DE69106311D1 - Automatische Vorrichtung zum Läppen von Wafern. - Google Patents

Automatische Vorrichtung zum Läppen von Wafern.

Info

Publication number
DE69106311D1
DE69106311D1 DE69106311T DE69106311T DE69106311D1 DE 69106311 D1 DE69106311 D1 DE 69106311D1 DE 69106311 T DE69106311 T DE 69106311T DE 69106311 T DE69106311 T DE 69106311T DE 69106311 D1 DE69106311 D1 DE 69106311D1
Authority
DE
Germany
Prior art keywords
automatic device
lapping
wafers
lapping wafers
automatic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69106311T
Other languages
English (en)
Other versions
DE69106311T2 (de
Inventor
Fumihiko Hasegawa
Hiromasa Hashimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1990108940U external-priority patent/JP2505482Y2/ja
Priority claimed from JP2278943A external-priority patent/JP2640695B2/ja
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Application granted granted Critical
Publication of DE69106311D1 publication Critical patent/DE69106311D1/de
Publication of DE69106311T2 publication Critical patent/DE69106311T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE69106311T 1990-10-19 1991-10-21 Automatische Vorrichtung zum Läppen von Wafern. Expired - Fee Related DE69106311T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1990108940U JP2505482Y2 (ja) 1990-10-19 1990-10-19 ウエ−ハ自動ラッピング装置
JP2278943A JP2640695B2 (ja) 1990-10-19 1990-10-19 ウエーハ自動ラッピング装置

Publications (2)

Publication Number Publication Date
DE69106311D1 true DE69106311D1 (de) 1995-02-09
DE69106311T2 DE69106311T2 (de) 1996-08-08

Family

ID=26448760

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69106311T Expired - Fee Related DE69106311T2 (de) 1990-10-19 1991-10-21 Automatische Vorrichtung zum Läppen von Wafern.

Country Status (3)

Country Link
US (1) US5174067A (de)
EP (1) EP0481826B1 (de)
DE (1) DE69106311T2 (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0615565A (ja) * 1991-12-18 1994-01-25 Shin Etsu Handotai Co Ltd ウエーハ自動ラッピング装置
US5404894A (en) * 1992-05-20 1995-04-11 Tokyo Electron Kabushiki Kaisha Conveyor apparatus
US5549502A (en) * 1992-12-04 1996-08-27 Fujikoshi Machinery Corp. Polishing apparatus
DE4306160C3 (de) * 1993-02-27 2003-08-28 Wolters Peter Fa Vorrichtung zum Be- und Entladen von Zweischeiben-Läpp- oder Honmaschinen
US5466117A (en) * 1993-06-10 1995-11-14 Xilinx, Inc. Device and method for programming multiple arrays of semiconductor devices
US5885138A (en) 1993-09-21 1999-03-23 Ebara Corporation Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
US5649854A (en) * 1994-05-04 1997-07-22 Gill, Jr.; Gerald L. Polishing apparatus with indexing wafer processing stations
DE19514037C2 (de) * 1995-04-13 1997-09-04 Leybold Ag Transportvorrichtung
US5830272A (en) * 1995-11-07 1998-11-03 Sputtered Films, Inc. System for and method of providing a controlled deposition on wafers
DE69732157T2 (de) * 1996-02-28 2005-12-29 Ebara Corp. Transportroboter mit Tropfwasserschutz
US5725347A (en) * 1996-05-17 1998-03-10 International Business Machines Corporation Carousel pin stacker
US5679055A (en) * 1996-05-31 1997-10-21 Memc Electronic Materials, Inc. Automated wafer lapping system
DE19718473A1 (de) * 1997-04-30 1998-11-12 Can Abay Oberflächenbearbeitungsmaschine
US5938506A (en) * 1997-06-03 1999-08-17 Speedfam-Ipec Corporation Methods and apparatus for conditioning grinding stones
DE29713515U1 (de) * 1997-07-29 1998-12-03 Mechanik Center Erlangen GmbH, 91058 Erlangen Bestückeinrichtung für eine Bearbeitungsmaschine
US6139678A (en) * 1997-11-20 2000-10-31 Trusi Technologies, Llc Plasma processing methods and apparatus
JPH11179649A (ja) * 1997-12-16 1999-07-06 Speedfam Co Ltd ワークの取出方法及びワーク取出機構付き平面研磨装置
US6270306B1 (en) * 1998-01-14 2001-08-07 Applied Materials, Inc. Wafer aligner in center of front end frame of vacuum system
JPH11267964A (ja) * 1998-03-20 1999-10-05 Speedfam Co Ltd 平面研磨装置及びそれに用いるキャリヤ
JP3262808B2 (ja) * 1998-08-20 2002-03-04 浜井産業株式会社 遊星歯車方式平行平面加工盤
US6338672B1 (en) 1998-12-21 2002-01-15 White Hydraulics, Inc. Dressing wheel system
JP2001077057A (ja) * 1999-09-06 2001-03-23 Disco Abrasive Syst Ltd Ｃｓｐ基板分割装置
FR2826350B1 (fr) 2001-06-25 2003-09-12 Dubuit Mach Dispositif de transfert de supports de pile et machine d'impression comportant un tel dispositif
DE10228441B4 (de) * 2001-07-11 2005-09-08 Peter Wolters Werkzeugmaschinen Gmbh Verfahren und Vorrichtung zum automatischen Beladen einer Doppelseiten-Poliermaschine mit Halbleiterscheiben
EP1990577A1 (de) * 2006-03-02 2008-11-12 Taiheiyo Cement Corporation Verfahren zur handhabung einer substanz, aus der sich brennbares gas verflüchtigt, verfahren zur herstellung von festem brennstoff, verfahren zum lagern von festem brennstoff, verfahren zur verwendung von festem brennstoff und vorrichtung, die festen brennstoff verwendet
KR100796347B1 (ko) 2006-07-21 2008-01-21 가부시키 가이샤 메쿠스 유성기어기구를 사용한 이동장치 및 평면연마기
US8389099B1 (en) 2007-06-01 2013-03-05 Rubicon Technology, Inc. Asymmetrical wafer configurations and method for creating the same
US8348720B1 (en) 2007-06-19 2013-01-08 Rubicon Technology, Inc. Ultra-flat, high throughput wafer lapping process
US8021094B2 (en) * 2007-10-11 2011-09-20 Hitachi High-Technologies Corporation Work handling mechanism and work inspection system
JP5249098B2 (ja) * 2009-03-17 2013-07-31 東京エレクトロン株式会社 基板処理システム及び基板処理方法
JP5493633B2 (ja) * 2009-09-18 2014-05-14 株式会社Ｓｕｍｃｏ 研磨方法及びその装置
DE102009048012A1 (de) * 2009-10-02 2011-04-14 Kapp Gmbh Verfahren zum Betreiben einer Verzahnungs- oder Profilschleifmaschine und Verzahnungs- oder Profilschleifmaschine
JP5619559B2 (ja) * 2010-10-12 2014-11-05 株式会社ディスコ 加工装置
JP6183301B2 (ja) * 2014-06-16 2017-08-23 信越半導体株式会社 自動ハンドリング装置
CN106024674B (zh) * 2016-05-11 2019-02-22 中国电子科技集团公司第四十五研究所 一种冲洗甩干设备专用的多工位转架装置清洗晶片的方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58223561A (ja) * 1982-06-16 1983-12-26 Disco Abrasive Sys Ltd ポリツシングマシン
JPS61241060A (ja) * 1985-04-17 1986-10-27 Supiide Fuamu Kk 平面自動研磨装置
JPS63120077A (ja) * 1986-11-08 1988-05-24 Otani Reiji ロボツト装填・装出用ラツピング及びポリシングマシン駆動方法
JPH0788098B2 (ja) * 1987-08-07 1995-09-27 キヤノン株式会社 画像形成装置
DE3730795A1 (de) * 1987-09-14 1989-03-23 Wolters Peter Fa Hon-, laepp- oder poliermaschine
IT1211850B (it) * 1987-10-13 1989-11-03 Melchiorre Off Mecc Dispositivo per effettuare automati camente le operazioni di carico dei pezzi da lavorare e scarico dei pezzi trattati nelle macchine lappatrici piane a doppio plato

Also Published As

Publication number Publication date
DE69106311T2 (de) 1996-08-08
US5174067A (en) 1992-12-29
EP0481826B1 (de) 1994-12-28
EP0481826A1 (de) 1992-04-22

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Legal Events

Date Code Title Description
8332 No legal effect for de
8370 Indication of lapse of patent is to be deleted
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee