KR960019102U - 웨이퍼 세척장치 - Google Patents

웨이퍼 세척장치

Info

Publication number
KR960019102U
KR960019102U KR2019940029209U KR19940029209U KR960019102U KR 960019102 U KR960019102 U KR 960019102U KR 2019940029209 U KR2019940029209 U KR 2019940029209U KR 19940029209 U KR19940029209 U KR 19940029209U KR 960019102 U KR960019102 U KR 960019102U
Authority
KR
South Korea
Prior art keywords
cleaning device
wafer cleaning
wafer
cleaning
Prior art date
Application number
KR2019940029209U
Other languages
English (en)
Other versions
KR0125238Y1 (ko
Inventor
박정근
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019940029209U priority Critical patent/KR0125238Y1/ko
Priority to JP7217288A priority patent/JPH08139065A/ja
Publication of KR960019102U publication Critical patent/KR960019102U/ko
Application granted granted Critical
Publication of KR0125238Y1 publication Critical patent/KR0125238Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Dicing (AREA)
KR2019940029209U 1994-11-04 1994-11-04 웨이퍼 세척장치 KR0125238Y1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR2019940029209U KR0125238Y1 (ko) 1994-11-04 1994-11-04 웨이퍼 세척장치
JP7217288A JPH08139065A (ja) 1994-11-04 1995-08-25 ウェーハ洗浄装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940029209U KR0125238Y1 (ko) 1994-11-04 1994-11-04 웨이퍼 세척장치

Publications (2)

Publication Number Publication Date
KR960019102U true KR960019102U (ko) 1996-06-19
KR0125238Y1 KR0125238Y1 (ko) 1999-02-18

Family

ID=19397378

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940029209U KR0125238Y1 (ko) 1994-11-04 1994-11-04 웨이퍼 세척장치

Country Status (2)

Country Link
JP (1) JPH08139065A (ko)
KR (1) KR0125238Y1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101255048B1 (ko) 2005-04-01 2013-04-16 에프에스아이 인터내쇼날 인크. 하나 이상의 처리 유체를 이용하여 마이크로일렉트로닉 워크피이스를 처리하는데 이용되는 장치용 배리어 구조 및 노즐 장치
KR101191337B1 (ko) 2006-07-07 2012-10-16 에프에스아이 인터내쇼날 인크. 하나 이상의 처리 유체로 마이크로일렉트로닉 워크피스를 처리하는데 사용되는 장치용 배리어 구조물 및 노즐장치
JP5312923B2 (ja) * 2008-01-31 2013-10-09 大日本スクリーン製造株式会社 基板処理装置
JP5705723B2 (ja) 2008-05-09 2015-04-22 テル エフエスアイ インコーポレイテッド 操作において開モードと閉モードとの切り替えを簡単に行う加工チェンバ設計を用いてマイクロ電子加工品を加工するための道具および方法
CN107743572B (zh) 2015-06-08 2021-03-30 株式会社高迎科技 湿空气形成装置、包括其的检查装置及检查方法
CN114210631B (zh) * 2021-12-14 2023-04-18 中国电建集团贵阳勘测设计研究院有限公司 一种水电站裂隙冲洗设备

Also Published As

Publication number Publication date
KR0125238Y1 (ko) 1999-02-18
JPH08139065A (ja) 1996-05-31

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