DE69307223D1 - Vorrichtung zum Polieren von Fasen auf Halbleiterscheiben - Google Patents
Vorrichtung zum Polieren von Fasen auf HalbleiterscheibenInfo
- Publication number
- DE69307223D1 DE69307223D1 DE69307223T DE69307223T DE69307223D1 DE 69307223 D1 DE69307223 D1 DE 69307223D1 DE 69307223 T DE69307223 T DE 69307223T DE 69307223 T DE69307223 T DE 69307223T DE 69307223 D1 DE69307223 D1 DE 69307223D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor wafers
- chamfers
- polishing
- polishing chamfers
- wafers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5388692U JPH0615957U (ja) | 1992-07-31 | 1992-07-31 | 回転割出式ウエーハ面取部研磨装置 |
JP4205275A JP3027882B2 (ja) | 1992-07-31 | 1992-07-31 | ウエーハ面取部研磨装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69307223D1 true DE69307223D1 (de) | 1997-02-20 |
DE69307223T2 DE69307223T2 (de) | 1997-08-14 |
Family
ID=26394611
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69307223T Expired - Fee Related DE69307223T2 (de) | 1992-07-31 | 1993-06-03 | Vorrichtung zum Polieren von Fasen auf Halbleiterscheiben |
Country Status (4)
Country | Link |
---|---|
US (2) | US5547415A (de) |
EP (1) | EP0584905B1 (de) |
JP (1) | JP3027882B2 (de) |
DE (1) | DE69307223T2 (de) |
Families Citing this family (56)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2882458B2 (ja) * | 1994-11-28 | 1999-04-12 | 株式会社東京精密 | ウェーハ面取り機 |
TW303487B (de) * | 1995-05-29 | 1997-04-21 | Shinetsu Handotai Co Ltd | |
US5816891A (en) * | 1995-06-06 | 1998-10-06 | Advanced Micro Devices, Inc. | Performing chemical mechanical polishing of oxides and metals using sequential removal on multiple polish platens to increase equipment throughput |
DE19732433A1 (de) * | 1996-07-29 | 1998-02-12 | Mitsubishi Material Silicon | Verfahren und Gerät zum Polieren von Schrägkanten von Halbleiterwafern |
DE19719503C2 (de) * | 1997-05-07 | 2002-05-02 | Wolters Peter Werkzeugmasch | Vorrichtung zum chemisch-mechanischen Polieren von Oberflächen von Halbleiterwafern und Verfahren zum Betrieb der Vorrichtung |
JPH10309666A (ja) * | 1997-05-09 | 1998-11-24 | Speedfam Co Ltd | エッジポリッシング装置及びその方法 |
JPH1190803A (ja) * | 1997-09-11 | 1999-04-06 | Speedfam Co Ltd | ワークエッジの鏡面研磨装置 |
US6110011A (en) * | 1997-11-10 | 2000-08-29 | Applied Materials, Inc. | Integrated electrodeposition and chemical-mechanical polishing tool |
JP3411202B2 (ja) * | 1997-12-05 | 2003-05-26 | ニトマック・イーアール株式会社 | 円盤状ワーク外周部の研磨方法 |
US6080050A (en) | 1997-12-31 | 2000-06-27 | Applied Materials, Inc. | Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus |
US5993302A (en) * | 1997-12-31 | 1999-11-30 | Applied Materials, Inc. | Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus |
JP3990073B2 (ja) * | 1999-06-17 | 2007-10-10 | 株式会社荏原製作所 | 基板洗浄装置及び基板洗浄方法 |
US6267649B1 (en) | 1999-08-23 | 2001-07-31 | Industrial Technology Research Institute | Edge and bevel CMP of copper wafer |
US6257954B1 (en) | 2000-02-23 | 2001-07-10 | Memc Electronic Materials, Inc. | Apparatus and process for high temperature wafer edge polishing |
US6517130B1 (en) | 2000-03-14 | 2003-02-11 | Applied Materials, Inc. | Self positioning vacuum chuck |
US6722964B2 (en) * | 2000-04-04 | 2004-04-20 | Ebara Corporation | Polishing apparatus and method |
US7066814B2 (en) * | 2001-09-21 | 2006-06-27 | Igt | Gaming device having regenerating multiple award opportunities |
US7351146B2 (en) * | 2001-10-05 | 2008-04-01 | Igt | Gaming device and method for activating multiple paylines upon the wager of a single credit |
JP4162892B2 (ja) * | 2002-01-11 | 2008-10-08 | 日鉱金属株式会社 | 半導体ウェハおよびその製造方法 |
JP2003209075A (ja) | 2002-01-15 | 2003-07-25 | Speedfam Co Ltd | ウェハエッジ研磨システム及びウェハエッジ研磨制御方法 |
US7485043B2 (en) | 2002-06-19 | 2009-02-03 | Igt | Elimination games for gaming machines |
GB0313012D0 (en) | 2003-06-06 | 2003-07-09 | Igt Uk Ltd | Entertainment machines |
US7731582B2 (en) * | 2003-09-08 | 2010-06-08 | Igt | Gaming device having an offer and acceptance game with multiple offers |
WO2005072443A2 (en) | 2004-01-28 | 2005-08-11 | Igt | Gaming device having a partial selectable symbol matrix |
US7666093B2 (en) | 2004-08-03 | 2010-02-23 | Igt | Gaming method and device involving progressive wagers |
US7950994B2 (en) | 2004-09-10 | 2011-05-31 | Igt | Replacement reel gaming device and method |
US7690982B2 (en) | 2004-09-21 | 2010-04-06 | Igt | Gaming device having free spin game with terminators and anti-terminators |
US7322887B2 (en) | 2004-10-01 | 2008-01-29 | Igt | Gaming device having sequential activations of a game and replay of previous activations of the game |
JP4561982B2 (ja) * | 2005-01-06 | 2010-10-13 | Tdk株式会社 | 加工機 |
JP5196709B2 (ja) | 2005-04-19 | 2013-05-15 | 株式会社荏原製作所 | 半導体ウエハ周縁研磨装置及び方法 |
US20070060241A1 (en) * | 2005-09-12 | 2007-03-15 | Low Michael N | Methods and apparatus for providing free-play credits in a video poker game |
US8070597B2 (en) | 2006-08-03 | 2011-12-06 | Igt | Gaming device and method having multiple progressive award levels and a secondary game for advancing through the progressive award levels |
US7758416B2 (en) | 2006-09-08 | 2010-07-20 | Igt | Gaming system having a plurality of simultaneously played wagering games that may trigger a plurality of free games which may be played simultaneously with the wagering games |
JP2008091665A (ja) * | 2006-10-03 | 2008-04-17 | Nec Electronics Corp | Cmp装置 |
US20080108430A1 (en) | 2006-11-08 | 2008-05-08 | Igt | Gaming system and method which provides players an opportunity to win a progressive award |
US8105149B2 (en) | 2006-11-10 | 2012-01-31 | Igt | Gaming system and method providing venue wide simultaneous player participation based bonus game |
US8033903B2 (en) | 2006-11-10 | 2011-10-11 | Igt | Gaming system and method having progressive free games |
US8231456B2 (en) | 2007-10-17 | 2012-07-31 | Igt | Gaming device and method providing side bet for winning free activations |
US8419546B2 (en) | 2009-08-31 | 2013-04-16 | Igt | Gaming system and method for selectively providing an elimination tournament that funds an award through expected values of unplayed tournament games of eliminated players |
US8613474B2 (en) * | 2011-07-06 | 2013-12-24 | Tel Nexx, Inc. | Substrate loader and unloader having a Bernoulli support |
US8684818B2 (en) | 2012-02-14 | 2014-04-01 | Igt | Gaming system, gaming device, and method for providing a replay of previously played games |
US9214067B2 (en) | 2012-09-06 | 2015-12-15 | Igt | Gaming system and method for providing a streaming symbols game |
US9028318B2 (en) | 2012-09-27 | 2015-05-12 | Igt | Gaming system and method for providing a game which populates symbols along a path |
US9039512B2 (en) | 2012-09-27 | 2015-05-26 | Igt | Gaming system and method for providing a game which populates symbols along a path |
US8992301B2 (en) | 2012-09-27 | 2015-03-31 | Igt | Gaming system and method for providing a game which populates symbols along a path |
US8784191B1 (en) | 2013-03-07 | 2014-07-22 | Igt | Gaming system and method for providing a symbol elimination game |
US8851979B2 (en) | 2013-03-07 | 2014-10-07 | Igt | Gaming system and method for providing a symbol elimination game |
US20150087208A1 (en) * | 2013-09-26 | 2015-03-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and method for manufacturing a semiconductor wafer |
US10147281B2 (en) | 2014-07-24 | 2018-12-04 | Igt | Gaming system and method having matching symbol stacks and additional award opportunities |
CN106002528B (zh) * | 2016-07-12 | 2018-01-30 | 苏州宏泉高压电容器有限公司 | 一种基于高压陶瓷电容器瓷介质芯片的在线毛刺去除机 |
US10186106B2 (en) | 2016-09-21 | 2019-01-22 | Igt | Gaming system and method for determining awards based on interacting symbols |
CN109333337A (zh) * | 2018-11-19 | 2019-02-15 | 深圳市华星光电技术有限公司 | 研磨装置及研磨方法 |
CN109877694B (zh) * | 2019-03-04 | 2023-08-08 | 天通日进精密技术有限公司 | 晶圆边缘抛光装置及晶圆边缘抛光方法 |
CN110181393B (zh) * | 2019-06-17 | 2020-11-24 | 温州澳鼎建材有限公司 | 一种汽车轮毂的翻转装置 |
CN112139926A (zh) * | 2020-10-22 | 2020-12-29 | 方红兵 | 一种高效型水晶打磨抛光设备 |
CN115319560B (zh) * | 2022-08-24 | 2023-04-25 | 广西博强建筑科技有限公司 | 一种建筑铝模板用校直装置 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH74767A (de) * | 1916-08-03 | 1917-09-01 | Bogoljub Dawidowatz | Apparat zum Schleifen von Fasetten an kreisrunden Glasscheiben, wie Uhrengläsern etc. |
US1437234A (en) * | 1920-06-11 | 1922-11-28 | Le Roy B Fraser | Method of finishing spinning rings |
US2693063A (en) * | 1949-08-13 | 1954-11-02 | American Optical Corp | Bevel edging machine and method |
US2745225A (en) * | 1955-06-27 | 1956-05-15 | Phillip A Vonada | Lapidary wheel |
JPS57189767A (en) * | 1981-05-12 | 1982-11-22 | Nec Corp | Continuous grinding device |
JPS59227361A (ja) * | 1983-06-07 | 1984-12-20 | Supiide Fuamu Kk | 平面研削装置 |
US4680893A (en) * | 1985-09-23 | 1987-07-21 | Motorola, Inc. | Apparatus for polishing semiconductor wafers |
JPS63256342A (ja) * | 1987-04-10 | 1988-10-24 | Sumitomo Electric Ind Ltd | 半導体ウエ−ハの研削方法 |
JPS6420959A (en) * | 1987-07-15 | 1989-01-24 | Toshiba Ceramics Co | Chamfering device |
JPH0637025B2 (ja) * | 1987-09-14 | 1994-05-18 | スピードファム株式会社 | ウエハの鏡面加工装置 |
DE3819193A1 (de) * | 1988-06-06 | 1989-12-07 | Henkel Kgaa | Verfahren zur herstellung stabiler, niedrigviskoser oel-in-wasser-emulsionen polarer oelkomponenten |
US5117590A (en) * | 1988-08-12 | 1992-06-02 | Shin-Etsu Handotai Co., Ltd. | Method of automatically chamfering a wafer and apparatus therefor |
DE3838898A1 (de) * | 1988-10-22 | 1990-04-26 | Lippert Masch Stahlbau J | Schleifmaschine fuer keramisches gut |
US5094037A (en) * | 1989-10-03 | 1992-03-10 | Speedfam Company, Ltd. | Edge polisher |
JPH0716865B2 (ja) * | 1989-10-03 | 1995-03-01 | スピードファム株式会社 | エッジポリッシャー |
US5044123A (en) * | 1990-03-22 | 1991-09-03 | Douglas Hoffman | Concave-convex faceting method and apparatus |
-
1992
- 1992-07-31 JP JP4205275A patent/JP3027882B2/ja not_active Expired - Lifetime
-
1993
- 1993-06-03 DE DE69307223T patent/DE69307223T2/de not_active Expired - Fee Related
- 1993-06-03 EP EP93304304A patent/EP0584905B1/de not_active Expired - Lifetime
- 1993-06-07 US US08/072,741 patent/US5547415A/en not_active Expired - Fee Related
-
1996
- 1996-03-20 US US08/619,882 patent/US6234879B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US6234879B1 (en) | 2001-05-22 |
JP3027882B2 (ja) | 2000-04-04 |
EP0584905B1 (de) | 1997-01-08 |
DE69307223T2 (de) | 1997-08-14 |
EP0584905A1 (de) | 1994-03-02 |
US5547415A (en) | 1996-08-20 |
JPH0647655A (ja) | 1994-02-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |