DE19882823T1 - Einrichtung zum Halten von Halbleiter-Wafer - Google Patents

Einrichtung zum Halten von Halbleiter-Wafer

Info

Publication number
DE19882823T1
DE19882823T1 DE19882823T DE19882823T DE19882823T1 DE 19882823 T1 DE19882823 T1 DE 19882823T1 DE 19882823 T DE19882823 T DE 19882823T DE 19882823 T DE19882823 T DE 19882823T DE 19882823 T1 DE19882823 T1 DE 19882823T1
Authority
DE
Germany
Prior art keywords
semiconductor wafers
holding semiconductor
holding
wafers
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19882823T
Other languages
English (en)
Inventor
Shinji Nakahara
Masato Imai
Masanori Mayusumi
Kazutoshi Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Super Silicon Crystal Research Institute Corp
Original Assignee
Super Silicon Crystal Research Institute Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP33372597A external-priority patent/JPH11150074A/ja
Priority claimed from JP6453298A external-priority patent/JP3227474B2/ja
Application filed by Super Silicon Crystal Research Institute Corp filed Critical Super Silicon Crystal Research Institute Corp
Publication of DE19882823T1 publication Critical patent/DE19882823T1/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE19882823T 1997-11-19 1998-11-19 Einrichtung zum Halten von Halbleiter-Wafer Ceased DE19882823T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP33372597A JPH11150074A (ja) 1997-11-19 1997-11-19 半導体ウエハ保持装置
JP6453298A JP3227474B2 (ja) 1998-02-27 1998-02-27 半導体ウエハ熱処理装置
PCT/JP1998/005212 WO1999026280A1 (fr) 1997-11-19 1998-11-19 Dispositif de support pour plaquette de semiconducteur

Publications (1)

Publication Number Publication Date
DE19882823T1 true DE19882823T1 (de) 2001-03-22

Family

ID=26405634

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19882823T Ceased DE19882823T1 (de) 1997-11-19 1998-11-19 Einrichtung zum Halten von Halbleiter-Wafer

Country Status (2)

Country Link
DE (1) DE19882823T1 (de)
WO (1) WO1999026280A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014119365A1 (de) * 2014-12-22 2016-06-23 Von Ardenne Gmbh Substrathaltevorrichtung, Verfahren zum Bestücken einer Substrathaltevorrichtung und Verfahren zum Herstellen einer Substrathaltevorrichtung

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6576064B2 (en) * 1997-07-10 2003-06-10 Sandia Corporation Support apparatus for semiconductor wafer processing
JP6539929B2 (ja) 2015-12-21 2019-07-10 昭和電工株式会社 ウェハ支持機構、化学気相成長装置およびエピタキシャルウェハの製造方法
CN113804909B (zh) * 2020-06-12 2023-12-12 中国科学院苏州纳米技术与纳米仿生研究所 真空互联样品转移组件

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0732143B2 (ja) * 1986-09-19 1995-04-10 株式会社日立製作所 半導体ウエハの熱処理装置
JP2945169B2 (ja) * 1991-06-20 1999-09-06 古河電気工業株式会社 半導体ウエハの気相成長装置
JPH0870007A (ja) * 1994-08-30 1996-03-12 Dainippon Screen Mfg Co Ltd 基板の熱処理装置
JP3292428B2 (ja) * 1994-12-20 2002-06-17 東芝セラミックス株式会社 ウエハの支持方法
JPH09139352A (ja) * 1995-11-15 1997-05-27 Nec Corp 縦型炉用ウェーハボート

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014119365A1 (de) * 2014-12-22 2016-06-23 Von Ardenne Gmbh Substrathaltevorrichtung, Verfahren zum Bestücken einer Substrathaltevorrichtung und Verfahren zum Herstellen einer Substrathaltevorrichtung
DE102014119365B4 (de) 2014-12-22 2023-01-26 VON ARDENNE Asset GmbH & Co. KG Substrathaltevorrichtung, Verfahren zum Bestücken einer Substrathaltevorrichtung und Verfahren zum Herstellen einer Substrathaltevorrichtung

Also Published As

Publication number Publication date
WO1999026280A1 (fr) 1999-05-27

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Legal Events

Date Code Title Description
8141 Disposal/no request for examination
8110 Request for examination paragraph 44
8170 Reinstatement of the former position
8131 Rejection