DE68924660D1 - Vorrichtung zum Montieren von Chips. - Google Patents

Vorrichtung zum Montieren von Chips.

Info

Publication number
DE68924660D1
DE68924660D1 DE68924660T DE68924660T DE68924660D1 DE 68924660 D1 DE68924660 D1 DE 68924660D1 DE 68924660 T DE68924660 T DE 68924660T DE 68924660 T DE68924660 T DE 68924660T DE 68924660 D1 DE68924660 D1 DE 68924660D1
Authority
DE
Germany
Prior art keywords
mounting chips
chips
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68924660T
Other languages
English (en)
Other versions
DE68924660T2 (de
Inventor
Kikuji Fukai
Takahiro Tanaka
Makoto Mineno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1988018495U external-priority patent/JPH0810234Y2/ja
Priority claimed from JP63108065A external-priority patent/JPH06103800B2/ja
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Application granted granted Critical
Publication of DE68924660D1 publication Critical patent/DE68924660D1/de
Publication of DE68924660T2 publication Critical patent/DE68924660T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0478—Simultaneously mounting of different components
    • H05K13/0482—Simultaneously mounting of different components using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE68924660T 1988-02-15 1989-02-08 Vorrichtung zum Montieren von Chips. Expired - Fee Related DE68924660T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1988018495U JPH0810234Y2 (ja) 1988-02-15 1988-02-15 チップ状回路部品マウント装置
JP63108065A JPH06103800B2 (ja) 1988-04-28 1988-04-28 チップ状回路部品マウント装置

Publications (2)

Publication Number Publication Date
DE68924660D1 true DE68924660D1 (de) 1995-12-07
DE68924660T2 DE68924660T2 (de) 1996-07-11

Family

ID=26355171

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68924660T Expired - Fee Related DE68924660T2 (de) 1988-02-15 1989-02-08 Vorrichtung zum Montieren von Chips.

Country Status (5)

