DE69607123T2 - Gerät zum Polieren von Wafers - Google Patents

Gerät zum Polieren von Wafers

Info

Publication number
DE69607123T2
DE69607123T2 DE69607123T DE69607123T DE69607123T2 DE 69607123 T2 DE69607123 T2 DE 69607123T2 DE 69607123 T DE69607123 T DE 69607123T DE 69607123 T DE69607123 T DE 69607123T DE 69607123 T2 DE69607123 T2 DE 69607123T2
Authority
DE
Germany
Prior art keywords
polishing wafers
wafers
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69607123T
Other languages
English (en)
Other versions
DE69607123D1 (de
Inventor
Fumihiko Hasegawa
Makoto Kobayashi
Fumio Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of DE69607123D1 publication Critical patent/DE69607123D1/de
Application granted granted Critical
Publication of DE69607123T2 publication Critical patent/DE69607123T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE69607123T 1995-12-28 1996-12-20 Gerät zum Polieren von Wafers Expired - Fee Related DE69607123T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP35398795A JP3453977B2 (ja) 1995-12-28 1995-12-28 ウェーハの研磨装置

Publications (2)

Publication Number Publication Date
DE69607123D1 DE69607123D1 (de) 2000-04-20
DE69607123T2 true DE69607123T2 (de) 2000-07-13

Family

ID=18434564

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69607123T Expired - Fee Related DE69607123T2 (de) 1995-12-28 1996-12-20 Gerät zum Polieren von Wafers

Country Status (7)

Country Link
US (1) US5860853A (de)
EP (1) EP0781628B1 (de)
JP (1) JP3453977B2 (de)
KR (1) KR100225275B1 (de)
DE (1) DE69607123T2 (de)
MY (1) MY132537A (de)
TW (1) TW351690B (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999048645A1 (en) * 1998-03-23 1999-09-30 Speedfam-Ipec Corporation Backing pad for workpiece carrier
JP3185753B2 (ja) * 1998-05-22 2001-07-11 日本電気株式会社 半導体装置の製造方法
TW467795B (en) * 1999-03-15 2001-12-11 Mitsubishi Materials Corp Wafer transporting device, wafer polishing device and method for making wafers
US6196899B1 (en) * 1999-06-21 2001-03-06 Micron Technology, Inc. Polishing apparatus
US6287173B1 (en) * 2000-01-11 2001-09-11 Lucent Technologies, Inc. Longer lifetime warm-up wafers for polishing systems
DE10054166C2 (de) * 2000-11-02 2002-08-08 Wacker Siltronic Halbleitermat Vorrichtung zum Polieren von Halbleiterscheiben
KR100430581B1 (ko) * 2001-12-11 2004-05-10 동부전자 주식회사 Ｃｍｐ 장치의 상부링
JP2005322663A (ja) 2004-05-06 2005-11-17 Opnext Japan Inc 半導体基板の研磨方法および研磨治具
US7520796B2 (en) * 2007-01-31 2009-04-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with grooves to reduce slurry consumption
US7520798B2 (en) * 2007-01-31 2009-04-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with grooves to reduce slurry consumption
JP5495525B2 (ja) * 2008-08-18 2014-05-21 株式会社東京精密 研磨ヘッドにおけるウェーハ回転安定化構造
US9039488B2 (en) * 2012-10-29 2015-05-26 Wayne O. Duescher Pin driven flexible chamber abrading workholder
US8998677B2 (en) * 2012-10-29 2015-04-07 Wayne O. Duescher Bellows driven floatation-type abrading workholder
US9011207B2 (en) * 2012-10-29 2015-04-21 Wayne O. Duescher Flexible diaphragm combination floating and rigid abrading workholder
US8998678B2 (en) * 2012-10-29 2015-04-07 Wayne O. Duescher Spider arm driven flexible chamber abrading workholder
US8845394B2 (en) * 2012-10-29 2014-09-30 Wayne O. Duescher Bellows driven air floatation abrading workholder
CN111958460A (zh) * 2020-08-28 2020-11-20 房金祥 一种机械瓶盖加工用太阳纹砂光设备

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3841031A (en) * 1970-10-21 1974-10-15 Monsanto Co Process for polishing thin elements
US4258508A (en) * 1979-09-04 1981-03-31 Rca Corporation Free hold down of wafers for material removal
FR2521895A1 (fr) * 1982-02-23 1983-08-26 Ansermoz Raymond Tasseau multiple pour le rodage, au lapidaire, de pieces en forme de lames minces
US4918870A (en) * 1986-05-16 1990-04-24 Siltec Corporation Floating subcarriers for wafer polishing apparatus
JPH0615565A (ja) * 1991-12-18 1994-01-25 Shin Etsu Handotai Co Ltd ウエーハ自動ラッピング装置
JP3024373B2 (ja) * 1992-07-07 2000-03-21 信越半導体株式会社 シート状弾性発泡体及びウェーハ研磨加工用治具
JPH0663862A (ja) * 1992-08-22 1994-03-08 Fujikoshi Mach Corp 研磨装置
JP2716653B2 (ja) * 1993-11-01 1998-02-18 不二越機械工業株式会社 ウェーハの研磨装置および研磨方法
JPH07201787A (ja) * 1993-12-28 1995-08-04 Lintec Corp ウエハ表面保護シートおよびその利用方法
JP2616735B2 (ja) * 1995-01-25 1997-06-04 日本電気株式会社 ウェハの研磨方法およびその装置
JP3158934B2 (ja) * 1995-02-28 2001-04-23 三菱マテリアル株式会社 ウェーハ研磨装置

Also Published As

Publication number Publication date
DE69607123D1 (de) 2000-04-20
EP0781628B1 (de) 2000-03-15
JP3453977B2 (ja) 2003-10-06
TW351690B (en) 1999-02-01
JPH09183063A (ja) 1997-07-15
EP0781628A1 (de) 1997-07-02
MY132537A (en) 2007-10-31
KR970052967A (ko) 1997-07-29
KR100225275B1 (ko) 1999-10-15
US5860853A (en) 1999-01-19

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee