JP4986406B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP4986406B2 JP4986406B2 JP2005105163A JP2005105163A JP4986406B2 JP 4986406 B2 JP4986406 B2 JP 4986406B2 JP 2005105163 A JP2005105163 A JP 2005105163A JP 2005105163 A JP2005105163 A JP 2005105163A JP 4986406 B2 JP4986406 B2 JP 4986406B2
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- 239000004065 semiconductor Substances 0.000 title claims description 133
- 238000004519 manufacturing process Methods 0.000 title claims description 38
- 239000000758 substrate Substances 0.000 claims description 63
- 238000000034 method Methods 0.000 claims description 23
- 229910002704 AlGaN Inorganic materials 0.000 claims description 14
- 229910052594 sapphire Inorganic materials 0.000 claims description 9
- 239000010980 sapphire Substances 0.000 claims description 9
- 238000000059 patterning Methods 0.000 claims description 2
- 238000012986 modification Methods 0.000 description 16
- 230000004048 modification Effects 0.000 description 16
- 230000006866 deterioration Effects 0.000 description 13
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 238000005229 chemical vapour deposition Methods 0.000 description 7
- 229910052814 silicon oxide Inorganic materials 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 238000001312 dry etching Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- XCZXGTMEAKBVPV-UHFFFAOYSA-N trimethylgallium Chemical compound C[Ga](C)C XCZXGTMEAKBVPV-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
- H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28575—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28575—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds
- H01L21/28581—Deposition of Schottky electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/6631—Bipolar junction transistors [BJT] with an active layer made of a group 13/15 material
- H01L29/66318—Heterojunction transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/2003—Nitride compounds
Description
10a、40a SiC基板
12、42 GaNバッファ層
12a、42a SiCバッファ層
14、44 GaNドリフト層
14a、44a SiCドリフト層
15、15a、45、45a 第1の半導体層
16 シード層
18 GaNスペーサ層
20 GaN電子制御層
22 GaNコンタクト層
24 キャップ層
25、55 GaN系半導体層
26、56 マスク層
28、58 開口部
30 ソース電極
32 ゲート電極
34 ドレイン電極
48 GaNスペーサ層
50 GaN電子制御層
52 GaNコンタクト層
54 キャップ層
60 エミッタ電極
62 ゲート電極
64 コレクタ電極
70 サファイア基板
72 バッファ層
74 ドリフト層
76 電子制御層
78 コンタクト層
80 キャップ層
82 マスク層
84 ソース電極
86 ゲート電極
88 ドレイン電極
90 開口部
92 マスク層
Claims (2)
- 第1の面と前記第1の面と反対側の第2の面とを有する基板の、前記第1の面上にSiCまたはGaNからなる第1の半導体層を形成する工程と、
前記第1の半導体層上をAlNまたはAlGaN層で覆う工程と、
前記AlNまたはAlGaN層をパターニングして、前記第1の半導体層を露出する開口部を形成する工程と、
前記開口部には成長せず前記パターニングされたAlNまたはAlGaN層上に成長するように、前記AlNまたはAlGaN層をシード層として、側面及び上面を有するGaN系半導体層を選択成長する工程と、
前記GaN系半導体層の前記側面にゲート電極を、前記GaN系半導体層の前記上面にソース電極またはエミッタ電極を、前記第1の半導体層の前記GaN系半導体層が形成された側の面上あるいは前記基板の前記第2の面上にドレイン電極またはコレクタ電極を、形成する工程と、
を有する半導体装置の製造方法。 - 前記基板はSiC基板、サファイア基板、Si基板およびGaNを含む半導体基板のいずれかである請求項1項記載の半導体装置の製造方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005105163A JP4986406B2 (ja) | 2005-03-31 | 2005-03-31 | 半導体装置の製造方法 |
US11/392,549 US7728353B2 (en) | 2005-03-31 | 2006-03-30 | Semiconductor device in which GaN-based semiconductor layer is selectively formed |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005105163A JP4986406B2 (ja) | 2005-03-31 | 2005-03-31 | 半導体装置の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2006286954A JP2006286954A (ja) | 2006-10-19 |
JP2006286954A5 JP2006286954A5 (ja) | 2008-05-08 |
JP4986406B2 true JP4986406B2 (ja) | 2012-07-25 |
Family
ID=37069249
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005105163A Expired - Fee Related JP4986406B2 (ja) | 2005-03-31 | 2005-03-31 | 半導体装置の製造方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7728353B2 (ja) |
JP (1) | JP4986406B2 (ja) |
Families Citing this family (27)
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TWI226139B (en) * | 2002-01-31 | 2005-01-01 | Osram Opto Semiconductors Gmbh | Method to manufacture a semiconductor-component |
KR101058302B1 (ko) * | 2003-01-31 | 2011-08-22 | 오스람 옵토 세미컨덕터스 게엠베하 | 박막 반도체 소자 및 상기 소자의 제조 방법 |
US8524573B2 (en) | 2003-01-31 | 2013-09-03 | Osram Opto Semiconductors Gmbh | Method for separating a semiconductor layer from a substrate by irradiating with laser pulses |
JP5051980B2 (ja) * | 2005-03-31 | 2012-10-17 | 住友電工デバイス・イノベーション株式会社 | 半導体装置 |
WO2007044727A2 (en) * | 2005-10-07 | 2007-04-19 | California Institute Of Technology | Pkr activation via hybridization chain reaction |
JP2008078604A (ja) * | 2006-08-24 | 2008-04-03 | Rohm Co Ltd | Mis型電界効果トランジスタおよびその製造方法 |
US8421119B2 (en) * | 2006-09-13 | 2013-04-16 | Rohm Co., Ltd. | GaN related compound semiconductor element and process for producing the same and device having the same |
JP5134797B2 (ja) * | 2006-09-13 | 2013-01-30 | ローム株式会社 | GaN系半導体素子及びその製造方法並びにGaN系半導体装置 |
JP4999065B2 (ja) * | 2006-11-09 | 2012-08-15 | 古河電気工業株式会社 | パワー半導体素子 |
JP5189771B2 (ja) * | 2007-02-01 | 2013-04-24 | ローム株式会社 | GaN系半導体素子 |
WO2008099843A1 (ja) * | 2007-02-14 | 2008-08-21 | Rohm Co., Ltd. | 窒化物半導体素子および窒化物半導体素子の製造方法 |
JP2008205199A (ja) * | 2007-02-20 | 2008-09-04 | Rohm Co Ltd | GaN系半導体素子の製造方法 |
JP2008226914A (ja) * | 2007-03-08 | 2008-09-25 | Rohm Co Ltd | GaN系半導体素子 |
JP2008227073A (ja) * | 2007-03-12 | 2008-09-25 | Rohm Co Ltd | 窒化物半導体積層構造の形成方法および窒化物半導体素子の製造方法 |
JP5252813B2 (ja) * | 2007-03-15 | 2013-07-31 | 株式会社豊田中央研究所 | 半導体装置の製造方法 |
FR2924270B1 (fr) * | 2007-11-27 | 2010-08-27 | Picogiga Internat | Procede de fabrication d'un dispositif electronique |
US9048302B2 (en) * | 2008-01-11 | 2015-06-02 | The Furukawa Electric Co., Ltd | Field effect transistor having semiconductor operating layer formed with an inclined side wall |
WO2010117987A1 (en) * | 2009-04-08 | 2010-10-14 | Efficient Power Conversion Corporation | Bumped, self-isolated gan transistor chip with electrically isolated back surface |
JP5531538B2 (ja) * | 2009-09-30 | 2014-06-25 | 住友電気工業株式会社 | ヘテロ接合トランジスタ、及びヘテロ接合トランジスタを作製する方法 |
JP2011210780A (ja) * | 2010-03-29 | 2011-10-20 | Oki Electric Industry Co Ltd | GaN−MISトランジスタ、GaN−IGBT、およびこれらの製造方法 |
JP2012160746A (ja) * | 2012-03-26 | 2012-08-23 | Furukawa Electric Co Ltd:The | パワー半導体素子 |
JP6170300B2 (ja) * | 2013-01-08 | 2017-07-26 | 住友化学株式会社 | 窒化物半導体デバイス |
CN107431085B (zh) * | 2015-04-14 | 2019-11-12 | Hrl实验室有限责任公司 | 具有沟槽栅的iii族氮化物晶体管 |
JP6755892B2 (ja) * | 2016-02-08 | 2020-09-16 | パナソニック株式会社 | 半導体装置 |
US20200194615A1 (en) * | 2017-05-05 | 2020-06-18 | The Regents Of The University Of California | Method of removing a substrate |
DE102021204293A1 (de) * | 2021-04-29 | 2022-11-03 | Robert Bosch Gesellschaft mit beschränkter Haftung | Vertikaler transistor und verfahren zum herstellen desselben |
WO2023162521A1 (ja) * | 2022-02-22 | 2023-08-31 | ローム株式会社 | 窒化物半導体装置およびその製造方法 |
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JPH0492439A (ja) * | 1990-08-08 | 1992-03-25 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
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JPH10223901A (ja) * | 1996-12-04 | 1998-08-21 | Sony Corp | 電界効果型トランジスタおよびその製造方法 |
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JP3876518B2 (ja) | 1998-03-05 | 2007-01-31 | 日亜化学工業株式会社 | 窒化物半導体基板の製造方法および窒化物半導体基板 |
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US7439555B2 (en) * | 2003-12-05 | 2008-10-21 | International Rectifier Corporation | III-nitride semiconductor device with trench structure |
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JP4447413B2 (ja) * | 2004-09-10 | 2010-04-07 | 株式会社神戸製鋼所 | 半導体素子の製造方法 |
-
2005
- 2005-03-31 JP JP2005105163A patent/JP4986406B2/ja not_active Expired - Fee Related
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2006
- 2006-03-30 US US11/392,549 patent/US7728353B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
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US7728353B2 (en) | 2010-06-01 |
JP2006286954A (ja) | 2006-10-19 |
US20060220042A1 (en) | 2006-10-05 |
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