TW351690B - Apparatus for grinding wafer - Google Patents

Apparatus for grinding wafer

Info

Publication number
TW351690B
TW351690B TW085115366A TW85115366A TW351690B TW 351690 B TW351690 B TW 351690B TW 085115366 A TW085115366 A TW 085115366A TW 85115366 A TW85115366 A TW 85115366A TW 351690 B TW351690 B TW 351690B
Authority
TW
Taiwan
Prior art keywords
metal plate
round
wafer
round metal
respect
Prior art date
Application number
TW085115366A
Other languages
English (en)
Inventor
Fumihiko Hasegawa
Makoto Kobayashi
Fumio Suzuki
Original Assignee
Shinetsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Co Ltd filed Critical Shinetsu Handotai Co Ltd
Application granted granted Critical
Publication of TW351690B publication Critical patent/TW351690B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW085115366A 1995-12-28 1996-12-12 Apparatus for grinding wafer TW351690B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP35398795A JP3453977B2 (ja) 1995-12-28 1995-12-28 ウェーハの研磨装置

Publications (1)

Publication Number Publication Date
TW351690B true TW351690B (en) 1999-02-01

Family

ID=18434564

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085115366A TW351690B (en) 1995-12-28 1996-12-12 Apparatus for grinding wafer

Country Status (7)

Country Link
US (1) US5860853A (zh)
EP (1) EP0781628B1 (zh)
JP (1) JP3453977B2 (zh)
KR (1) KR100225275B1 (zh)
DE (1) DE69607123T2 (zh)
MY (1) MY132537A (zh)
TW (1) TW351690B (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999048645A1 (en) * 1998-03-23 1999-09-30 Speedfam-Ipec Corporation Backing pad for workpiece carrier
JP3185753B2 (ja) * 1998-05-22 2001-07-11 日本電気株式会社 半導体装置の製造方法
TW467795B (en) * 1999-03-15 2001-12-11 Mitsubishi Materials Corp Wafer transporting device, wafer polishing device and method for making wafers
US6196899B1 (en) 1999-06-21 2001-03-06 Micron Technology, Inc. Polishing apparatus
US6287173B1 (en) * 2000-01-11 2001-09-11 Lucent Technologies, Inc. Longer lifetime warm-up wafers for polishing systems
DE10054166C2 (de) * 2000-11-02 2002-08-08 Wacker Siltronic Halbleitermat Vorrichtung zum Polieren von Halbleiterscheiben
KR100430581B1 (ko) * 2001-12-11 2004-05-10 동부전자 주식회사 Ｃｍｐ 장치의 상부링
JP2005322663A (ja) 2004-05-06 2005-11-17 Opnext Japan Inc 半導体基板の研磨方法および研磨治具
US7520798B2 (en) * 2007-01-31 2009-04-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with grooves to reduce slurry consumption
US7520796B2 (en) * 2007-01-31 2009-04-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with grooves to reduce slurry consumption
JP5495525B2 (ja) * 2008-08-18 2014-05-21 株式会社東京精密 研磨ヘッドにおけるウェーハ回転安定化構造
US9011207B2 (en) * 2012-10-29 2015-04-21 Wayne O. Duescher Flexible diaphragm combination floating and rigid abrading workholder
US8998678B2 (en) * 2012-10-29 2015-04-07 Wayne O. Duescher Spider arm driven flexible chamber abrading workholder
US9039488B2 (en) * 2012-10-29 2015-05-26 Wayne O. Duescher Pin driven flexible chamber abrading workholder
US8998677B2 (en) * 2012-10-29 2015-04-07 Wayne O. Duescher Bellows driven floatation-type abrading workholder
US8845394B2 (en) * 2012-10-29 2014-09-30 Wayne O. Duescher Bellows driven air floatation abrading workholder
CN111958460A (zh) * 2020-08-28 2020-11-20 房金祥 一种机械瓶盖加工用太阳纹砂光设备

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3841031A (en) * 1970-10-21 1974-10-15 Monsanto Co Process for polishing thin elements
US4258508A (en) * 1979-09-04 1981-03-31 Rca Corporation Free hold down of wafers for material removal
FR2521895A1 (fr) * 1982-02-23 1983-08-26 Ansermoz Raymond Tasseau multiple pour le rodage, au lapidaire, de pieces en forme de lames minces
US4918870A (en) * 1986-05-16 1990-04-24 Siltec Corporation Floating subcarriers for wafer polishing apparatus
JPH0615565A (ja) * 1991-12-18 1994-01-25 Shin Etsu Handotai Co Ltd ウエーハ自動ラッピング装置
JP3024373B2 (ja) * 1992-07-07 2000-03-21 信越半導体株式会社 シート状弾性発泡体及びウェーハ研磨加工用治具
JPH0663862A (ja) * 1992-08-22 1994-03-08 Fujikoshi Mach Corp 研磨装置
JP2716653B2 (ja) * 1993-11-01 1998-02-18 不二越機械工業株式会社 ウェーハの研磨装置および研磨方法
JPH07201787A (ja) * 1993-12-28 1995-08-04 Lintec Corp ウエハ表面保護シートおよびその利用方法
JP2616735B2 (ja) * 1995-01-25 1997-06-04 日本電気株式会社 ウェハの研磨方法およびその装置
JP3158934B2 (ja) * 1995-02-28 2001-04-23 三菱マテリアル株式会社 ウェーハ研磨装置

Also Published As

Publication number Publication date
JP3453977B2 (ja) 2003-10-06
EP0781628A1 (en) 1997-07-02
DE69607123D1 (de) 2000-04-20
MY132537A (en) 2007-10-31
KR100225275B1 (ko) 1999-10-15
DE69607123T2 (de) 2000-07-13
EP0781628B1 (en) 2000-03-15
JPH09183063A (ja) 1997-07-15
US5860853A (en) 1999-01-19
KR970052967A (ko) 1997-07-29

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