DE69106311D1 - Automatische Vorrichtung zum Läppen von Wafern. - Google Patents
Automatische Vorrichtung zum Läppen von Wafern.Info
- Publication number
- DE69106311D1 DE69106311D1 DE69106311T DE69106311T DE69106311D1 DE 69106311 D1 DE69106311 D1 DE 69106311D1 DE 69106311 T DE69106311 T DE 69106311T DE 69106311 T DE69106311 T DE 69106311T DE 69106311 D1 DE69106311 D1 DE 69106311D1
- Authority
- DE
- Germany
- Prior art keywords
- automatic device
- lapping
- wafers
- lapping wafers
- automatic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990108940U JP2505482Y2 (ja) | 1990-10-19 | 1990-10-19 | ウエ−ハ自動ラッピング装置 |
JP2278943A JP2640695B2 (ja) | 1990-10-19 | 1990-10-19 | ウエーハ自動ラッピング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69106311D1 true DE69106311D1 (de) | 1995-02-09 |
DE69106311T2 DE69106311T2 (de) | 1996-08-08 |
Family
ID=26448760
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69106311T Expired - Fee Related DE69106311T2 (de) | 1990-10-19 | 1991-10-21 | Automatische Vorrichtung zum Läppen von Wafern. |
Country Status (3)
Country | Link |
---|---|
US (1) | US5174067A (de) |
EP (1) | EP0481826B1 (de) |
DE (1) | DE69106311T2 (de) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0615565A (ja) * | 1991-12-18 | 1994-01-25 | Shin Etsu Handotai Co Ltd | ウエーハ自動ラッピング装置 |
US5404894A (en) * | 1992-05-20 | 1995-04-11 | Tokyo Electron Kabushiki Kaisha | Conveyor apparatus |
US5549502A (en) * | 1992-12-04 | 1996-08-27 | Fujikoshi Machinery Corp. | Polishing apparatus |
DE4306160C3 (de) * | 1993-02-27 | 2003-08-28 | Wolters Peter Fa | Vorrichtung zum Be- und Entladen von Zweischeiben-Läpp- oder Honmaschinen |
US5466117A (en) * | 1993-06-10 | 1995-11-14 | Xilinx, Inc. | Device and method for programming multiple arrays of semiconductor devices |
US5885138A (en) | 1993-09-21 | 1999-03-23 | Ebara Corporation | Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
US5649854A (en) * | 1994-05-04 | 1997-07-22 | Gill, Jr.; Gerald L. | Polishing apparatus with indexing wafer processing stations |
DE19514037C2 (de) * | 1995-04-13 | 1997-09-04 | Leybold Ag | Transportvorrichtung |
US5830272A (en) * | 1995-11-07 | 1998-11-03 | Sputtered Films, Inc. | System for and method of providing a controlled deposition on wafers |
DE69732157T2 (de) * | 1996-02-28 | 2005-12-29 | Ebara Corp. | Transportroboter mit Tropfwasserschutz |
US5725347A (en) * | 1996-05-17 | 1998-03-10 | International Business Machines Corporation | Carousel pin stacker |
US5679055A (en) * | 1996-05-31 | 1997-10-21 | Memc Electronic Materials, Inc. | Automated wafer lapping system |
DE19718473A1 (de) * | 1997-04-30 | 1998-11-12 | Can Abay | Oberflächenbearbeitungsmaschine |
US5938506A (en) * | 1997-06-03 | 1999-08-17 | Speedfam-Ipec Corporation | Methods and apparatus for conditioning grinding stones |
DE29713515U1 (de) * | 1997-07-29 | 1998-12-03 | Mechanik Center Erlangen GmbH, 91058 Erlangen | Bestückeinrichtung für eine Bearbeitungsmaschine |
US6139678A (en) * | 1997-11-20 | 2000-10-31 | Trusi Technologies, Llc | Plasma processing methods and apparatus |
JPH11179649A (ja) * | 1997-12-16 | 1999-07-06 | Speedfam Co Ltd | ワークの取出方法及びワーク取出機構付き平面研磨装置 |
US6270306B1 (en) * | 1998-01-14 | 2001-08-07 | Applied Materials, Inc. | Wafer aligner in center of front end frame of vacuum system |
JPH11267964A (ja) * | 1998-03-20 | 1999-10-05 | Speedfam Co Ltd | 平面研磨装置及びそれに用いるキャリヤ |
JP3262808B2 (ja) * | 1998-08-20 | 2002-03-04 | 浜井産業株式会社 | 遊星歯車方式平行平面加工盤 |
US6338672B1 (en) | 1998-12-21 | 2002-01-15 | White Hydraulics, Inc. | Dressing wheel system |
JP2001077057A (ja) * | 1999-09-06 | 2001-03-23 | Disco Abrasive Syst Ltd | Csp基板分割装置 |
FR2826350B1 (fr) | 2001-06-25 | 2003-09-12 | Dubuit Mach | Dispositif de transfert de supports de pile et machine d'impression comportant un tel dispositif |
DE10228441B4 (de) * | 2001-07-11 | 2005-09-08 | Peter Wolters Werkzeugmaschinen Gmbh | Verfahren und Vorrichtung zum automatischen Beladen einer Doppelseiten-Poliermaschine mit Halbleiterscheiben |
EP1990577A1 (de) * | 2006-03-02 | 2008-11-12 | Taiheiyo Cement Corporation | Verfahren zur handhabung einer substanz, aus der sich brennbares gas verflüchtigt, verfahren zur herstellung von festem brennstoff, verfahren zum lagern von festem brennstoff, verfahren zur verwendung von festem brennstoff und vorrichtung, die festen brennstoff verwendet |
KR100796347B1 (ko) | 2006-07-21 | 2008-01-21 | 가부시키 가이샤 메쿠스 | 유성기어기구를 사용한 이동장치 및 평면연마기 |
US8389099B1 (en) | 2007-06-01 | 2013-03-05 | Rubicon Technology, Inc. | Asymmetrical wafer configurations and method for creating the same |
US8348720B1 (en) | 2007-06-19 | 2013-01-08 | Rubicon Technology, Inc. | Ultra-flat, high throughput wafer lapping process |
US8021094B2 (en) * | 2007-10-11 | 2011-09-20 | Hitachi High-Technologies Corporation | Work handling mechanism and work inspection system |
JP5249098B2 (ja) * | 2009-03-17 | 2013-07-31 | 東京エレクトロン株式会社 | 基板処理システム及び基板処理方法 |
JP5493633B2 (ja) * | 2009-09-18 | 2014-05-14 | 株式会社Sumco | 研磨方法及びその装置 |
DE102009048012A1 (de) * | 2009-10-02 | 2011-04-14 | Kapp Gmbh | Verfahren zum Betreiben einer Verzahnungs- oder Profilschleifmaschine und Verzahnungs- oder Profilschleifmaschine |
JP5619559B2 (ja) * | 2010-10-12 | 2014-11-05 | 株式会社ディスコ | 加工装置 |
JP6183301B2 (ja) * | 2014-06-16 | 2017-08-23 | 信越半導体株式会社 | 自動ハンドリング装置 |
CN106024674B (zh) * | 2016-05-11 | 2019-02-22 | 中国电子科技集团公司第四十五研究所 | 一种冲洗甩干设备专用的多工位转架装置清洗晶片的方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58223561A (ja) * | 1982-06-16 | 1983-12-26 | Disco Abrasive Sys Ltd | ポリツシングマシン |
JPS61241060A (ja) * | 1985-04-17 | 1986-10-27 | Supiide Fuamu Kk | 平面自動研磨装置 |
JPS63120077A (ja) * | 1986-11-08 | 1988-05-24 | Otani Reiji | ロボツト装填・装出用ラツピング及びポリシングマシン駆動方法 |
JPH0788098B2 (ja) * | 1987-08-07 | 1995-09-27 | キヤノン株式会社 | 画像形成装置 |
DE3730795A1 (de) * | 1987-09-14 | 1989-03-23 | Wolters Peter Fa | Hon-, laepp- oder poliermaschine |
IT1211850B (it) * | 1987-10-13 | 1989-11-03 | Melchiorre Off Mecc | Dispositivo per effettuare automati camente le operazioni di carico dei pezzi da lavorare e scarico dei pezzi trattati nelle macchine lappatrici piane a doppio plato |
-
1991
- 1991-10-18 US US07/779,474 patent/US5174067A/en not_active Expired - Fee Related
- 1991-10-21 EP EP91309701A patent/EP0481826B1/de not_active Expired - Lifetime
- 1991-10-21 DE DE69106311T patent/DE69106311T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69106311T2 (de) | 1996-08-08 |
US5174067A (en) | 1992-12-29 |
EP0481826B1 (de) | 1994-12-28 |
EP0481826A1 (de) | 1992-04-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69106311D1 (de) | Automatische Vorrichtung zum Läppen von Wafern. | |
DE69108689D1 (de) | Vorrichtung zum Reinigen von Siliciumscheiben. | |
DE69103546D1 (de) | Vorrichtung zum Positionieren von beweglichen Elementen. | |
DE69120665D1 (de) | Selbsttätige vorrichtung zum verbinden von bahnen | |
DE69210566D1 (de) | Gerät zum automatischen Läppen von Wafern | |
DE59104603D1 (de) | Vorrichtung zum Verlagern von Patienten. | |
DE68924660D1 (de) | Vorrichtung zum Montieren von Chips. | |
DE3852591D1 (de) | Vorrichtung zum Montieren von Chips. | |
DE69118513D1 (de) | Vorrichtung zum erwärmen von halbleiterscheiben oder -substraten | |
DE69109287D1 (de) | Vorrichtung zum unterscheiden von münzen. | |
DE68910381D1 (de) | Vorrichtung zum Herstellen von Rohren. | |
DE3874405D1 (de) | Vorrichtung zum unterscheiden von bildbereichen. | |
DE69108838D1 (de) | Vorrichtung zum Ätzen von Plättchen. | |
DE69015479D1 (de) | Vorrichtung zum Reinigen von Webstühlen. | |
DE3765237D1 (de) | Vorrichtung zum regeln der fuellhoehe. | |
DE69109956D1 (de) | Fördereinrichtung zum Vereinzeln von Münzen. | |
DE69101517D1 (de) | Vorrichtung zum gleichzeitigen Positionieren von mehreren Schraubverbindungselementen. | |
DE69110456D1 (de) | Vorrichtung zum zwischenschichtplanieren von halbleitern. | |
DE59101337D1 (de) | Vorrichtung zum aufnehmen von karten mit integrierten schaltkreisen. | |
DE3860528D1 (de) | Vorrichtung zum aufnehmen von stueckguetern. | |
DE3852736D1 (de) | Vorrichtung zum Montieren von Chips. | |
DE3862433D1 (de) | Vorrichtung zum sieben von faserbrei. | |
DE59005110D1 (de) | Vorrichtung zum Abscheiden von Fluiden. | |
DE59105967D1 (de) | Vorrichtung zum Verbinden von Containern. | |
DE69110336D1 (de) | Vorrichtung zum Abziehen von Schlacken. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8332 | No legal effect for de | ||
8370 | Indication of lapse of patent is to be deleted | ||
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |