DE69817601D1 - Halbleiterscheiben-läppmaschine - Google Patents

Halbleiterscheiben-läppmaschine

Info

Publication number
DE69817601D1
DE69817601D1 DE69817601T DE69817601T DE69817601D1 DE 69817601 D1 DE69817601 D1 DE 69817601D1 DE 69817601 T DE69817601 T DE 69817601T DE 69817601 T DE69817601 T DE 69817601T DE 69817601 D1 DE69817601 D1 DE 69817601D1
Authority
DE
Germany
Prior art keywords
lapping machine
semiconductor disk
disk lapping
semiconductor
machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69817601T
Other languages
English (en)
Other versions
DE69817601T2 (de
Inventor
Norio Kimura
Yu Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Application granted granted Critical
Publication of DE69817601D1 publication Critical patent/DE69817601D1/de
Publication of DE69817601T2 publication Critical patent/DE69817601T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
DE69817601T 1997-11-21 1998-11-20 Halbleiterscheiben-läppmaschine Expired - Fee Related DE69817601T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP33803397A JPH11156715A (ja) 1997-11-21 1997-11-21 ポリッシング装置
JP33803397 1997-11-21
PCT/JP1998/005244 WO1999026760A1 (en) 1997-11-21 1998-11-20 Wafer polishing machine

Publications (2)

Publication Number Publication Date
DE69817601D1 true DE69817601D1 (de) 2003-10-02
DE69817601T2 DE69817601T2 (de) 2004-06-24

Family

ID=18314308

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69817601T Expired - Fee Related DE69817601T2 (de) 1997-11-21 1998-11-20 Halbleiterscheiben-läppmaschine

Country Status (6)

Country Link
US (1) US6186872B1 (de)
EP (1) EP1032485B1 (de)
JP (1) JPH11156715A (de)
KR (1) KR100555933B1 (de)
DE (1) DE69817601T2 (de)
WO (1) WO1999026760A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6579407B1 (en) * 2000-06-30 2003-06-17 Lam Research Corporation Method and apparatus for aligning and setting the axis of rotation of spindles of a multi-body system
KR100681683B1 (ko) * 2001-03-16 2007-02-09 동부일렉트로닉스 주식회사 가공물의 표면 연마장치
WO2011106801A2 (en) * 2010-06-14 2011-09-01 Saint-Gobain Abrasives, Inc. Apparatuses methods for coolant delivery

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3128880A1 (de) * 1981-07-22 1983-02-10 Fa. Peter Wolters, 2370 Rendsburg Maschine zum laeppen oder polieren
US4450652A (en) 1981-09-04 1984-05-29 Monsanto Company Temperature control for wafer polishing
US5036625A (en) * 1988-12-07 1991-08-06 Anatoly Gosis Lapping plate for a lapping and polishing machine
AU637087B2 (en) * 1989-03-24 1993-05-20 Sumitomo Electric Industries, Ltd. Apparatus for grinding semiconductor wafer
JP3201833B2 (ja) 1992-07-27 2001-08-27 東芝機械株式会社 ポリッシング用加工定盤
US5607718A (en) * 1993-03-26 1997-03-04 Kabushiki Kaisha Toshiba Polishing method and polishing apparatus
JP3415886B2 (ja) 1993-07-13 2003-06-09 富士通テン株式会社 内燃機関の点火制御装置
JP3678468B2 (ja) * 1995-07-18 2005-08-03 株式会社荏原製作所 ポリッシング装置
JP3734878B2 (ja) * 1996-04-25 2006-01-11 不二越機械工業株式会社 ウェーハの研磨装置
US5873769A (en) * 1997-05-30 1999-02-23 Industrial Technology Research Institute Temperature compensated chemical mechanical polishing to achieve uniform removal rates

Also Published As

Publication number Publication date
US6186872B1 (en) 2001-02-13
DE69817601T2 (de) 2004-06-24
JPH11156715A (ja) 1999-06-15
KR100555933B1 (ko) 2006-03-03
EP1032485B1 (de) 2003-08-27
EP1032485A1 (de) 2000-09-06
WO1999026760A1 (en) 1999-06-03
KR20010015569A (ko) 2001-02-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee