DE69823113D1 - Halbleiterscheibenpoliermaschine - Google Patents

Halbleiterscheibenpoliermaschine

Info

Publication number
DE69823113D1
DE69823113D1 DE69823113T DE69823113T DE69823113D1 DE 69823113 D1 DE69823113 D1 DE 69823113D1 DE 69823113 T DE69823113 T DE 69823113T DE 69823113 T DE69823113 T DE 69823113T DE 69823113 D1 DE69823113 D1 DE 69823113D1
Authority
DE
Germany
Prior art keywords
polishing machine
wafer polishing
wafer
machine
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69823113T
Other languages
English (en)
Other versions
DE69823113T2 (de
Inventor
Minoru Numoto
Takao Inaba
Hisashi Terashita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Application granted granted Critical
Publication of DE69823113D1 publication Critical patent/DE69823113D1/de
Publication of DE69823113T2 publication Critical patent/DE69823113T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE69823113T 1997-08-11 1998-08-10 Halbleiterscheibenpoliermaschine Expired - Fee Related DE69823113T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP21669997 1997-08-11
JP21669997 1997-08-11

Publications (2)

Publication Number Publication Date
DE69823113D1 true DE69823113D1 (de) 2004-05-19
DE69823113T2 DE69823113T2 (de) 2004-08-26

Family

ID=16692544

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69823113T Expired - Fee Related DE69823113T2 (de) 1997-08-11 1998-08-10 Halbleiterscheibenpoliermaschine

Country Status (7)

Country Link
US (1) US6080049A (de)
EP (1) EP0896859B1 (de)
KR (1) KR100306717B1 (de)
DE (1) DE69823113T2 (de)
MY (1) MY120754A (de)
SG (1) SG65778A1 (de)
TW (1) TW434096B (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW434095B (en) * 1997-08-11 2001-05-16 Tokyo Seimitsu Co Ltd Wafer polishing apparatus
US6425809B1 (en) * 1999-02-15 2002-07-30 Ebara Corporation Polishing apparatus
US6281128B1 (en) * 1999-06-14 2001-08-28 Agere Systems Guardian Corp. Wafer carrier modification for reduced extraction force
US6910949B1 (en) * 2001-04-25 2005-06-28 Lam Research Corporation Spherical cap-shaped polishing head in a chemical mechanical polishing apparatus for semiconductor wafers
US6776693B2 (en) * 2001-12-19 2004-08-17 Applied Materials Inc. Method and apparatus for face-up substrate polishing
TWI492818B (zh) * 2011-07-12 2015-07-21 Iv Technologies Co Ltd 研磨墊、研磨方法以及研磨系統
KR102191916B1 (ko) * 2013-06-26 2020-12-16 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드
KR101480168B1 (ko) * 2014-01-29 2015-01-08 제타텍 주식회사 리테이너링을 갖는 화학기계적 연마장치
KR102050975B1 (ko) * 2017-12-27 2020-01-08 주식회사 케이씨텍 기판 지지 유닛 및 이를 포함하는 기판 연마 장치
US12017322B2 (en) * 2018-08-14 2024-06-25 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing method

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6022500B2 (ja) * 1980-05-23 1985-06-03 株式会社デイスコ 位置合せ載置方法
JPH0691058B2 (ja) * 1988-10-06 1994-11-14 信越半導体株式会社 半導体ウエーハ研磨方法
JPH0582631A (ja) * 1991-09-20 1993-04-02 Toshiba Ceramics Co Ltd 半導体ウエーハ用真空チヤツク
JPH07290355A (ja) * 1994-04-25 1995-11-07 Nippon Steel Corp 研磨装置
JP3257304B2 (ja) * 1994-11-24 2002-02-18 三菱マテリアル株式会社 研磨装置
JP2758152B2 (ja) * 1995-04-10 1998-05-28 松下電器産業株式会社 被研磨基板の保持装置及び基板の研磨方法
TW400567B (en) * 1995-04-10 2000-08-01 Matsushita Electric Ind Co Ltd The polishing device and its polishing method for the substrate
JP3287761B2 (ja) * 1995-06-19 2002-06-04 日本電信電話株式会社 真空吸着装置および加工装置
ATE228915T1 (de) * 1996-01-24 2002-12-15 Lam Res Corp Halbleiterscheiben-polierkopf
JP3663728B2 (ja) * 1996-03-28 2005-06-22 信越半導体株式会社 薄板の研磨機
TW431942B (en) * 1997-04-04 2001-05-01 Tokyo Seimitsu Co Ltd Polishing device
TW436369B (en) * 1997-07-11 2001-05-28 Tokyo Seimitsu Co Ltd Wafer polishing device

Also Published As

Publication number Publication date
DE69823113T2 (de) 2004-08-26
SG65778A1 (en) 1999-06-22
TW434096B (en) 2001-05-16
KR19990023511A (ko) 1999-03-25
US6080049A (en) 2000-06-27
EP0896859A2 (de) 1999-02-17
EP0896859A3 (de) 2002-08-28
EP0896859B1 (de) 2004-04-14
MY120754A (en) 2005-11-30
KR100306717B1 (ko) 2001-11-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee