DE60030829D1 - Halbleiterscheibehalter für Poliermaschine - Google Patents
Halbleiterscheibehalter für PoliermaschineInfo
- Publication number
- DE60030829D1 DE60030829D1 DE60030829T DE60030829T DE60030829D1 DE 60030829 D1 DE60030829 D1 DE 60030829D1 DE 60030829 T DE60030829 T DE 60030829T DE 60030829 T DE60030829 T DE 60030829T DE 60030829 D1 DE60030829 D1 DE 60030829D1
- Authority
- DE
- Germany
- Prior art keywords
- semi
- polishing machine
- conductor holder
- conductor
- holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP35944099 | 1999-12-17 | ||
JP35944099 | 1999-12-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60030829D1 true DE60030829D1 (de) | 2006-11-02 |
DE60030829T2 DE60030829T2 (de) | 2007-03-15 |
Family
ID=18464516
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60030829T Expired - Lifetime DE60030829T2 (de) | 1999-12-17 | 2000-12-15 | Schleifmaschine |
Country Status (5)
Country | Link |
---|---|
US (1) | US6435955B2 (de) |
EP (1) | EP1110668B1 (de) |
DE (1) | DE60030829T2 (de) |
MY (1) | MY120489A (de) |
TW (1) | TW477733B (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4465645B2 (ja) | 2003-06-03 | 2010-05-19 | 株式会社ニコン | 研磨装置、これを用いた半導体デバイス製造方法 |
JP4374370B2 (ja) * | 2006-10-27 | 2009-12-02 | 信越半導体株式会社 | 研磨ヘッド及び研磨装置 |
US20120002147A1 (en) * | 2009-03-23 | 2012-01-05 | Yoshikazu Umeno | Method for manufacturing liquid crystal display device and liquid crystal display device manufactured thereby |
CN103144027B (zh) * | 2013-04-02 | 2015-12-23 | 清华大学 | 用于抛光头的气缸 |
CN103192317B (zh) * | 2013-04-02 | 2015-11-18 | 天津华海清科机电科技有限公司 | 抛光头 |
CN103862335B (zh) * | 2014-03-18 | 2017-01-04 | 海门市森达装饰材料有限公司 | 超级镜面不锈钢装饰板制备方法 |
CN204366726U (zh) * | 2015-01-04 | 2015-06-03 | 京东方光科技有限公司 | 抛光夹具 |
JP7023455B2 (ja) * | 2017-01-23 | 2022-02-22 | 不二越機械工業株式会社 | ワーク研磨方法およびワーク研磨装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3173041B2 (ja) | 1991-05-15 | 2001-06-04 | 不二越機械工業株式会社 | ドレッサー付きウェハー研磨装置及びその研磨布表面のドレッシング方法 |
JP3218572B2 (ja) | 1992-07-01 | 2001-10-15 | 不二越機械工業株式会社 | ウェーハ加圧用ポリッシングプレート |
JP3158934B2 (ja) | 1995-02-28 | 2001-04-23 | 三菱マテリアル株式会社 | ウェーハ研磨装置 |
JP3697775B2 (ja) | 1996-03-19 | 2005-09-21 | ヤマハ株式会社 | 研磨装置 |
US6019670A (en) * | 1997-03-10 | 2000-02-01 | Applied Materials, Inc. | Method and apparatus for conditioning a polishing pad in a chemical mechanical polishing system |
US5857899A (en) * | 1997-04-04 | 1999-01-12 | Ontrak Systems, Inc. | Wafer polishing head with pad dressing element |
TW431942B (en) * | 1997-04-04 | 2001-05-01 | Tokyo Seimitsu Co Ltd | Polishing device |
JP3220937B2 (ja) | 1997-09-05 | 2001-10-22 | 株式会社東京精密 | ウェーハ研磨装置 |
JP3006568B2 (ja) | 1997-12-04 | 2000-02-07 | 日本電気株式会社 | ウエハ研磨装置および研磨方法 |
JP3959173B2 (ja) | 1998-03-27 | 2007-08-15 | 株式会社東芝 | 研磨装置及び研磨加工方法 |
KR100550034B1 (ko) * | 1998-04-06 | 2006-02-08 | 가부시키가이샤 에바라 세이사꾸쇼 | 폴리싱장치 |
US6231428B1 (en) * | 1999-03-03 | 2001-05-15 | Mitsubishi Materials Corporation | Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring |
-
2000
- 2000-12-12 TW TW089126417A patent/TW477733B/zh not_active IP Right Cessation
- 2000-12-14 US US09/737,006 patent/US6435955B2/en not_active Expired - Lifetime
- 2000-12-15 MY MYPI20005916A patent/MY120489A/en unknown
- 2000-12-15 DE DE60030829T patent/DE60030829T2/de not_active Expired - Lifetime
- 2000-12-15 EP EP00311251A patent/EP1110668B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1110668B1 (de) | 2006-09-20 |
MY120489A (en) | 2005-10-31 |
TW477733B (en) | 2002-03-01 |
EP1110668A2 (de) | 2001-06-27 |
US20010003883A1 (en) | 2001-06-21 |
EP1110668A3 (de) | 2003-10-22 |
DE60030829T2 (de) | 2007-03-15 |
US6435955B2 (en) | 2002-08-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |