KR950029031U - 반도체 디바이스 언릴장치 - Google Patents
반도체 디바이스 언릴장치Info
- Publication number
- KR950029031U KR950029031U KR2019940005855U KR19940005855U KR950029031U KR 950029031 U KR950029031 U KR 950029031U KR 2019940005855 U KR2019940005855 U KR 2019940005855U KR 19940005855 U KR19940005855 U KR 19940005855U KR 950029031 U KR950029031 U KR 950029031U
- Authority
- KR
- South Korea
- Prior art keywords
- unwinding
- semiconductor device
- semiconductor
- unwinding device
- device unwinding
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
- H05K13/0419—Feeding with belts or tapes tape feeders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
- B65H37/002—Web delivery apparatus, the web serving as support for articles, material or another web
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/021—Loading or unloading of containers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Packaging Frangible Articles (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019940005855U KR0121152Y1 (ko) | 1994-03-23 | 1994-03-23 | 반도체 디바이스 언릴장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019940005855U KR0121152Y1 (ko) | 1994-03-23 | 1994-03-23 | 반도체 디바이스 언릴장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950029031U true KR950029031U (ko) | 1995-10-20 |
KR0121152Y1 KR0121152Y1 (ko) | 1998-10-01 |
Family
ID=19379457
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019940005855U KR0121152Y1 (ko) | 1994-03-23 | 1994-03-23 | 반도체 디바이스 언릴장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR0121152Y1 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI498059B (zh) * | 2011-09-19 | 2015-08-21 | Young Koan Woo | 將附加板黏蓋至軟性電路板之裝置及用於該裝置之附加板分離單元與按壓單元 |
KR101257603B1 (ko) * | 2011-09-19 | 2013-04-26 | 우영관 | Fpc에 부재플레이트를 부착하기 위한 부재플레이트 부착장치 및 이에 이용되는 부재플레이트 분리 유닛 |
KR101257621B1 (ko) * | 2011-09-19 | 2013-04-29 | 우영관 | Fpc에 부재플레이트를 부착하기 위한 부재플레이트 부착장치 및 부착방법 |
-
1994
- 1994-03-23 KR KR2019940005855U patent/KR0121152Y1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR0121152Y1 (ko) | 1998-10-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69433951D1 (de) | Verbundenes Halbleiterbauelement | |
DE69610457D1 (de) | Halbleitervorrichtung | |
KR970004020A (ko) | 반도체장치 | |
KR970005998A (ko) | 반도체 장치 | |
DE69637769D1 (de) | Halbleitervorrichtung | |
DE69738008D1 (de) | Halbleiterbauelement | |
DE69739242D1 (de) | Halbleitervorrichtung | |
DE69510834D1 (de) | Halbleiterspeicheranordnung | |
DE69727373D1 (de) | Halbleitervorrichtung | |
DE69422901D1 (de) | Halbleiterspeicheranordnung | |
DE69637698D1 (de) | Halbleitervorrichtung | |
DE59508581D1 (de) | Halbleiterbauelement | |
DE69631940D1 (de) | Halbleitervorrichtung | |
DE69512700D1 (de) | Halbleiterspeicheranordnung | |
DE59607521D1 (de) | Halbleiter-Bauelement-Konfiguration | |
DE69637809D1 (de) | Halbleiteranordnung | |
DE69522789D1 (de) | Halbleitervorrichtung | |
DE69501381D1 (de) | Halbleitergerät | |
DE69513207D1 (de) | Halbleitervorrichtung | |
DE19681689T1 (de) | Gesichertes Halbleiterbauelement | |
DE69531121D1 (de) | Integrierte Halbleiteranordnung | |
DE69521066D1 (de) | Halbleiterspeicheranordnung | |
DE69728850D1 (de) | Halbleiteranordnung | |
KR960009084A (ko) | 반도체장치 | |
KR950029031U (ko) | 반도체 디바이스 언릴장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20040326 Year of fee payment: 7 |
|
LAPS | Lapse due to unpaid annual fee |