DE3670178D1 - Apparat zum zusammenfuegen von halbleiterscheiben. - Google Patents

Apparat zum zusammenfuegen von halbleiterscheiben.

Info

Publication number
DE3670178D1
DE3670178D1 DE8686111213T DE3670178T DE3670178D1 DE 3670178 D1 DE3670178 D1 DE 3670178D1 DE 8686111213 T DE8686111213 T DE 8686111213T DE 3670178 T DE3670178 T DE 3670178T DE 3670178 D1 DE3670178 D1 DE 3670178D1
Authority
DE
Germany
Prior art keywords
assembling semiconductor
semiconductor disc
disc
assembling
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8686111213T
Other languages
English (en)
Inventor
Kiyoshi C O Patent D Yoshikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE3670178D1 publication Critical patent/DE3670178D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE8686111213T 1986-08-13 1986-08-13 Apparat zum zusammenfuegen von halbleiterscheiben. Expired - Lifetime DE3670178D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP19860111213 EP0256150B1 (de) 1986-08-13 1986-08-13 Apparat zum Zusammenfügen von Halbleiterscheiben

Publications (1)

Publication Number Publication Date
DE3670178D1 true DE3670178D1 (de) 1990-05-10

Family

ID=8195337

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8686111213T Expired - Lifetime DE3670178D1 (de) 1986-08-13 1986-08-13 Apparat zum zusammenfuegen von halbleiterscheiben.

Country Status (2)

Country Link
EP (1) EP0256150B1 (de)
DE (1) DE3670178D1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0744135B2 (ja) * 1989-08-28 1995-05-15 株式会社東芝 半導体基板の接着方法及び接着装置
JP2534196B2 (ja) * 1993-12-21 1996-09-11 株式会社エンヤシステム ウエ−ハ貼付方法
US6484585B1 (en) 1995-02-28 2002-11-26 Rosemount Inc. Pressure sensor for a pressure transmitter
JP3720515B2 (ja) 1997-03-13 2005-11-30 キヤノン株式会社 基板処理装置及びその方法並びに基板の製造方法
SG71182A1 (en) * 1997-12-26 2000-03-21 Canon Kk Substrate processing apparatus substrate support apparatus substrate processing method and substrate manufacturing method
US6561038B2 (en) 2000-01-06 2003-05-13 Rosemount Inc. Sensor with fluid isolation barrier
US6505516B1 (en) 2000-01-06 2003-01-14 Rosemount Inc. Capacitive pressure sensing with moving dielectric
US6520020B1 (en) 2000-01-06 2003-02-18 Rosemount Inc. Method and apparatus for a direct bonded isolated pressure sensor
EP1244900B1 (de) 2000-01-06 2005-01-05 Rosemount Inc. Kornwachstumsverfahren zur herstellung einer elektrischen verbindung für mikroelektromechanische systeme (mems)
US6508129B1 (en) 2000-01-06 2003-01-21 Rosemount Inc. Pressure sensor capsule with improved isolation
DE102012111246A1 (de) 2012-11-21 2014-05-22 Ev Group E. Thallner Gmbh Vorrichtung und Verfahren zum Bonden
CN109390220B (zh) 2013-05-29 2023-05-23 Ev 集团 E·索尔纳有限责任公司 用以接合衬底的装置及方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2608427C2 (de) * 1976-03-01 1984-07-19 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen Verfahren zum Aufkitten von Halbleiterscheiben
EP0129732A1 (de) * 1983-06-15 1985-01-02 The Perkin-Elmer Corporation Aufnahmezusammenbau zum Befördern von Halbleiterplättchen
EP0161740B1 (de) * 1984-05-09 1991-06-12 Kabushiki Kaisha Toshiba Verfahren zur Herstellung eines Halbleitersubstrates

Also Published As

Publication number Publication date
EP0256150A1 (de) 1988-02-24
EP0256150B1 (de) 1990-04-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)