KR950004794U - 웨이퍼 세척장치 - Google Patents

웨이퍼 세척장치

Info

Publication number
KR950004794U
KR950004794U KR2019930012249U KR930012249U KR950004794U KR 950004794 U KR950004794 U KR 950004794U KR 2019930012249 U KR2019930012249 U KR 2019930012249U KR 930012249 U KR930012249 U KR 930012249U KR 950004794 U KR950004794 U KR 950004794U
Authority
KR
South Korea
Prior art keywords
cleaning device
wafer cleaning
wafer
cleaning
Prior art date
Application number
KR2019930012249U
Other languages
English (en)
Other versions
KR960007298Y1 (ko
Inventor
황준
권병인
Original Assignee
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업 주식회사 filed Critical 현대전자산업 주식회사
Priority to KR2019930012249U priority Critical patent/KR960007298Y1/ko
Publication of KR950004794U publication Critical patent/KR950004794U/ko
Application granted granted Critical
Publication of KR960007298Y1 publication Critical patent/KR960007298Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR2019930012249U 1993-07-05 1993-07-05 웨이퍼 세척장치 KR960007298Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019930012249U KR960007298Y1 (ko) 1993-07-05 1993-07-05 웨이퍼 세척장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019930012249U KR960007298Y1 (ko) 1993-07-05 1993-07-05 웨이퍼 세척장치

Publications (2)

Publication Number Publication Date
KR950004794U true KR950004794U (ko) 1995-02-18
KR960007298Y1 KR960007298Y1 (ko) 1996-08-28

Family

ID=19358485

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019930012249U KR960007298Y1 (ko) 1993-07-05 1993-07-05 웨이퍼 세척장치

Country Status (1)

Country Link
KR (1) KR960007298Y1 (ko)

Also Published As

Publication number Publication date
KR960007298Y1 (ko) 1996-08-28

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