ATE264378T1 - Zusammensetzung zum chemisch-mechanischen polieren von oxyden - Google Patents

Zusammensetzung zum chemisch-mechanischen polieren von oxyden

Info

Publication number
ATE264378T1
ATE264378T1 AT97951772T AT97951772T ATE264378T1 AT E264378 T1 ATE264378 T1 AT E264378T1 AT 97951772 T AT97951772 T AT 97951772T AT 97951772 T AT97951772 T AT 97951772T AT E264378 T1 ATE264378 T1 AT E264378T1
Authority
AT
Austria
Prior art keywords
mechanical polishing
chemical
composition
oxides
semiconductors
Prior art date
Application number
AT97951772T
Other languages
English (en)
Inventor
Gautam S Grover
Brian L Mueller
Shumin Wang
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Application granted granted Critical
Publication of ATE264378T1 publication Critical patent/ATE264378T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Agricultural Chemicals And Associated Chemicals (AREA)
AT97951772T 1996-12-30 1997-12-19 Zusammensetzung zum chemisch-mechanischen polieren von oxyden ATE264378T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/774,488 US5759917A (en) 1996-12-30 1996-12-30 Composition for oxide CMP
PCT/US1997/023627 WO1998029515A1 (en) 1996-12-30 1997-12-19 Composition for oxide cmp

Publications (1)

Publication Number Publication Date
ATE264378T1 true ATE264378T1 (de) 2004-04-15

Family

ID=25101406

Family Applications (1)

Application Number Title Priority Date Filing Date
AT97951772T ATE264378T1 (de) 1996-12-30 1997-12-19 Zusammensetzung zum chemisch-mechanischen polieren von oxyden

Country Status (11)

Country Link
US (3) US5759917A (de)
EP (1) EP0963419B1 (de)
JP (2) JP2001507739A (de)
KR (1) KR20000069823A (de)
CN (1) CN1168794C (de)
AT (1) ATE264378T1 (de)
AU (1) AU5532898A (de)
DE (1) DE69728691T2 (de)
IL (1) IL130720A0 (de)
TW (1) TW505690B (de)
WO (1) WO1998029515A1 (de)

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AU5532898A (en) 1998-07-31
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US6689692B1 (en) 2004-02-10
JP2001507739A (ja) 2001-06-12
EP0963419A1 (de) 1999-12-15
JP5038199B2 (ja) 2012-10-03
TW505690B (en) 2002-10-11
IL130720A0 (en) 2000-06-01
DE69728691D1 (de) 2004-05-19
CN1168794C (zh) 2004-09-29
US20040089634A1 (en) 2004-05-13
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US5759917A (en) 1998-06-02

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