DE69504549D1 - Gerät zum Polieren von Wafers - Google Patents

Gerät zum Polieren von Wafers

Info

Publication number
DE69504549D1
DE69504549D1 DE69504549T DE69504549T DE69504549D1 DE 69504549 D1 DE69504549 D1 DE 69504549D1 DE 69504549 T DE69504549 T DE 69504549T DE 69504549 T DE69504549 T DE 69504549T DE 69504549 D1 DE69504549 D1 DE 69504549D1
Authority
DE
Germany
Prior art keywords
polishing wafers
wafers
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69504549T
Other languages
English (en)
Other versions
DE69504549T2 (de
Inventor
Hiroyoshi Tominaga
Yoshinori Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of DE69504549D1 publication Critical patent/DE69504549D1/de
Application granted granted Critical
Publication of DE69504549T2 publication Critical patent/DE69504549T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE69504549T 1994-02-18 1995-02-10 Gerät zum Polieren von Wafers Expired - Fee Related DE69504549T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4483994A JP3042293B2 (ja) 1994-02-18 1994-02-18 ウエーハのポリッシング装置

Publications (2)

Publication Number Publication Date
DE69504549D1 true DE69504549D1 (de) 1998-10-15
DE69504549T2 DE69504549T2 (de) 1999-06-17

Family

ID=12702650

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69504549T Expired - Fee Related DE69504549T2 (de) 1994-02-18 1995-02-10 Gerät zum Polieren von Wafers

Country Status (4)

Country Link
US (1) US5588902A (de)
EP (1) EP0672499B1 (de)
JP (1) JP3042293B2 (de)
DE (1) DE69504549T2 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5643053A (en) * 1993-12-27 1997-07-01 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved polishing control
US6024630A (en) 1995-06-09 2000-02-15 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head
JPH09225819A (ja) * 1996-02-21 1997-09-02 Shin Etsu Handotai Co Ltd 被加工物の保持機構
JP3183388B2 (ja) * 1996-07-12 2001-07-09 株式会社東京精密 半導体ウェーハ研磨装置
US5941758A (en) * 1996-11-13 1999-08-24 Intel Corporation Method and apparatus for chemical-mechanical polishing
JPH10156710A (ja) * 1996-11-27 1998-06-16 Shin Etsu Handotai Co Ltd 薄板の研磨方法および研磨装置
JPH10217105A (ja) * 1997-02-06 1998-08-18 Speedfam Co Ltd ワークの研磨方法及びその装置
US6110025A (en) * 1997-05-07 2000-08-29 Obsidian, Inc. Containment ring for substrate carrier apparatus
EP0881039B1 (de) * 1997-05-28 2003-04-16 Tokyo Seimitsu Co.,Ltd. Halbleiterscheibe Poliervorrichtung mit Halterring
US6113479A (en) 1997-07-25 2000-09-05 Obsidian, Inc. Wafer carrier for chemical mechanical planarization polishing
US6142857A (en) * 1998-01-06 2000-11-07 Speedfam-Ipec Corporation Wafer polishing with improved backing arrangement
JP2917992B1 (ja) 1998-04-10 1999-07-12 日本電気株式会社 研磨装置
US5985094A (en) * 1998-05-12 1999-11-16 Speedfam-Ipec Corporation Semiconductor wafer carrier
US6106379A (en) * 1998-05-12 2000-08-22 Speedfam-Ipec Corporation Semiconductor wafer carrier with automatic ring extension
US6174221B1 (en) 1998-09-01 2001-01-16 Micron Technology, Inc. Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, semiconductor wafer polishing methods, and methods of forming polishing chucks
US6176764B1 (en) 1999-03-10 2001-01-23 Micron Technology, Inc. Polishing chucks, semiconductor wafer polishing chucks, abrading methods, polishing methods, simiconductor wafer polishing methods, and methods of forming polishing chucks
US6093086A (en) * 1999-09-24 2000-07-25 Lucent Technologies Inc. Polishing head release mechanism
US6383056B1 (en) 1999-12-02 2002-05-07 Yin Ming Wang Plane constructed shaft system used in precision polishing and polishing apparatuses
KR101377538B1 (ko) * 2009-03-06 2014-03-26 주식회사 엘지화학 유리판 연마 시스템용 하부 유니트 및 이를 이용한 연마 방법
JP5821883B2 (ja) * 2013-03-22 2015-11-24 信越半導体株式会社 テンプレートアセンブリ及びテンプレートアセンブリの製造方法
WO2021262521A1 (en) * 2020-06-26 2021-12-30 Applied Materials, Inc. Deformable substrate chuck

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2809274A1 (de) * 1978-03-03 1979-09-13 Wacker Chemitronic Verfahren zur vergleichmaessigung des polierabtrages von scheiben beim polieren
JPS6059113B2 (ja) * 1979-09-18 1985-12-23 スピ−ドフアム・コ−ポレイシヨン 微小サイズウエ−ハの液体無ワツクス取付具
US4521995A (en) * 1980-05-23 1985-06-11 Disco Co., Ltd. Wafer attracting and fixing device
JPH079896B2 (ja) * 1988-10-06 1995-02-01 信越半導体株式会社 研磨装置
US5036630A (en) * 1990-04-13 1991-08-06 International Business Machines Corporation Radial uniformity control of semiconductor wafer polishing
JPH0569310A (ja) * 1991-04-23 1993-03-23 Mitsubishi Materials Corp ウエーハの鏡面研磨装置
JP3247708B2 (ja) * 1991-11-22 2002-01-21 不二越機械工業株式会社 半導体ウェハーのポリッシング装置
JPH07183259A (ja) * 1993-12-24 1995-07-21 Fujitsu Ltd 枚葉式研磨装置

Also Published As

Publication number Publication date
EP0672499A1 (de) 1995-09-20
JPH07227757A (ja) 1995-08-29
US5588902A (en) 1996-12-31
JP3042293B2 (ja) 2000-05-15
DE69504549T2 (de) 1999-06-17
EP0672499B1 (de) 1998-09-09

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Legal Events

Date Code Title Description
8332 No legal effect for de
8370 Indication of lapse of patent is to be deleted
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee