DE3586944D1 - Vorrichtung zum abtrennen von halbleiterscheiben. - Google Patents
Vorrichtung zum abtrennen von halbleiterscheiben.Info
- Publication number
- DE3586944D1 DE3586944D1 DE8585116581T DE3586944T DE3586944D1 DE 3586944 D1 DE3586944 D1 DE 3586944D1 DE 8585116581 T DE8585116581 T DE 8585116581T DE 3586944 T DE3586944 T DE 3586944T DE 3586944 D1 DE3586944 D1 DE 3586944D1
- Authority
- DE
- Germany
- Prior art keywords
- separating semiconductor
- semiconductor discs
- discs
- separating
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/06—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials
- H01L21/14—Treatment of the complete device, e.g. by electroforming to form a barrier
- H01L21/145—Ageing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27B—SAWS FOR WOOD OR SIMILAR MATERIAL; COMPONENTS OR ACCESSORIES THEREFOR
- B27B31/00—Arrangements for conveying, loading, turning, adjusting, or discharging the log or timber, specially designed for saw mills or sawing machines
- B27B31/06—Adjusting equipment, e.g. using optical projection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/024—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with the stock carried by a movable support for feeding stock into engagement with the cutting blade, e.g. stock carried by a pivoted arm or a carriage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a plurality of cutting blades
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Forests & Forestry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Gerontology & Geriatric Medicine (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27412684 | 1984-12-27 | ||
JP10403085 | 1985-05-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3586944D1 true DE3586944D1 (de) | 1993-02-11 |
DE3586944T2 DE3586944T2 (de) | 1993-05-06 |
Family
ID=26444588
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8585116581T Expired - Lifetime DE3586944T2 (de) | 1984-12-27 | 1985-12-27 | Vorrichtung zum abtrennen von halbleiterscheiben. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4688540A (de) |
EP (1) | EP0186201B1 (de) |
KR (1) | KR900001232B1 (de) |
DE (1) | DE3586944T2 (de) |
Families Citing this family (60)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3735449A1 (de) * | 1987-10-20 | 1989-05-03 | Convac Gmbh | Fertigungssystem fuer halbleitersubstrate |
JPH01143211A (ja) * | 1987-11-27 | 1989-06-05 | Takatori Haitetsuku:Kk | ウエハーに対する保護テープの貼付け切り抜き方法および装置 |
JPH0612768B2 (ja) * | 1990-05-18 | 1994-02-16 | 信越半導体株式会社 | 内周刃スライサーによる単結晶インゴットの切断方法及び装置 |
JP2759165B2 (ja) * | 1992-04-28 | 1998-05-28 | カシオ計算機株式会社 | ウェハ載置用シート拡張方法およびその装置 |
US5398458A (en) * | 1992-11-19 | 1995-03-21 | Craftsman Marble, Granite & Tile Co. | Process of manufacturing stone tile mosaics and apparatus therefor |
AU1567895A (en) * | 1994-01-18 | 1995-08-01 | Dynatex International | Method and apparatus for scribing and/or breaking semiconductor wafers |
US5839337A (en) * | 1995-04-28 | 1998-11-24 | Neu; H. Karl | Semiconductor carrier strip trimming apparatus |
GB2300137B (en) * | 1995-04-28 | 1997-06-18 | Neu Dynamics Corp | Carrier strip trimming |
JP3223421B2 (ja) * | 1996-08-13 | 2001-10-29 | 株式会社東京精密 | ダイシング装置 |
US6006739A (en) * | 1996-11-12 | 1999-12-28 | Micron Technology, Inc. | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
