DE69405342D1 - Poliervorrichtung für Halbleiterscheibe - Google Patents

Poliervorrichtung für Halbleiterscheibe

Info

Publication number
DE69405342D1
DE69405342D1 DE69405342T DE69405342T DE69405342D1 DE 69405342 D1 DE69405342 D1 DE 69405342D1 DE 69405342 T DE69405342 T DE 69405342T DE 69405342 T DE69405342 T DE 69405342T DE 69405342 D1 DE69405342 D1 DE 69405342D1
Authority
DE
Germany
Prior art keywords
semiconductor wafers
polishing device
polishing
wafers
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69405342T
Other languages
English (en)
Other versions
DE69405342T2 (de
Inventor
Hiroyuki Ohashi
Naoto Miyashita
Ichiro Katakabe
Tetsuya Tsukihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE69405342D1 publication Critical patent/DE69405342D1/de
Publication of DE69405342T2 publication Critical patent/DE69405342T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE69405342T 1993-10-28 1994-10-28 Poliervorrichtung für Halbleiterscheibe Expired - Fee Related DE69405342T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27065493A JP3311116B2 (ja) 1993-10-28 1993-10-28 半導体製造装置

Publications (2)

Publication Number Publication Date
DE69405342D1 true DE69405342D1 (de) 1997-10-09
DE69405342T2 DE69405342T2 (de) 1998-01-29

Family

ID=17489104

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69405342T Expired - Fee Related DE69405342T2 (de) 1993-10-28 1994-10-28 Poliervorrichtung für Halbleiterscheibe

Country Status (5)

Country Link
US (1) US5605488A (de)
EP (1) EP0650806B1 (de)
JP (1) JP3311116B2 (de)
KR (1) KR0147451B1 (de)
DE (1) DE69405342T2 (de)

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JPH09225819A (ja) * 1996-02-21 1997-09-02 Shin Etsu Handotai Co Ltd 被加工物の保持機構
USRE38854E1 (en) 1996-02-27 2005-10-25 Ebara Corporation Apparatus for and method for polishing workpiece
US5762539A (en) 1996-02-27 1998-06-09 Ebara Corporation Apparatus for and method for polishing workpiece
US6183354B1 (en) * 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6146259A (en) 1996-11-08 2000-11-14 Applied Materials, Inc. Carrier head with local pressure control for a chemical mechanical polishing apparatus
US5941758A (en) * 1996-11-13 1999-08-24 Intel Corporation Method and apparatus for chemical-mechanical polishing
JP3011113B2 (ja) * 1996-11-15 2000-02-21 日本電気株式会社 基板の研磨方法及び研磨装置
DE19651761A1 (de) * 1996-12-12 1998-06-18 Wacker Siltronic Halbleitermat Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben
US6056632A (en) * 1997-02-13 2000-05-02 Speedfam-Ipec Corp. Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head
US5967881A (en) * 1997-05-29 1999-10-19 Tucker; Thomas N. Chemical mechanical planarization tool having a linear polishing roller
US5873769A (en) * 1997-05-30 1999-02-23 Industrial Technology Research Institute Temperature compensated chemical mechanical polishing to achieve uniform removal rates
JP3027551B2 (ja) * 1997-07-03 2000-04-04 キヤノン株式会社 基板保持装置ならびに該基板保持装置を用いた研磨方法および研磨装置
US5964653A (en) * 1997-07-11 1999-10-12 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
JP3741523B2 (ja) * 1997-07-30 2006-02-01 株式会社荏原製作所 研磨装置
JP3982890B2 (ja) * 1997-08-06 2007-09-26 富士通株式会社 研磨装置、この装置に用いられる研磨治具、及び、この研磨治具に取り付けられる被研磨物取付部材
US5931719A (en) * 1997-08-25 1999-08-03 Lsi Logic Corporation Method and apparatus for using pressure differentials through a polishing pad to improve performance in chemical mechanical polishing
US5975998A (en) * 1997-09-26 1999-11-02 Memc Electronic Materials , Inc. Wafer processing apparatus
US5957750A (en) * 1997-12-18 1999-09-28 Micron Technology, Inc. Method and apparatus for controlling a temperature of a polishing pad used in planarizing substrates
US6121144A (en) * 1997-12-29 2000-09-19 Intel Corporation Low temperature chemical mechanical polishing of dielectric materials
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US6142857A (en) * 1998-01-06 2000-11-07 Speedfam-Ipec Corporation Wafer polishing with improved backing arrangement
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US6077151A (en) * 1999-05-17 2000-06-20 Vlsi Technology, Inc. Temperature control carrier head for chemical mechanical polishing process
US6358121B1 (en) * 1999-07-09 2002-03-19 Applied Materials, Inc. Carrier head with a flexible membrane and an edge load ring
JP3270428B2 (ja) 1999-07-28 2002-04-02 東芝機械株式会社 電動式射出成形機の旋回装置
DE19941903A1 (de) * 1999-09-02 2001-03-15 Wacker Siltronic Halbleitermat Verfahren und Vorrichtung zum Polieren einer Halbleiterscheibe
JP2001121411A (ja) 1999-10-29 2001-05-08 Applied Materials Inc ウェハー研磨装置
US6227939B1 (en) * 2000-01-25 2001-05-08 Agilent Technologies, Inc. Temperature controlled chemical mechanical polishing method and apparatus
US6629881B1 (en) 2000-02-17 2003-10-07 Applied Materials, Inc. Method and apparatus for controlling slurry delivery during polishing
DE10009656B4 (de) * 2000-02-24 2005-12-08 Siltronic Ag Verfahren zur Herstellung einer Halbleiterscheibe
DE10012840C2 (de) * 2000-03-16 2001-08-02 Wacker Siltronic Halbleitermat Verfahren zur Herstellung einer Vielzahl von polierten Halbleiterscheiben
KR100780099B1 (ko) * 2000-03-29 2007-11-29 신에쯔 한도타이 가부시키가이샤 연마용 워크지지반, 연마장치 및 연마방법
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US6390905B1 (en) 2000-03-31 2002-05-21 Speedfam-Ipec Corporation Workpiece carrier with adjustable pressure zones and barriers
US6336853B1 (en) 2000-03-31 2002-01-08 Speedfam-Ipec Corporation Carrier having pistons for distributing a pressing force on the back surface of a workpiece
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US6558232B1 (en) 2000-05-12 2003-05-06 Multi-Planar Technologies, Inc. System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
JP2003533359A (ja) * 2000-05-12 2003-11-11 マルチプレーナーテクノロジーズ インコーポレーテッド 独立のリテーナリングと多領域圧力制御とを備えた空気圧ダイアフラムヘッドおよび該空気圧ダイアフラムヘッドを用いた方法
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JP5643151B2 (ja) * 2011-05-17 2014-12-17 新光電気工業株式会社 研磨装置及び研磨方法
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Also Published As

Publication number Publication date
KR950012624A (ko) 1995-05-16
JPH07122523A (ja) 1995-05-12
US5605488A (en) 1997-02-25
DE69405342T2 (de) 1998-01-29
JP3311116B2 (ja) 2002-08-05
EP0650806B1 (de) 1997-09-03
EP0650806A1 (de) 1995-05-03
KR0147451B1 (ko) 1998-11-02

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