KR960025432U - 웨이퍼 홀딩장치 - Google Patents

웨이퍼 홀딩장치

Info

Publication number
KR960025432U
KR960025432U KR2019940037361U KR19940037361U KR960025432U KR 960025432 U KR960025432 U KR 960025432U KR 2019940037361 U KR2019940037361 U KR 2019940037361U KR 19940037361 U KR19940037361 U KR 19940037361U KR 960025432 U KR960025432 U KR 960025432U
Authority
KR
South Korea
Prior art keywords
holding device
wafer holding
wafer
holding
Prior art date
Application number
KR2019940037361U
Other languages
English (en)
Other versions
KR0118691Y1 (ko
Inventor
정창렬
유형성
김용술
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR2019940037361U priority Critical patent/KR0118691Y1/ko
Publication of KR960025432U publication Critical patent/KR960025432U/ko
Application granted granted Critical
Publication of KR0118691Y1 publication Critical patent/KR0118691Y1/ko

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR2019940037361U 1994-12-29 1994-12-29 웨이퍼 홀딩장치 KR0118691Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940037361U KR0118691Y1 (ko) 1994-12-29 1994-12-29 웨이퍼 홀딩장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019940037361U KR0118691Y1 (ko) 1994-12-29 1994-12-29 웨이퍼 홀딩장치

Publications (2)

Publication Number Publication Date
KR960025432U true KR960025432U (ko) 1996-07-22
KR0118691Y1 KR0118691Y1 (ko) 1998-08-01

Family

ID=19403912

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019940037361U KR0118691Y1 (ko) 1994-12-29 1994-12-29 웨이퍼 홀딩장치

Country Status (1)

Country Link
KR (1) KR0118691Y1 (ko)

Also Published As

Publication number Publication date
KR0118691Y1 (ko) 1998-08-01

Similar Documents

Publication Publication Date Title
DE69806578D1 (de) Waferhaltevorrichtung
DE69601394D1 (de) Haltevorrichtung
DE69637769D1 (de) Halbleitervorrichtung
DE69727373D1 (de) Halbleitervorrichtung
DE69637698D1 (de) Halbleitervorrichtung
DE59508581D1 (de) Halbleiterbauelement
DE69637809D1 (de) Halbleiteranordnung
DE69504227D1 (de) Haltevorrichtung
DE69522789D1 (de) Halbleitervorrichtung
DE69501381D1 (de) Halbleitergerät
DE69513207D1 (de) Halbleitervorrichtung
DE69607985D1 (de) Haltevorrichtung
DE69500707D1 (de) Haltevorrichtung
DE69728850D1 (de) Halbleiteranordnung
DE69702921D1 (de) Haltevorrichtung
KR960019102U (ko) 웨이퍼 세척장치
KR960012414A (ko) 웨이퍼 검사장치
KR960009084A (ko) 반도체장치
KR950029031U (ko) 반도체 디바이스 언릴장치
KR960009225A (ko) 반도체장치
KR960025432U (ko) 웨이퍼 홀딩장치
KR960006354U (ko) 웨이퍼 고정 장치
DK87795A (da) Holdeindretning
DE69713658D1 (de) Halbleiterbauelement
KR960025424U (ko) 웨이퍼 클램핑장치

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20090223

Year of fee payment: 12

EXPY Expiration of term