US6493934B2 (en) | 1996-11-12 | 2002-12-17 | Salman Akram | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
US6250192B1 (en) | 1996-11-12 | 2001-06-26 | Micron Technology, Inc. | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
US6102023A (en) * | 1997-07-02 | 2000-08-15 | Disco Corporation | Precision cutting apparatus and cutting method using the same |
JP3203364B2 (ja) * | 1997-12-01 | 2001-08-27 | 株式会社東京精密 | アライメント方法及びその装置 |
US6357330B1 (en) * | 1999-01-07 | 2002-03-19 | Intel Corporation | Method and apparatus for cutting a wafer |
JP4509243B2 (ja) * | 1999-03-04 | 2010-07-21 | 株式会社ディスコ | 積層被加工物の切削方法 |
JP4447074B2 (ja) * | 1999-06-21 | 2010-04-07 | 株式会社ディスコ | 切削装置 |
JP4394210B2 (ja) * | 1999-09-08 | 2010-01-06 | 株式会社ディスコ | 切削方法 |
JP4347960B2 (ja) * | 1999-09-14 | 2009-10-21 | 株式会社ディスコ | ダイシング方法 |
JP2001196328A (ja) * | 2000-01-12 | 2001-07-19 | Disco Abrasive Syst Ltd | Csp基板の分割方法 |
DE10019054C1 (de) * | 2000-04-18 | 2001-12-13 | Kronotec Ag | Verfahren zum Zuschneiden von Paneelen oder dergleichen |
JP2002237472A (ja) * | 2001-02-07 | 2002-08-23 | Disco Abrasive Syst Ltd | 被加工物の切削方法 |
US7267037B2 (en) * | 2001-05-05 | 2007-09-11 | David Walter Smith | Bidirectional singulation saw and method |
US6826986B2 (en) * | 2001-05-05 | 2004-12-07 | Ah Beng Lim | Bi-directional singulation system and method |
US20020185121A1 (en) * | 2001-06-06 | 2002-12-12 | Farnworth Warren M. | Group encapsulated dicing chuck |
US20030056628A1 (en) * | 2001-09-27 | 2003-03-27 | Eli Razon | Coaxial spindle cutting saw |
JP2003124155A (ja) * | 2001-10-12 | 2003-04-25 | Disco Abrasive Syst Ltd | 切削装置 |
JP2003151920A (ja) * | 2001-11-09 | 2003-05-23 | Disco Abrasive Syst Ltd | 切削機における被加工物位置合わせ方法 |
JP2004146727A (ja) * | 2002-10-28 | 2004-05-20 | Tokyo Seimitsu Co Ltd | ウェーハの搬送方法 |
DE10253250B4 (de) * | 2002-11-15 | 2004-09-30 | Uni-Tek System Inc. | Automatisches Präzisionsausrichtungsverfahren für eine Halbleiterwaferschneidevorrichtung |
TWI249762B (en) * | 2003-12-03 | 2006-02-21 | Ind Tech Res Inst | Sheet cutting device |
JP4481667B2 (ja) * | 2004-02-02 | 2010-06-16 | 株式会社ディスコ | 切削方法 |
US7281535B2 (en) * | 2004-02-23 | 2007-10-16 | Towa Intercon Technology, Inc. | Saw singulation |
US7804043B2 (en) * | 2004-06-15 | 2010-09-28 | Laserfacturing Inc. | Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser |
TWI387053B (zh) * | 2004-08-23 | 2013-02-21 | Rokko Systems Pte Ltd | 用於積體電路切割裝置之夾盤的供給機構 |
SG120197A1 (en) * | 2004-08-23 | 2006-03-28 | Rokko Systems Pte Ltd | Supply mechanism for the chuck of an integrated circuit dicing device |
US7731798B2 (en) * | 2004-12-01 | 2010-06-08 | Ultratech, Inc. | Heated chuck for laser thermal processing |
JP2007206783A (ja) * | 2006-01-31 | 2007-08-16 | Disco Abrasive Syst Ltd | メモリーカード成型装置及びメモリーカードの成型方法 |
WO2008142670A2 (en) * | 2007-05-22 | 2008-11-27 | Assaf Malul | Repetitive stroke work system |
SG142402A1 (en) * | 2008-05-02 | 2009-11-26 | Rokko Ventures Pte Ltd | Apparatus and method for multiple substrate processing |
CN105459189B (zh) * | 2008-12-08 | 2018-05-08 | 血管科学有限公司 | 沿备料的长度形成多个切口以形成产品的系统和方法 |
US10363389B2 (en) | 2009-04-03 | 2019-07-30 | Scientia Vascular, Llc | Micro-fabricated guidewire devices having varying diameters |
US11406791B2 (en) | 2009-04-03 | 2022-08-09 | Scientia Vascular, Inc. | Micro-fabricated guidewire devices having varying diameters |
US9616195B2 (en) | 2009-04-03 | 2017-04-11 | Scientia Vascular, Llc | Micro-fabricated catheter devices having varying diameters |
US9950137B2 (en) | 2009-04-03 | 2018-04-24 | Scientia Vascular, Llc | Micro-fabricated guidewire devices formed with hybrid materials |
CN102729339B (zh) * | 2011-04-01 | 2014-11-26 | 涂政德 | 滚切机及滚切方法 |
US20130217310A1 (en) * | 2012-02-21 | 2013-08-22 | Chih-hao Chen | Wafer Processing Equipment |
JP5115671B1 (ja) * | 2012-05-30 | 2013-01-09 | 富士ゼロックス株式会社 | ウエハ切断装置、半導体素子の製造方法 |
US9508570B2 (en) * | 2013-10-21 | 2016-11-29 | Asm Technology Singapore Pte Ltd | Singulation apparatus and method |
CN104647615A (zh) * | 2013-11-15 | 2015-05-27 | 台湾暹劲股份有限公司 | 晶圆切割装置及其切割方法 |
PT3164250T (pt) * | 2014-07-02 | 2018-12-18 | Panotec Srl | Dispositivo de corte para cortar materiais em tela relativamente rígidos, tais como papel, cartão, plástico ou materiais compósitos |
US11052228B2 (en) | 2016-07-18 | 2021-07-06 | Scientia Vascular, Llc | Guidewire devices having shapeable tips and bypass cuts |
US11207502B2 (en) | 2016-07-18 | 2021-12-28 | Scientia Vascular, Llc | Guidewire devices having shapeable tips and bypass cuts |
US10821268B2 (en) | 2016-09-14 | 2020-11-03 | Scientia Vascular, Llc | Integrated coil vascular devices |
US11452541B2 (en) | 2016-12-22 | 2022-09-27 | Scientia Vascular, Inc. | Intravascular device having a selectively deflectable tip |
EP3842091B1 (de) | 2017-05-26 | 2023-09-13 | Scientia Vascular, Inc. | Mikrohergestellte medizinische vorrichtung mit einer nicht-schraubenförmigen schneidanordnung |
JP7028607B2 (ja) * | 2017-11-06 | 2022-03-02 | 株式会社ディスコ | 切削装置 |
US11305095B2 (en) | 2018-02-22 | 2022-04-19 | Scientia Vascular, Llc | Microfabricated catheter having an intermediate preferred bending section |
US10703016B2 (en) | 2018-06-20 | 2020-07-07 | Texas Instruments Incorporated | Semiconductor sawing method and system |
US12011555B2 (en) | 2019-01-15 | 2024-06-18 | Scientia Vascular, Inc. | Guidewire with core centering mechanism |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2187299A (en) * | 1935-08-13 | 1940-01-16 | Burkhardt Otto Wilhelm | Dressing of individual blocks of stone |
FR1240358A (fr) * | 1959-04-10 | 1960-09-02 | Intermetall | Procédé de découpage de matériaux semi-conducteurs et éléments conformes à ceux obtenus |
US3289662A (en) * | 1964-02-04 | 1966-12-06 | Swenson Granite Co Inc John | Dual head sawing machine |
US4328553A (en) * | 1976-12-07 | 1982-05-04 | Computervision Corporation | Method and apparatus for targetless wafer alignment |
CH635769A5 (fr) * | 1980-03-10 | 1983-04-29 | Far Fab Assortiments Reunies | Installation pour le sciage de plaques et dispositif de manutention pour une telle installation. |
-
1985
- 1985-12-27 KR KR1019850009875A patent/KR900001232B1/ko not_active IP Right Cessation
- 1985-12-27 EP EP85116581A patent/EP0186201B1/de not_active Expired - Lifetime
- 1985-12-27 DE DE8585116581T patent/DE3586944T2/de not_active Expired - Lifetime
- 1985-12-27 US US06/813,801 patent/US4688540A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0186201B1 (de) | 1992-12-30 |
KR860005430A (ko) | 1986-07-23 |
KR900001232B1 (ko) | 1990-03-05 |
US4688540A (en) | 1987-08-25 |
EP0186201A2 (de) | 1986-07-02 |
DE3586944T2 (de) | 1993-05-06 |
EP0186201A3 (en) | 1989-04-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |