DE69832554D1 - Doppelseitenreinigungsmaschine für Halbleitersubstrat - Google Patents
Doppelseitenreinigungsmaschine für HalbleitersubstratInfo
- Publication number
- DE69832554D1 DE69832554D1 DE69832554T DE69832554T DE69832554D1 DE 69832554 D1 DE69832554 D1 DE 69832554D1 DE 69832554 T DE69832554 T DE 69832554T DE 69832554 T DE69832554 T DE 69832554T DE 69832554 D1 DE69832554 D1 DE 69832554D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor substrate
- cleaning machine
- double side
- side cleaning
- double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004140 cleaning Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9139156A JPH10321572A (ja) | 1997-05-15 | 1997-05-15 | 半導体ウェーハの両面洗浄装置及び半導体ウェーハのポリッシング方法 |
JP13915697 | 1997-05-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69832554D1 true DE69832554D1 (de) | 2006-01-05 |
DE69832554T2 DE69832554T2 (de) | 2006-08-10 |
Family
ID=15238889
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69832554T Expired - Lifetime DE69832554T2 (de) | 1997-05-15 | 1998-05-14 | Doppelseitenreinigungsmaschine für Halbleitersubstrat |
Country Status (5)
Country | Link |
---|---|
US (1) | US6167583B1 (de) |
EP (1) | EP0878831B1 (de) |
JP (1) | JPH10321572A (de) |
KR (1) | KR100396421B1 (de) |
DE (1) | DE69832554T2 (de) |
Families Citing this family (66)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08162425A (ja) * | 1994-12-06 | 1996-06-21 | Mitsubishi Electric Corp | 半導体集積回路装置の製造方法および製造装置 |
JP4200565B2 (ja) * | 1998-06-24 | 2008-12-24 | 日立金属株式会社 | 電子部品の洗浄方法 |
JP3395696B2 (ja) | 1999-03-15 | 2003-04-14 | 日本電気株式会社 | ウェハ処理装置およびウェハ処理方法 |
US6358847B1 (en) | 1999-03-31 | 2002-03-19 | Lam Research Corporation | Method for enabling conventional wire bonding to copper-based bond pad features |
JP4127926B2 (ja) * | 1999-04-08 | 2008-07-30 | 株式会社荏原製作所 | ポリッシング方法 |
JP4481394B2 (ja) * | 1999-08-13 | 2010-06-16 | 株式会社荏原製作所 | 半導体基板の洗浄装置及びその洗浄方法 |
KR20010037210A (ko) * | 1999-10-14 | 2001-05-07 | 구본준, 론 위라하디락사 | 기판 세정 장치 및 기판 세정 방법 |
US6622334B1 (en) * | 2000-03-29 | 2003-09-23 | International Business Machines Corporation | Wafer edge cleaning utilizing polish pad material |
US6523210B1 (en) * | 2000-04-05 | 2003-02-25 | Nicholas Andros | Surface charge controlling apparatus for wafer cleaning |
TW491750B (en) * | 2000-10-04 | 2002-06-21 | Speedfam Ipec Corp | Method and apparatus for electrochemical planarization of a workpiece |
KR100685919B1 (ko) * | 2000-12-29 | 2007-02-22 | 엘지.필립스 엘시디 주식회사 | 세정 장치 |
JP2003068695A (ja) * | 2001-08-29 | 2003-03-07 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
US6817057B2 (en) * | 2001-08-30 | 2004-11-16 | Micron Technology, Inc. | Spindle chuck cleaner |
US6827633B2 (en) * | 2001-12-28 | 2004-12-07 | Ebara Corporation | Polishing method |
US20040049870A1 (en) * | 2002-06-21 | 2004-03-18 | Applied Materials, Inc. | Substrate scrubbing apparatus having stationary brush member in contact with edge bevel of rotating substrate |
US7007333B1 (en) * | 2002-06-28 | 2006-03-07 | Lam Research Corporation | System and method for a combined contact and non-contact wafer cleaning module |
US7743449B2 (en) * | 2002-06-28 | 2010-06-29 | Lam Research Corporation | System and method for a combined contact and non-contact wafer cleaning module |
US6916233B2 (en) * | 2002-11-28 | 2005-07-12 | Tsc Corporation | Polishing and cleaning compound device |
KR100506814B1 (ko) * | 2003-01-15 | 2005-08-09 | 삼성전자주식회사 | 웨이퍼 연마 장치 |
US6951042B1 (en) * | 2003-02-28 | 2005-10-04 | Lam Research Corporation | Brush scrubbing-high frequency resonating wafer processing system and methods for making and implementing the same |
US20040177813A1 (en) * | 2003-03-12 | 2004-09-16 | Applied Materials, Inc. | Substrate support lift mechanism |