Country Link
US (1) US4914809A (de)
EP (1) EP0329004B1 (de)
KR (1) KR920002278B1 (de)
DE (1) DE68924660T2 (de)
HK (1) HK105896A (de)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5034083A (en) * 1989-10-16 1991-07-23 Xerox Corporation Process and apparatus for assembling smaller scanning or printing arrays together to form an extended array
US5040291A (en) * 1990-05-04 1991-08-20 Universal Instruments Corporation Multi-spindle pick and place method and apparatus
US5117555A (en) * 1991-01-17 1992-06-02 International Business Machines Corporation Modular system and method for populating circuit boards
DE4108780C2 (de) * 1991-03-18 1994-12-15 D Andres Malfaz Prieto Vorrichtung zum Zusammenlegen von dünnen Trägermaterialien
US5174021A (en) * 1991-05-31 1992-12-29 At&T Bell Laboratories Device manipulation apparatus and method
FR2693077B1 (fr) * 1992-06-26 1994-09-30 Sgs Thomson Microelectronics Outil de montage de puce entre deux dissipateurs thermiques.
US5456007A (en) * 1993-12-27 1995-10-10 Ford Motor Company Assist method and apparatus for fitting close tolerance valves into bores
US5670009A (en) * 1995-02-28 1997-09-23 Eastman Kodak Company Assembly technique for an image sensor array
US6112905A (en) * 1996-07-31 2000-09-05 Aseco Corporation Automatic semiconductor part handler
JP3914602B2 (ja) 1997-01-06 2007-05-16 松下電器産業株式会社 電子部品実装装置におけるノズル交換方法
JPH10224097A (ja) * 1997-02-04 1998-08-21 Mitsubishi Electric Corp 両面実装基板用受け治具
JP3512598B2 (ja) * 1997-07-01 2004-03-29 アルプス電気株式会社 チップ部品装着装置
US5901444A (en) * 1997-07-01 1999-05-11 Ford Global Technologies, Inc. Assist method for fitting close tolerance valves into bores
US6085407A (en) * 1997-08-21 2000-07-11 Micron Technology, Inc. Component alignment apparatuses and methods
US6701610B1 (en) * 1998-07-28 2004-03-09 Koninklijke Philips Electronics N.V. Pick and place machine with varied nozzle lengths
JP3506952B2 (ja) * 1999-05-28 2004-03-15 株式会社大橋製作所 電気部品の位置出し供給方法及びその装置
KR20010114161A (ko) * 2000-06-21 2001-12-29 마츠시타 덴끼 산교 가부시키가이샤 부품의 장착 장치 및 장착 방법
US6731353B1 (en) * 2001-08-17 2004-05-04 Alien Technology Corporation Method and apparatus for transferring blocks
US7023347B2 (en) * 2002-08-02 2006-04-04 Symbol Technologies, Inc. Method and system for forming a die frame and for transferring dies therewith
JP3833997B2 (ja) * 2002-12-17 2006-10-18 オリオン電機株式会社 プリント回路板の製造方法
TW200504809A (en) * 2003-06-12 2005-02-01 Matrics Inc Method and system for high volume transfer of dies to substrates
US20060225273A1 (en) * 2005-03-29 2006-10-12 Symbol Technologies, Inc. Transferring die(s) from an intermediate surface to a substrate
US20070107186A1 (en) * 2005-11-04 2007-05-17 Symbol Technologies, Inc. Method and system for high volume transfer of dies to substrates
KR100816071B1 (ko) * 2006-09-22 2008-03-24 미래산업 주식회사 전자부품 픽커 및 이를 구비한 핸들러용 헤드 어셈블리
US20100047053A1 (en) * 2008-08-19 2010-02-25 Silverbrook Research Pty Ltd Die picker for picking printhead die from a wafer
US7979979B2 (en) * 2008-08-19 2011-07-19 Silverbrook Research Pty Ltd Clamp assembly for an assembler of integrated circuitry on a carrier
US8296937B2 (en) * 2008-08-19 2012-10-30 Silverbrook Research Pty Ltd Wafer positioning system
US8092625B2 (en) * 2008-08-19 2012-01-10 Silverbrook Research Pty Ltd Integrated circuit placement system
US7877876B2 (en) * 2008-08-19 2011-02-01 Silverbrook Research Pty Ltd Method of attaching integrated circuits to a carrier
US8701276B2 (en) * 2008-08-19 2014-04-22 Zamtec Ltd Placement head for a die placing assembly
US20100047962A1 (en) * 2008-08-19 2010-02-25 Silverbrook Research Pty Ltd Multi-chip printhead assembler
US20100043214A1 (en) * 2008-08-19 2010-02-25 Silverbrook Research Pty Ltd Integrated circuit dice pick and lift head
US20150214204A1 (en) * 2014-01-28 2015-07-30 Infineon Technologies Ag Electronic Device and Method for Fabricating an Electronic Device
US10238145B2 (en) * 2015-05-19 2019-03-26 Rai Strategic Holdings, Inc. Assembly substation for assembling a cartridge for a smoking article
US20170290211A1 (en) * 2016-04-01 2017-10-05 Intel Corporation Batch component placement template
KR101646487B1 (ko) * 2016-04-11 2016-08-08 채광식 두부 절단기와 그 절단기용 절단장치 및 절단칼대

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5537879B2 (de) * 1973-10-15 1980-09-30
US4451324A (en) * 1979-05-12 1984-05-29 Sony Corporation Apparatus for placing chip type circuit elements on a board
DE2935081C2 (de) * 1979-08-30 1985-12-19 Philips Patentverwaltung Gmbh, 2000 Hamburg Vorrichtung zur Bestückung von Leiterplatten.
US4670981A (en) * 1986-03-17 1987-06-09 Nitto Kogyo Kabushiki Kaisha Method of mounting electronic parts on the predetermined positions of a printed circuit board

Also Published As

Publication number Publication date
EP0329004B1 (de) 1995-11-02
EP0329004A3 (en) 1990-10-10
KR920002278B1 (ko) 1992-03-20
DE68924660T2 (de) 1996-07-11
EP0329004A2 (de) 1989-08-23
KR890013972A (ko) 1989-09-26
HK105896A (en) 1996-06-28
US4914809A (en) 1990-04-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee