plate extension
US7419892B2 (en) 2005-12-13 2008-09-02 Cree, Inc. Semiconductor devices including implanted regions and protective layers and methods of forming the same
US7569466B2 (en) * 2005-12-16 2009-08-04 International Business Machines Corporation Dual metal gate self-aligned integration
US20070221953A1 (en) * 2006-03-24 2007-09-27 Kozo Sakamoto Semiconductor device
JP5040170B2 (ja) 2006-05-17 2012-10-03 三菱電機株式会社 半導体装置の製造方法
US20080197422A1 (en) * 2007-02-20 2008-08-21 National Central University Planar combined structure of a bipolar junction transistor and N-type/P-type metal semiconductor field-effect transistors and method for forming the same

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US20040173816A1 (en) 2004-09-09
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US7875910B2 (en) 2011-01-25
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US20110114968A1 (en) 2011-05-19
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WO2004079904A3 (en) 2005-01-27
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