US20040261823A1 (en) * | 2003-06-27 | 2004-12-30 | Lam Research Corporation | Method and apparatus for removing a target layer from a substrate using reactive gases |
US7913703B1 (en) | 2003-06-27 | 2011-03-29 | Lam Research Corporation | Method and apparatus for uniformly applying a multi-phase cleaning solution to a substrate |
US7737097B2 (en) * | 2003-06-27 | 2010-06-15 | Lam Research Corporation | Method for removing contamination from a substrate and for making a cleaning solution |
US8316866B2 (en) * | 2003-06-27 | 2012-11-27 | Lam Research Corporation | Method and apparatus for cleaning a semiconductor substrate |
US7648584B2 (en) * | 2003-06-27 | 2010-01-19 | Lam Research Corporation | Method and apparatus for removing contamination from substrate |
US8522801B2 (en) * | 2003-06-27 | 2013-09-03 | Lam Research Corporation | Method and apparatus for cleaning a semiconductor substrate |
US7799141B2 (en) * | 2003-06-27 | 2010-09-21 | Lam Research Corporation | Method and system for using a two-phases substrate cleaning compound |
US7353560B2 (en) * | 2003-12-18 | 2008-04-08 | Lam Research Corporation | Proximity brush unit apparatus and method |
US7862662B2 (en) * | 2005-12-30 | 2011-01-04 | Lam Research Corporation | Method and material for cleaning a substrate |
US8323420B2 (en) | 2005-06-30 | 2012-12-04 | Lam Research Corporation | Method for removing material from semiconductor wafer and apparatus for performing the same |
US7416370B2 (en) * | 2005-06-15 | 2008-08-26 | Lam Research Corporation | Method and apparatus for transporting a substrate using non-Newtonian fluid |
US8043441B2 (en) * | 2005-06-15 | 2011-10-25 | Lam Research Corporation | Method and apparatus for cleaning a substrate using non-Newtonian fluids |
US8522799B2 (en) * | 2005-12-30 | 2013-09-03 | Lam Research Corporation | Apparatus and system for cleaning a substrate |
US7568490B2 (en) * | 2003-12-23 | 2009-08-04 | Lam Research Corporation | Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids |
CN100502722C (zh) | 2004-01-29 | 2009-06-24 | 应用材料公司 | 在心轴上安装洗涤器刷子的方法和设备 |
TWI240028B (en) * | 2004-06-23 | 2005-09-21 | Ind Tech Res Inst | Portable ultrasonic cleaning machine |
US8480810B2 (en) * | 2005-12-30 | 2013-07-09 | Lam Research Corporation | Method and apparatus for particle removal |
SG154438A1 (en) * | 2005-12-30 | 2009-08-28 | Lam Res Corp | Cleaning compound and method and system for using the cleaning compound |
JP4813185B2 (ja) * | 2006-01-17 | 2011-11-09 | 富士通セミコンダクター株式会社 | ウェハの洗浄装置及び洗浄方法 |
DE102006007442A1 (de) * | 2006-02-17 | 2007-08-23 | BSH Bosch und Siemens Hausgeräte GmbH | Reinigungsvorrichtung für ein Bauteil eines Haushaltswäschetrockners |
JP2009529241A (ja) | 2006-03-07 | 2009-08-13 | アプライド マテリアルズ インコーポレイテッド | スリーブを備えたスクラバブラシおよびスクラバブラシと共に用いるためのブラシマンドレル |
US8127395B2 (en) * | 2006-05-05 | 2012-03-06 | Lam Research Corporation | Apparatus for isolated bevel edge clean and method for using the same |
US20080148595A1 (en) * | 2006-12-20 | 2008-06-26 | Lam Research Corporation | Method and apparatus for drying substrates using a surface tensions reducing gas |
US7897213B2 (en) * | 2007-02-08 | 2011-03-01 | Lam Research Corporation | Methods for contained chemical surface treatment |
KR100879015B1 (ko) | 2007-03-13 | 2009-01-15 | 주식회사 에스에프에이 | 기판 세정장치 |
KR100871135B1 (ko) * | 2007-03-13 | 2008-12-03 | 주식회사 에스에프에이 | 기판 세정장치 |
US8388762B2 (en) * | 2007-05-02 | 2013-03-05 | Lam Research Corporation | Substrate cleaning technique employing multi-phase solution |
JP2009123831A (ja) * | 2007-11-13 | 2009-06-04 | Tokyo Electron Ltd | Bsp除去方法、bsp除去装置、基板処理装置、及び記憶媒体 |
US8211846B2 (en) | 2007-12-14 | 2012-07-03 | Lam Research Group | Materials for particle removal by single-phase and two-phase media |
JP5356776B2 (ja) * | 2008-10-31 | 2013-12-04 | 株式会社ディスコ | 研削装置 |
TWI452423B (zh) * | 2012-11-19 | 2014-09-11 | Gudeng Prec Industral Co Ltd | 光罩清洗方法及其系統 |
TWM457962U (zh) * | 2012-11-21 | 2013-07-21 | Gudeng Prec Ind Co Ltd | 光罩水洗清潔機構 |
JP6016301B2 (ja) | 2013-02-13 | 2016-10-26 | 昭和電工株式会社 | 単結晶SiC基板の表面加工方法、その製造方法及び単結晶SiC基板の表面加工用研削プレート |
CN104174601B (zh) * | 2014-07-23 | 2016-03-09 | 上海华虹宏力半导体制造有限公司 | 半导体晶圆的刷洗装置和刷洗方法 |
US9748090B2 (en) * | 2015-01-22 | 2017-08-29 | Toshiba Memory Corporation | Semiconductor manufacturing apparatus and manufacturing method of semiconductor device |
JP6491908B2 (ja) * | 2015-03-09 | 2019-03-27 | 株式会社荏原製作所 | 基板洗浄装置、基板洗浄方法、および基板処理装置 |
KR102454775B1 (ko) * | 2015-02-18 | 2022-10-17 | 가부시키가이샤 에바라 세이사꾸쇼 | 기판 세정 장치, 기판 세정 방법 및 기판 처리 장치 |
JP2016174077A (ja) * | 2015-03-17 | 2016-09-29 | 株式会社東芝 | 基板洗浄装置および基板洗浄方法 |
CN107221491B (zh) * | 2016-03-22 | 2021-10-22 | 东京毅力科创株式会社 | 基板清洗装置 |
JP6808519B2 (ja) * | 2016-03-22 | 2021-01-06 | 東京エレクトロン株式会社 | 基板洗浄装置 |
WO2018003718A1 (ja) | 2016-06-27 | 2018-01-04 | 株式会社荏原製作所 | 基板洗浄装置及び基板洗浄方法 |
CN109427613A (zh) * | 2017-09-01 | 2019-03-05 | 联华电子股份有限公司 | 晶片清洗设备及应用其的晶片清洗方法 |
CN108889657B (zh) * | 2018-08-06 | 2021-05-14 | 安徽省三环康乐包装材料有限公司 | 一种可转动式包装盒纸板双面清洗装置 |
JP7274883B2 (ja) * | 2019-02-19 | 2023-05-17 | 株式会社荏原製作所 | 洗浄部材用洗浄装置及び基板処理装置 |
CN112570347A (zh) * | 2020-11-12 | 2021-03-30 | 来有合 | 一种汽车刹车盘清洁去尘装置 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60143634A (ja) * | 1983-12-29 | 1985-07-29 | Fujitsu Ltd | ウエ−ハ処理方法及び装置 |
US4728552A (en) * | 1984-07-06 | 1988-03-01 | Rodel, Inc. | Substrate containing fibers of predetermined orientation and process of making the same |
US5048549A (en) * | 1988-03-02 | 1991-09-17 | General Dynamics Corp., Air Defense Systems Div. | Apparatus for cleaning and/or fluxing circuit card assemblies |
US5317778A (en) * | 1991-07-31 | 1994-06-07 | Shin-Etsu Handotai Co., Ltd. | Automatic cleaning apparatus for wafers |
JP3030796B2 (ja) * | 1992-07-24 | 2000-04-10 | 東京エレクトロン株式会社 | 洗浄処理方法 |
JP3324181B2 (ja) * | 1993-03-12 | 2002-09-17 | 富士通株式会社 | ウエハの洗浄方法 |
US5350428A (en) * | 1993-06-17 | 1994-09-27 | Vlsi Technology, Inc. | Electrostatic apparatus and method for removing particles from semiconductor wafers |
EP1080797A3 (de) | 1994-06-28 | 2005-10-05 | Ebara Corporation | Verfahren und Vorrichtung für die Reinigung von Werkstücken |
US5723019A (en) * | 1994-07-15 | 1998-03-03 | Ontrak Systems, Incorporated | Drip chemical delivery method and apparatus |
DE69620037T2 (de) * | 1995-10-13 | 2002-11-07 | Lam Res Corp | VORRICHTUNG ZUR aBGABE VON ZWEI CHEMISCHEN PRODUKTEN DURCH EINE BÜRSTE |
US5901399A (en) * | 1996-12-30 | 1999-05-11 | Intel Corporation | Flexible-leaf substrate edge cleaning apparatus |
US5868857A (en) * | 1996-12-30 | 1999-02-09 | Intel Corporation | Rotating belt wafer edge cleaning apparatus |
JP3399772B2 (ja) | 1997-02-28 | 2003-04-21 | 株式会社藤森技術研究所 | 半導体製造装置の洗浄装置 |
-
1997
- 1997-05-15 JP JP9139156A patent/JPH10321572A/ja active Pending
-
1998
- 1998-05-14 DE DE69832554T patent/DE69832554T2/de not_active Expired - Lifetime
- 1998-05-14 KR KR10-1998-0017350A patent/KR100396421B1/ko not_active IP Right Cessation
- 1998-05-14 US US09/078,132 patent/US6167583B1/en not_active Expired - Fee Related
- 1998-05-14 EP EP98108801A patent/EP0878831B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH10321572A (ja) | 1998-12-04 |
US6167583B1 (en) | 2001-01-02 |
EP0878831B1 (de) | 2005-11-30 |
EP0878831A2 (de) | 1998-11-18 |
KR100396421B1 (ko) | 2003-10-17 |
KR19980087037A (ko) | 1998-12-05 |
DE69832554T2 (de) | 2006-08-10 |
EP0878831A3 (de) | 2000-09-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |