DE3685386D1 - Vorrichtung zum polieren von halbleiterscheiben. - Google Patents

Vorrichtung zum polieren von halbleiterscheiben.

Info

Publication number
DE3685386D1
DE3685386D1 DE8686109817T DE3685386T DE3685386D1 DE 3685386 D1 DE3685386 D1 DE 3685386D1 DE 8686109817 T DE8686109817 T DE 8686109817T DE 3685386 T DE3685386 T DE 3685386T DE 3685386 D1 DE3685386 D1 DE 3685386D1
Authority
DE
Germany
Prior art keywords
polishing semiconductor
semiconductor discs
discs
polishing
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8686109817T
Other languages
English (en)
Inventor
Paul W Cronkhite
Bruce C Bosley
James H Jones
Asit G Patel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Application granted granted Critical
Publication of DE3685386D1 publication Critical patent/DE3685386D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
DE8686109817T 1985-09-23 1986-07-17 Vorrichtung zum polieren von halbleiterscheiben. Expired - Lifetime DE3685386D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/779,339 US4680893A (en) 1985-09-23 1985-09-23 Apparatus for polishing semiconductor wafers

Publications (1)

Publication Number Publication Date
DE3685386D1 true DE3685386D1 (de) 1992-06-25

Family

ID=25116105

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686109817T Expired - Lifetime DE3685386D1 (de) 1985-09-23 1986-07-17 Vorrichtung zum polieren von halbleiterscheiben.

Country Status (5)

Country Link
US (1) US4680893A (de)
EP (1) EP0216054B1 (de)
JP (1) JP2572577B2 (de)
KR (1) KR920009984B1 (de)
DE (1) DE3685386D1 (de)

Families Citing this family (113)

* Cited by examiner, † Cited by third party
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USRE36890E (en) * 1990-07-31 2000-10-03 Motorola, Inc. Gradient chuck method for wafer bonding employing a convex pressure
US5320706A (en) * 1991-10-15 1994-06-14 Texas Instruments Incorporated Removing slurry residue from semiconductor wafer planarization
JPH0615565A (ja) * 1991-12-18 1994-01-25 Shin Etsu Handotai Co Ltd ウエーハ自動ラッピング装置
JP2789153B2 (ja) * 1992-01-27 1998-08-20 マイクロン テクノロジー インコーポレイテッド マイクロスクラッチのない平滑面を形成するための半導体ウェハの化学機械的平坦化方法
US5514245A (en) * 1992-01-27 1996-05-07 Micron Technology, Inc. Method for chemical planarization (CMP) of a semiconductor wafer to provide a planar surface free of microscratches
US5245794A (en) * 1992-04-09 1993-09-21 Advanced Micro Devices, Inc. Audio end point detector for chemical-mechanical polishing and method therefor
US5329732A (en) 1992-06-15 1994-07-19 Speedfam Corporation Wafer polishing method and apparatus
US5498199A (en) * 1992-06-15 1996-03-12 Speedfam Corporation Wafer polishing method and apparatus
JP3027882B2 (ja) 1992-07-31 2000-04-04 信越半導体株式会社 ウエーハ面取部研磨装置
JP2655975B2 (ja) * 1992-09-18 1997-09-24 三菱マテリアル株式会社 ウェーハ研磨装置
US5487697A (en) * 1993-02-09 1996-01-30 Rodel, Inc. Polishing apparatus and method using a rotary work holder travelling down a rail for polishing a workpiece with linear pads
US5443416A (en) * 1993-09-09 1995-08-22 Cybeq Systems Incorporated Rotary union for coupling fluids in a wafer polishing apparatus
US5679059A (en) * 1994-11-29 1997-10-21 Ebara Corporation Polishing aparatus and method
US5885138A (en) 1993-09-21 1999-03-23 Ebara Corporation Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
JP2513426B2 (ja) * 1993-09-20 1996-07-03 日本電気株式会社 ウェ―ハ研磨装置
KR100390293B1 (ko) * 1993-09-21 2003-09-02 가부시끼가이샤 도시바 폴리싱장치
US5531861A (en) * 1993-09-29 1996-07-02 Motorola, Inc. Chemical-mechanical-polishing pad cleaning process for use during the fabrication of semiconductor devices
JP3326642B2 (ja) * 1993-11-09 2002-09-24 ソニー株式会社 基板の研磨後処理方法およびこれに用いる研磨装置
US5938504A (en) 1993-11-16 1999-08-17 Applied Materials, Inc. Substrate polishing apparatus
US5653623A (en) * 1993-12-14 1997-08-05 Ebara Corporation Polishing apparatus with improved exhaust
US5643053A (en) * 1993-12-27 1997-07-01 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved polishing control
US5582534A (en) * 1993-12-27 1996-12-10 Applied Materials, Inc. Orbital chemical mechanical polishing apparatus and method
US5650039A (en) * 1994-03-02 1997-07-22 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved slurry distribution
US5449314A (en) * 1994-04-25 1995-09-12 Micron Technology, Inc. Method of chimical mechanical polishing for dielectric layers
US5733175A (en) * 1994-04-25 1998-03-31 Leach; Michael A. Polishing a workpiece using equal velocity at all points overlapping a polisher
US5795495A (en) * 1994-04-25 1998-08-18 Micron Technology, Inc. Method of chemical mechanical polishing for dielectric layers
US5679060A (en) * 1994-07-14 1997-10-21 Silicon Technology Corporation Wafer grinding machine
US5534106A (en) * 1994-07-26 1996-07-09 Kabushiki Kaisha Toshiba Apparatus for processing semiconductor wafers
US5607341A (en) * 1994-08-08 1997-03-04 Leach; Michael A. Method and structure for polishing a wafer during manufacture of integrated circuits
US5558111A (en) * 1995-02-02 1996-09-24 International Business Machines Corporation Apparatus and method for carrier backing film reconditioning
US5769696A (en) * 1995-02-10 1998-06-23 Advanced Micro Devices, Inc. Chemical-mechanical polishing of thin materials using non-baked carrier film
JP2647050B2 (ja) * 1995-03-31 1997-08-27 日本電気株式会社 ウェハ研磨装置
US5593343A (en) * 1995-04-03 1997-01-14 Bauer; Jason Apparatus for reconditioning digital recording discs
US5954566A (en) * 1995-04-03 1999-09-21 Bauer; Jason Method and apparatus for reconditioning digital recording discs
JP3690837B2 (ja) * 1995-05-02 2005-08-31 株式会社荏原製作所 ポリッシング装置及び方法
US5578529A (en) * 1995-06-02 1996-11-26 Motorola Inc. Method for using rinse spray bar in chemical mechanical polishing
US5816891A (en) * 1995-06-06 1998-10-06 Advanced Micro Devices, Inc. Performing chemical mechanical polishing of oxides and metals using sequential removal on multiple polish platens to increase equipment throughput
US6110820A (en) * 1995-06-07 2000-08-29 Micron Technology, Inc. Low scratch density chemical mechanical planarization process
JP3678468B2 (ja) * 1995-07-18 2005-08-03 株式会社荏原製作所 ポリッシング装置
JP2850803B2 (ja) * 1995-08-01 1999-01-27 信越半導体株式会社 ウエーハ研磨方法
KR100487590B1 (ko) 1995-08-21 2005-08-04 가부시키가이샤 에바라 세이사꾸쇼 폴리싱장치
US5685766A (en) * 1995-11-30 1997-11-11 Speedfam Corporation Polishing control method
US6050884A (en) * 1996-02-28 2000-04-18 Ebara Corporation Polishing apparatus
US5800254A (en) * 1996-04-01 1998-09-01 Buehler Ltd. Automatic apparatus for grinding and polishing samples
JP3696690B2 (ja) * 1996-04-23 2005-09-21 不二越機械工業株式会社 ウェーハの研磨装置システム
US6012966A (en) * 1996-05-10 2000-01-11 Canon Kabushiki Kaisha Precision polishing apparatus with detecting means
US6413156B1 (en) 1996-05-16 2002-07-02 Ebara Corporation Method and apparatus for polishing workpiece
JP2000315665A (ja) * 1999-04-29 2000-11-14 Ebara Corp 研磨方法及び装置
DE69719847T2 (de) * 1996-05-16 2004-02-05 Ebara Corp. Verfahren und Vorrichtung zum Polieren von Werkstücken
KR100241537B1 (ko) * 1996-06-21 2000-02-01 김영환 반도체 소자의 층간 절연막 평탄화 방법
US5932486A (en) * 1996-08-16 1999-08-03 Rodel, Inc. Apparatus and methods for recirculating chemical-mechanical polishing of semiconductor wafers
US6210525B1 (en) 1996-08-16 2001-04-03 Rodel Holdings, Inc. Apparatus and methods for chemical-mechanical polishing of semiconductor wafers
US6245679B1 (en) 1996-08-16 2001-06-12 Rodel Holdings, Inc Apparatus and methods for chemical-mechanical polishing of semiconductor wafers
US6537137B2 (en) 1996-08-16 2003-03-25 Rodel Holdings, Inc Methods for chemical-mechanical polishing of semiconductor wafers
US6200201B1 (en) * 1996-08-29 2001-03-13 Lam Research Corporation Cleaning/buffer apparatus for use in a wafer processing device
US5702292A (en) * 1996-10-31 1997-12-30 Micron Technology, Inc. Apparatus and method for loading and unloading substrates to a chemical-mechanical planarization machine
US5716258A (en) * 1996-11-26 1998-02-10 Metcalf; Robert L. Semiconductor wafer polishing machine and method
US6379221B1 (en) 1996-12-31 2002-04-30 Applied Materials, Inc. Method and apparatus for automatically changing a polishing pad in a chemical mechanical polishing system
US6012970A (en) * 1997-01-15 2000-01-11 Motorola, Inc. Process for forming a semiconductor device
TW426556B (en) * 1997-01-24 2001-03-21 United Microelectronics Corp Method of cleaning slurry remnants left on a chemical-mechanical polish machine
JP3705670B2 (ja) * 1997-02-19 2005-10-12 株式会社荏原製作所 ポリッシング装置及び方法
US6048254A (en) * 1997-03-06 2000-04-11 Keltech Engineering Lapping apparatus and process with annular abrasive area
US5967882A (en) * 1997-03-06 1999-10-19 Keltech Engineering Lapping apparatus and process with two opposed lapping platens
US6149506A (en) * 1998-10-07 2000-11-21 Keltech Engineering Lapping apparatus and method for high speed lapping with a rotatable abrasive platen
US6120352A (en) * 1997-03-06 2000-09-19 Keltech Engineering Lapping apparatus and lapping method using abrasive sheets
JPH10329015A (ja) * 1997-03-24 1998-12-15 Canon Inc 研磨装置および研磨方法
US6244946B1 (en) 1997-04-08 2001-06-12 Lam Research Corporation Polishing head with removable subcarrier
US6425812B1 (en) 1997-04-08 2002-07-30 Lam Research Corporation Polishing head for chemical mechanical polishing using linear planarization technology
US6139406A (en) 1997-06-24 2000-10-31 Applied Materials, Inc. Combined slurry dispenser and rinse arm and method of operation
JPH1187286A (ja) 1997-09-05 1999-03-30 Lsi Logic Corp 半導体ウエハの二段階式化学的機械的研磨方法及び装置
US6213853B1 (en) 1997-09-10 2001-04-10 Speedfam-Ipec Corporation Integral machine for polishing, cleaning, rinsing and drying workpieces
US6190237B1 (en) 1997-11-06 2001-02-20 International Business Machines Corporation pH-buffered slurry and use thereof for polishing
US6336845B1 (en) 1997-11-12 2002-01-08 Lam Research Corporation Method and apparatus for polishing semiconductor wafers
US5972162A (en) * 1998-01-06 1999-10-26 Speedfam Corporation Wafer polishing with improved end point detection
US6102777A (en) * 1998-03-06 2000-08-15 Keltech Engineering Lapping apparatus and method for high speed lapping with a rotatable abrasive platen
JP3615931B2 (ja) * 1998-03-26 2005-02-02 株式会社荏原製作所 ポリッシング装置および該ポリッシング装置におけるコンディショニング方法
FR2776552B1 (fr) * 1998-03-31 2000-06-16 Procedes & Equipement Pour Les Machine modulaire de polissage et de planarisation de substrats
US6102782A (en) 1998-04-06 2000-08-15 Micron Technology, Inc. System and apparatus for distributing flush fluid to processing equipment
US6257966B1 (en) * 1998-04-27 2001-07-10 Tokyo Seimitsu Co., Ltd. Wafer surface machining apparatus
US6391779B1 (en) 1998-08-11 2002-05-21 Micron Technology, Inc. Planarization process
US6220941B1 (en) * 1998-10-01 2001-04-24 Applied Materials, Inc. Method of post CMP defect stability improvement
JP2000133623A (ja) * 1998-10-28 2000-05-12 Toshiba Corp 平坦化方法及び平坦化装置
US6319098B1 (en) 1998-11-13 2001-11-20 Applied Materials, Inc. Method of post CMP defect stability improvement
US6165052A (en) * 1998-11-16 2000-12-26 Taiwan Semiconductor Manufacturing Company Method and apparatus for chemical/mechanical planarization (CMP) of a semiconductor substrate having shallow trench isolation
US6521536B1 (en) 1999-01-11 2003-02-18 Micron Technology, Inc. Planarization process
US6368189B1 (en) * 1999-03-03 2002-04-09 Mitsubishi Materials Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
US6231428B1 (en) 1999-03-03 2001-05-15 Mitsubishi Materials Corporation Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring
US6354922B1 (en) 1999-08-20 2002-03-12 Ebara Corporation Polishing apparatus
US6358128B1 (en) * 1999-03-05 2002-03-19 Ebara Corporation Polishing apparatus
US6352595B1 (en) * 1999-05-28 2002-03-05 Lam Research Corporation Method and system for cleaning a chemical mechanical polishing pad
US6261159B1 (en) * 1999-07-06 2001-07-17 Kevin Krieg Apparatus and method for the restoration of optical storage media
US6083082A (en) * 1999-08-30 2000-07-04 Lam Research Corporation Spindle assembly for force controlled polishing
US6431959B1 (en) 1999-12-20 2002-08-13 Lam Research Corporation System and method of defect optimization for chemical mechanical planarization of polysilicon
US6669538B2 (en) 2000-02-24 2003-12-30 Applied Materials Inc Pad cleaning for a CMP system
US6666756B1 (en) 2000-03-31 2003-12-23 Lam Research Corporation Wafer carrier head assembly
JP2001326201A (ja) * 2000-05-16 2001-11-22 Ebara Corp ポリッシング装置
US6659116B1 (en) 2000-06-26 2003-12-09 Lam Research Corporation System for wafer carrier in-process clean and rinse
US6505636B1 (en) 2000-06-26 2003-01-14 Lam Research Corporation Apparatus for wafer carrier in-process clean and rinse
US6409580B1 (en) * 2001-03-26 2002-06-25 Speedfam-Ipec Corporation Rigid polishing pad conditioner for chemical mechanical polishing tool
US6599174B1 (en) * 2001-04-27 2003-07-29 Advanced Micro Devices, Inc. Eliminating dishing non-uniformity of a process layer
JP3530158B2 (ja) * 2001-08-21 2004-05-24 沖電気工業株式会社 半導体装置及びその製造方法
US6585567B1 (en) * 2001-08-31 2003-07-01 Koninklijke Philips Electronics N.V. Short CMP polish method
JP2003211355A (ja) * 2002-01-15 2003-07-29 Ebara Corp ポリッシング装置及びドレッシング方法
US20060180486A1 (en) * 2003-04-21 2006-08-17 Bennett David W Modular panel and storage system for flat items such as media discs and holders therefor
US8574028B2 (en) * 2008-06-20 2013-11-05 Illinois Tool Works Inc. Grinder/polisher
JP6209088B2 (ja) * 2013-01-25 2017-10-04 株式会社荏原製作所 研磨方法および装置
KR20160125585A (ko) * 2015-04-21 2016-11-01 삼성전자주식회사 기판 처리 장치 및 기판 처리 방법
US20210299815A1 (en) * 2020-03-31 2021-09-30 Illinois Tool Works Inc. Grinding/polishing devices with recall
TWI766728B (zh) * 2021-06-16 2022-06-01 均豪精密工業股份有限公司 研磨裝置

Family Cites Families (9)

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US3550325A (en) * 1968-03-22 1970-12-29 Ibm Apparatus for providing a finished surface on workpieces
GB1377837A (en) * 1972-10-18 1974-12-18 Dolgov V M Machine for simultaneous grinding of a plurality of semiconduct or blanks
US3888053A (en) * 1973-05-29 1975-06-10 Rca Corp Method of shaping semiconductor workpiece
DE2451549A1 (de) * 1974-10-30 1976-08-12 Mueller Georg Kugellager Belade- und entladevorrichtung fuer plattenfoermige halbleitermaterialien
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US4239567A (en) * 1978-10-16 1980-12-16 Western Electric Company, Inc. Removably holding planar articles for polishing operations
US4313284A (en) * 1980-03-27 1982-02-02 Monsanto Company Apparatus for improving flatness of polished wafers
JPS58192750A (ja) * 1982-05-03 1983-11-10 Toyoda Mach Works Ltd 研削盤

Also Published As

Publication number Publication date
EP0216054A2 (de) 1987-04-01
EP0216054B1 (de) 1992-05-20
US4680893A (en) 1987-07-21
JP2572577B2 (ja) 1997-01-16
JPS6268273A (ja) 1987-03-28
KR920009984B1 (ko) 1992-11-09
EP0216054A3 (en) 1989-03-01
KR870003555A (ko) 1987-04-18

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8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8327 Change in the person/name/address of the patent owner

Owner name: FREESCALE SEMICONDUCTOR, INC. (N.D.GES.D. STAATES