DE10196317T1 - Orbitalpoliervorrichtung - Google Patents

Orbitalpoliervorrichtung

Info

Publication number
DE10196317T1
DE10196317T1 DE10196317T DE10196317T DE10196317T1 DE 10196317 T1 DE10196317 T1 DE 10196317T1 DE 10196317 T DE10196317 T DE 10196317T DE 10196317 T DE10196317 T DE 10196317T DE 10196317 T1 DE10196317 T1 DE 10196317T1
Authority
DE
Germany
Prior art keywords
orbital polisher
polisher
orbital
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE10196317T
Other languages
English (en)
Inventor
Stephen C Schultz
John D Herb
Nikolay Korovin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Speedfam IPEC Corp
Original Assignee
Speedfam IPEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam IPEC Corp filed Critical Speedfam IPEC Corp
Publication of DE10196317T1 publication Critical patent/DE10196317T1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE10196317T 2000-06-08 2001-06-06 Orbitalpoliervorrichtung Withdrawn DE10196317T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US59031900A 2000-06-08 2000-06-08
PCT/US2001/018351 WO2001094075A1 (en) 2000-06-08 2001-06-06 Orbital polishing apparatus

Publications (1)

Publication Number Publication Date
DE10196317T1 true DE10196317T1 (de) 2003-11-13

Family

ID=24361775

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10196317T Withdrawn DE10196317T1 (de) 2000-06-08 2001-06-06 Orbitalpoliervorrichtung

Country Status (7)

Country Link
US (1) US20030077986A1 (de)
JP (1) JP2004505435A (de)
KR (1) KR20030007928A (de)
AU (1) AU2001266742A1 (de)
DE (1) DE10196317T1 (de)
GB (1) GB2379626A (de)
WO (1) WO2001094075A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5964653A (en) * 1997-07-11 1999-10-12 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US20100173567A1 (en) * 2006-02-06 2010-07-08 Chien-Min Sung Methods and Devices for Enhancing Chemical Mechanical Polishing Processes
TW201029807A (en) * 2009-02-06 2010-08-16 Inotera Memories Inc A pressure control system for a wafer polish machine
DE102009030294B4 (de) * 2009-06-24 2013-04-25 Siltronic Ag Verfahren zur Politur der Kante einer Halbleiterscheibe
TWI530360B (zh) * 2012-09-28 2016-04-21 荏原製作所股份有限公司 研磨裝置
KR102540042B1 (ko) 2021-06-30 2023-06-05 (주)피엔피 Oled 디스플레이 패널용 인캡 글라스의 전면카메라 전방 영역 폴리싱장치
CN115383622B (zh) * 2022-04-20 2024-08-27 北京晶亦精微科技股份有限公司 抛光头用分体式万向节及抛光装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5554064A (en) * 1993-08-06 1996-09-10 Intel Corporation Orbital motion chemical-mechanical polishing apparatus and method of fabrication
US5635083A (en) * 1993-08-06 1997-06-03 Intel Corporation Method and apparatus for chemical-mechanical polishing using pneumatic pressure applied to the backside of a substrate
JP3311116B2 (ja) * 1993-10-28 2002-08-05 株式会社東芝 半導体製造装置
US5582534A (en) * 1993-12-27 1996-12-10 Applied Materials, Inc. Orbital chemical mechanical polishing apparatus and method
US5423716A (en) * 1994-01-05 1995-06-13 Strasbaugh; Alan Wafer-handling apparatus having a resilient membrane which holds wafer when a vacuum is applied
US5449316A (en) * 1994-01-05 1995-09-12 Strasbaugh; Alan Wafer carrier for film planarization
JPH07241764A (ja) * 1994-03-04 1995-09-19 Fujitsu Ltd 研磨装置と研磨方法
US5908530A (en) * 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
US6024630A (en) * 1995-06-09 2000-02-15 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head
JP3734878B2 (ja) * 1996-04-25 2006-01-11 不二越機械工業株式会社 ウェーハの研磨装置
JPH11156704A (ja) * 1997-11-21 1999-06-15 Ebara Corp 基板の研磨装置
US5941758A (en) * 1996-11-13 1999-08-24 Intel Corporation Method and apparatus for chemical-mechanical polishing
DE19651761A1 (de) * 1996-12-12 1998-06-18 Wacker Siltronic Halbleitermat Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben
US5851140A (en) * 1997-02-13 1998-12-22 Integrated Process Equipment Corp. Semiconductor wafer polishing apparatus with a flexible carrier plate
US5882243A (en) * 1997-04-24 1999-03-16 Motorola, Inc. Method for polishing a semiconductor wafer using dynamic control
JP3027551B2 (ja) * 1997-07-03 2000-04-04 キヤノン株式会社 基板保持装置ならびに該基板保持装置を用いた研磨方法および研磨装置
JPH11226865A (ja) * 1997-12-11 1999-08-24 Speedfam Co Ltd キャリア及びｃｍｐ装置
JP2907209B1 (ja) * 1998-05-29 1999-06-21 日本電気株式会社 ウェハ研磨装置用裏面パッド
US6093089A (en) * 1999-01-25 2000-07-25 United Microelectronics Corp. Apparatus for controlling uniformity of polished material
US6050882A (en) * 1999-06-10 2000-04-18 Applied Materials, Inc. Carrier head to apply pressure to and retain a substrate

Also Published As

Publication number Publication date
AU2001266742A1 (en) 2001-12-17
JP2004505435A (ja) 2004-02-19
GB0227538D0 (en) 2002-12-31
US20030077986A1 (en) 2003-04-24
WO2001094075A1 (en) 2001-12-13
KR20030007928A (ko) 2003-01-23
GB2379626A (en) 2003-03-19

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Legal Events

Date Code Title Description
8139 Disposal/non-payment of the annual fee