KR950031470U - 웨이퍼 세정장치 - Google Patents

웨이퍼 세정장치

Info

Publication number
KR950031470U
KR950031470U KR2019940006933U KR19940006933U KR950031470U KR 950031470 U KR950031470 U KR 950031470U KR 2019940006933 U KR2019940006933 U KR 2019940006933U KR 19940006933 U KR19940006933 U KR 19940006933U KR 950031470 U KR950031470 U KR 950031470U
Authority
KR
South Korea
Prior art keywords
cleaning device
wafer cleaning
wafer
cleaning
Prior art date
Application number
KR2019940006933U
Other languages
English (en)
Other versions
KR970003597Y1 (ko
Inventor
김학묵
서부길
Original Assignee
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업 주식회사 filed Critical 현대전자산업 주식회사
Priority to KR2019940006933U priority Critical patent/KR970003597Y1/ko
Publication of KR950031470U publication Critical patent/KR950031470U/ko
Application granted granted Critical
Publication of KR970003597Y1 publication Critical patent/KR970003597Y1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67063Apparatus for fluid treatment for etching
    • H01L21/67075Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/048Overflow-type cleaning, e.g. tanks in which the liquid flows over the tank in which the articles are placed

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR2019940006933U 1994-04-01 1994-04-01 웨이퍼 세정장치 KR970003597Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940006933U KR970003597Y1 (ko) 1994-04-01 1994-04-01 웨이퍼 세정장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940006933U KR970003597Y1 (ko) 1994-04-01 1994-04-01 웨이퍼 세정장치

Publications (2)

Publication Number Publication Date
KR950031470U true KR950031470U (ko) 1995-11-22
KR970003597Y1 KR970003597Y1 (ko) 1997-04-18

Family

ID=19380335

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940006933U KR970003597Y1 (ko) 1994-04-01 1994-04-01 웨이퍼 세정장치

Country Status (1)

Country Link
KR (1) KR970003597Y1 (ko)

Also Published As

Publication number Publication date
KR970003597Y1 (ko) 1997-04-18

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Legal Events

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