FR2776552B1 - Machine modulaire de polissage et de planarisation de substrats - Google Patents
Machine modulaire de polissage et de planarisation de substratsInfo
- Publication number
- FR2776552B1 FR2776552B1 FR9804202A FR9804202A FR2776552B1 FR 2776552 B1 FR2776552 B1 FR 2776552B1 FR 9804202 A FR9804202 A FR 9804202A FR 9804202 A FR9804202 A FR 9804202A FR 2776552 B1 FR2776552 B1 FR 2776552B1
- Authority
- FR
- France
- Prior art keywords
- unloading
- loading
- substrates
- planarizing machine
- automaton
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Multi-Process Working Machines And Systems (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9804202A FR2776552B1 (fr) | 1998-03-31 | 1998-03-31 | Machine modulaire de polissage et de planarisation de substrats |
PCT/FR1999/000739 WO1999050023A1 (fr) | 1998-03-31 | 1999-03-30 | Machine modulaire de polissage et de planarisation de substrats |
US09/646,956 US6343979B1 (en) | 1998-03-31 | 1999-03-30 | Modular machine for polishing and planing substrates |
DE69904647T DE69904647D1 (de) | 1998-03-31 | 1999-03-30 | Baukastensystem poliermaschine und substrat planarisierung |
JP2000540971A JP2002509812A (ja) | 1998-03-31 | 1999-03-30 | 基板の研磨平削りモジューラ機 |
KR10-2000-7010773A KR100531987B1 (ko) | 1998-03-31 | 1999-03-30 | 기판의 연마 및 평삭을 위한 모듈식 장치 |
CNB998046353A CN1134323C (zh) | 1998-03-31 | 1999-03-30 | 一种用于磨削和刨削基片的组合机床 |
AT99937813T ATE229867T1 (de) | 1998-03-31 | 1999-03-30 | Baukastensystem poliermaschine und substrat planarisierung |
EP99937813A EP1137514B1 (fr) | 1998-03-31 | 1999-03-30 | Machine modulaire de polissage et de planarisation de substrats |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9804202A FR2776552B1 (fr) | 1998-03-31 | 1998-03-31 | Machine modulaire de polissage et de planarisation de substrats |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2776552A1 FR2776552A1 (fr) | 1999-10-01 |
FR2776552B1 true FR2776552B1 (fr) | 2000-06-16 |
Family
ID=9524860
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9804202A Expired - Fee Related FR2776552B1 (fr) | 1998-03-31 | 1998-03-31 | Machine modulaire de polissage et de planarisation de substrats |
Country Status (9)
Country | Link |
---|---|
US (1) | US6343979B1 (fr) |
EP (1) | EP1137514B1 (fr) |
JP (1) | JP2002509812A (fr) |
KR (1) | KR100531987B1 (fr) |
CN (1) | CN1134323C (fr) |
AT (1) | ATE229867T1 (fr) |
DE (1) | DE69904647D1 (fr) |
FR (1) | FR2776552B1 (fr) |
WO (1) | WO1999050023A1 (fr) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6575818B2 (en) * | 2001-06-27 | 2003-06-10 | Oriol Inc. | Apparatus and method for polishing multiple semiconductor wafers in parallel |
US7273408B2 (en) * | 2005-12-16 | 2007-09-25 | Applied Materials, Inc. | Paired pivot arm |
KR100899973B1 (ko) * | 2006-06-14 | 2009-05-28 | 이노플라 아엔씨 | 반도체 웨이퍼 연마 장치 |
US9570311B2 (en) * | 2012-02-10 | 2017-02-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Modular grinding apparatuses and methods for wafer thinning |
FR3054158B1 (fr) * | 2016-07-21 | 2019-06-28 | Comau France | Machine-outil d’usinage |
WO2019186704A1 (fr) * | 2018-03-27 | 2019-10-03 | 平田機工株式会社 | Dispositif de travail et système de travail |
US20210323117A1 (en) * | 2020-04-16 | 2021-10-21 | Applied Materials, Inc. | High throughput polishing modules and modular polishing systems |
US11705354B2 (en) | 2020-07-10 | 2023-07-18 | Applied Materials, Inc. | Substrate handling systems |
WO2023125916A1 (fr) * | 2021-12-31 | 2023-07-06 | 杭州众硅电子科技有限公司 | Système de polissage de tranche et procédé de transfert de tranche |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4680893A (en) * | 1985-09-23 | 1987-07-21 | Motorola, Inc. | Apparatus for polishing semiconductor wafers |
JPS63207559A (ja) * | 1987-02-19 | 1988-08-26 | Disco Abrasive Syst Ltd | ウエ−ハ自動研削装置 |
US5827110A (en) * | 1994-12-28 | 1998-10-27 | Kabushiki Kaisha Toshiba | Polishing facility |
KR100390293B1 (ko) * | 1993-09-21 | 2003-09-02 | 가부시끼가이샤 도시바 | 폴리싱장치 |
US5562524A (en) * | 1994-05-04 | 1996-10-08 | Gill, Jr.; Gerald L. | Polishing apparatus |
US5655954A (en) * | 1994-11-29 | 1997-08-12 | Toshiba Kikai Kabushiki Kaisha | Polishing apparatus |
US5738574A (en) | 1995-10-27 | 1998-04-14 | Applied Materials, Inc. | Continuous processing system for chemical mechanical polishing |
JP3679871B2 (ja) * | 1996-09-04 | 2005-08-03 | 株式会社荏原製作所 | ポリッシング装置及び搬送ロボット |
US5893795A (en) * | 1997-07-11 | 1999-04-13 | Applied Materials, Inc. | Apparatus for moving a cassette |
US6110011A (en) * | 1997-11-10 | 2000-08-29 | Applied Materials, Inc. | Integrated electrodeposition and chemical-mechanical polishing tool |
-
1998
- 1998-03-31 FR FR9804202A patent/FR2776552B1/fr not_active Expired - Fee Related
-
1999
- 1999-03-30 CN CNB998046353A patent/CN1134323C/zh not_active Expired - Fee Related
- 1999-03-30 KR KR10-2000-7010773A patent/KR100531987B1/ko not_active IP Right Cessation
- 1999-03-30 JP JP2000540971A patent/JP2002509812A/ja active Pending
- 1999-03-30 AT AT99937813T patent/ATE229867T1/de not_active IP Right Cessation
- 1999-03-30 US US09/646,956 patent/US6343979B1/en not_active Expired - Fee Related
- 1999-03-30 DE DE69904647T patent/DE69904647D1/de not_active Expired - Lifetime
- 1999-03-30 EP EP99937813A patent/EP1137514B1/fr not_active Expired - Lifetime
- 1999-03-30 WO PCT/FR1999/000739 patent/WO1999050023A1/fr active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
US6343979B1 (en) | 2002-02-05 |
CN1296434A (zh) | 2001-05-23 |
EP1137514A1 (fr) | 2001-10-04 |
JP2002509812A (ja) | 2002-04-02 |
CN1134323C (zh) | 2004-01-14 |
KR100531987B1 (ko) | 2005-11-30 |
FR2776552A1 (fr) | 1999-10-01 |
WO1999050023A1 (fr) | 1999-10-07 |
EP1137514B1 (fr) | 2002-12-18 |
KR20010078700A (ko) | 2001-08-21 |
DE69904647D1 (de) | 2003-01-30 |
ATE229867T1 (de) | 2003-01-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
TP | Transmission of property | ||
TP | Transmission of property | ||
TP | Transmission of property | ||
ST | Notification of lapse |
Effective date: 20091130 |