DE60007642D1 - Spindelanordnung für poliervorrichtung - Google Patents
Spindelanordnung für poliervorrichtungInfo
- Publication number
- DE60007642D1 DE60007642D1 DE60007642T DE60007642T DE60007642D1 DE 60007642 D1 DE60007642 D1 DE 60007642D1 DE 60007642 T DE60007642 T DE 60007642T DE 60007642 T DE60007642 T DE 60007642T DE 60007642 D1 DE60007642 D1 DE 60007642D1
- Authority
- DE
- Germany
- Prior art keywords
- polishing device
- spindle arrangement
- spindle
- arrangement
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
- B24B41/044—Grinding spindles with magnetic or electromagnetic bearings; Features related thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
- G05B19/19—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by positioning or contouring control systems, e.g. to control position from one programmed point to another or to control movement along a programmed continuous path
- G05B19/39—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by positioning or contouring control systems, e.g. to control position from one programmed point to another or to control movement along a programmed continuous path using a combination of the means covered by at least two of the preceding sub-groups G05B19/21, G05B19/27, and G05B19/33
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/385,769 US6083082A (en) | 1999-08-30 | 1999-08-30 | Spindle assembly for force controlled polishing |
PCT/US2000/021843 WO2001015862A1 (en) | 1999-08-30 | 2000-08-11 | Spindle assembly for force controlled polishing |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60007642D1 true DE60007642D1 (de) | 2004-02-12 |
DE60007642T2 DE60007642T2 (de) | 2004-10-07 |
Family
ID=23522802
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60007642T Expired - Fee Related DE60007642T2 (de) | 1999-08-30 | 2000-08-11 | Spindelanordnung für poliervorrichtung |
Country Status (7)
Country | Link |
---|---|
US (1) | US6083082A (de) |
EP (1) | EP1207981B1 (de) |
JP (1) | JP4484413B2 (de) |
KR (1) | KR100717477B1 (de) |
DE (1) | DE60007642T2 (de) |
TW (1) | TW480207B (de) |
WO (1) | WO2001015862A1 (de) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6340326B1 (en) | 2000-01-28 | 2002-01-22 | Lam Research Corporation | System and method for controlled polishing and planarization of semiconductor wafers |
US6705930B2 (en) * | 2000-01-28 | 2004-03-16 | Lam Research Corporation | System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques |
US6646364B1 (en) * | 2000-07-11 | 2003-11-11 | Honeywell International Inc. | MEMS actuator with lower power consumption and lower cost simplified fabrication |
US6755723B1 (en) | 2000-09-29 | 2004-06-29 | Lam Research Corporation | Polishing head assembly |
US6812598B2 (en) * | 2002-02-19 | 2004-11-02 | Rockwell Scientific Licensing, Llc | Multiple magnet transducer with differential magnetic strengths |
US20030154923A1 (en) * | 2002-02-19 | 2003-08-21 | Innovative Technology Licensing, Llc | Mechanical translator with ultra low friction ferrofluid bearings |
US6812583B2 (en) | 2002-02-19 | 2004-11-02 | Rockwell Scientific Licensing, Llc | Electrical generator with ferrofluid bearings |
US6768230B2 (en) * | 2002-02-19 | 2004-07-27 | Rockwell Scientific Licensing, Llc | Multiple magnet transducer |
US7288860B2 (en) * | 2002-02-19 | 2007-10-30 | Teledyne Licensing, Inc. | Magnetic transducer with ferrofluid end bearings |
US6766679B1 (en) * | 2002-03-27 | 2004-07-27 | Lam Research Corporation | System and method for spindle drive downforce calibration |
US6798090B2 (en) * | 2002-04-18 | 2004-09-28 | Rockwell Scientific Licensing, Llc | Electrical power generation by coupled magnets |
US6935938B1 (en) | 2004-03-31 | 2005-08-30 | Lam Research Corporation | Multiple-conditioning member device for chemical mechanical planarization conditioning |
US7040955B1 (en) * | 2005-01-28 | 2006-05-09 | Strasbaugh | Chemical-mechanical planarization tool force calibration method and system |
JP2008246628A (ja) * | 2007-03-30 | 2008-10-16 | Disco Abrasive Syst Ltd | チャックテーブル機構 |
JP4327880B2 (ja) * | 2008-01-04 | 2009-09-09 | ファナック株式会社 | ゲイン自動調整機能を備えたサーボモータ制御装置 |
JP5306065B2 (ja) * | 2009-06-04 | 2013-10-02 | 株式会社荏原製作所 | ドレッシング装置およびドレッシング方法 |
US8408082B2 (en) * | 2009-11-18 | 2013-04-02 | General Electric Company | Apparatus to measure fluids in a conduit |
JP5895154B2 (ja) * | 2011-01-21 | 2016-03-30 | パナソニックIpマネジメント株式会社 | リニアアクチュエータの駆動方法 |
US8550876B2 (en) | 2011-08-08 | 2013-10-08 | Apple Inc. | Force-controlled surface finishing through the use of a passive magnetic constant-force device |
CN103586772B (zh) * | 2012-08-16 | 2016-01-06 | 鸿富锦精密工业(深圳)有限公司 | 压力检测装置 |
US9898000B2 (en) * | 2013-01-30 | 2018-02-20 | Akribis Systems Pte Ltd | Planar positioning system and method of using the same |
CN110315421B (zh) * | 2019-08-20 | 2023-12-26 | 江苏集萃精凯高端装备技术有限公司 | 一种晶体材料均一化抛光装置及使用方法 |
JP7431589B2 (ja) | 2020-01-17 | 2024-02-15 | 株式会社ディスコ | 加工装置 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3631634A (en) * | 1970-01-26 | 1972-01-04 | John L Weber | Polishing machine |
US3691694A (en) * | 1970-11-02 | 1972-09-19 | Ibm | Wafer polishing machine |
US3903653A (en) * | 1973-04-11 | 1975-09-09 | Harold J Imhoff | Lapping machine |
DE2451549A1 (de) * | 1974-10-30 | 1976-08-12 | Mueller Georg Kugellager | Belade- und entladevorrichtung fuer plattenfoermige halbleitermaterialien |
US4009539A (en) * | 1975-06-16 | 1977-03-01 | Spitfire Tool & Machine Co., Inc. | Lapping machine with vacuum workholder |
US4020600A (en) * | 1976-08-13 | 1977-05-03 | Spitfire Tool & Machine Co., Inc. | Polishing fixture |
US4141180A (en) * | 1977-09-21 | 1979-02-27 | Kayex Corporation | Polishing apparatus |
US4450652A (en) * | 1981-09-04 | 1984-05-29 | Monsanto Company | Temperature control for wafer polishing |
JPS59161262A (ja) * | 1983-03-04 | 1984-09-12 | Masanori Kunieda | 磁気吸引式研摩方法 |
US4593495A (en) * | 1983-11-25 | 1986-06-10 | Toshiba Machine Co., Ltd. | Polishing machine |
DE3479936D1 (en) * | 1983-12-12 | 1989-11-02 | Unisys Corp | Air bearing for moving webs |
GB8402194D0 (en) * | 1984-01-27 | 1984-02-29 | Secr Defence | Chemical polishing apparatus |
US4680893A (en) * | 1985-09-23 | 1987-07-21 | Motorola, Inc. | Apparatus for polishing semiconductor wafers |
DK155299B (da) * | 1986-04-18 | 1989-03-20 | Struers As | Apparat til slibning eller polering af emner |
CH684321A5 (de) * | 1988-04-07 | 1994-08-31 | Arthur Werner Staehli | Einrichtung an einer Zweischeibenläppmaschine. |
JPH01310859A (ja) * | 1988-06-09 | 1989-12-14 | Toyoda Mach Works Ltd | ポリシング加工機 |
US4934102A (en) * | 1988-10-04 | 1990-06-19 | International Business Machines Corporation | System for mechanical planarization |
JP2827540B2 (ja) * | 1991-03-11 | 1998-11-25 | 松下電器産業株式会社 | 研磨スピンドル |
FR2677292B1 (fr) * | 1991-06-04 | 1995-12-08 | Seva | Machine de polissage a regulation pneumatique de l'effort de l'outil de la piece a polir. |
FR2677291B1 (fr) * | 1991-06-06 | 1995-12-15 | Commissariat Energie Atomique | Machine de polissage a controle de pression. |
US5148632A (en) * | 1991-06-14 | 1992-09-22 | Corning Incorporated | Cavity forming in plastic body |
JP3227199B2 (ja) * | 1992-05-18 | 2001-11-12 | 株式会社リコー | 廃トナーの処理方法 |
US5658183A (en) * | 1993-08-25 | 1997-08-19 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing including optical monitoring |
US5456627A (en) * | 1993-12-20 | 1995-10-10 | Westech Systems, Inc. | Conditioner for a polishing pad and method therefor |
US5643044A (en) * | 1994-11-01 | 1997-07-01 | Lund; Douglas E. | Automatic chemical and mechanical polishing system for semiconductor wafers |
US5618447A (en) * | 1996-02-13 | 1997-04-08 | Micron Technology, Inc. | Polishing pad counter meter and method for real-time control of the polishing rate in chemical-mechanical polishing of semiconductor wafers |
JPH1071560A (ja) * | 1996-08-27 | 1998-03-17 | Speedfam Co Ltd | ウエハ加圧装置 |
-
1999
- 1999-08-30 US US09/385,769 patent/US6083082A/en not_active Expired - Lifetime
-
2000
- 2000-08-11 DE DE60007642T patent/DE60007642T2/de not_active Expired - Fee Related
- 2000-08-11 WO PCT/US2000/021843 patent/WO2001015862A1/en active IP Right Grant
- 2000-08-11 EP EP00955424A patent/EP1207981B1/de not_active Expired - Lifetime
- 2000-08-11 JP JP2001520259A patent/JP4484413B2/ja not_active Expired - Fee Related
- 2000-08-11 KR KR1020027002464A patent/KR100717477B1/ko not_active IP Right Cessation
- 2000-08-29 TW TW089117518A patent/TW480207B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1207981A1 (de) | 2002-05-29 |
US6083082A (en) | 2000-07-04 |
KR100717477B1 (ko) | 2007-05-14 |
TW480207B (en) | 2002-03-21 |
DE60007642T2 (de) | 2004-10-07 |
EP1207981B1 (de) | 2004-01-07 |
KR20020027583A (ko) | 2002-04-13 |
JP2003508237A (ja) | 2003-03-04 |
JP4484413B2 (ja) | 2010-06-16 |
WO2001015862A1 (en) | 2001-03-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |