DE60221163D1 - Poliermaschine - Google Patents

Poliermaschine

Info

Publication number
DE60221163D1
DE60221163D1 DE60221163T DE60221163T DE60221163D1 DE 60221163 D1 DE60221163 D1 DE 60221163D1 DE 60221163 T DE60221163 T DE 60221163T DE 60221163 T DE60221163 T DE 60221163T DE 60221163 D1 DE60221163 D1 DE 60221163D1
Authority
DE
Germany
Prior art keywords
polisher
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60221163T
Other languages
English (en)
Other versions
DE60221163T2 (de
Inventor
Hitoshi Suwabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of DE60221163D1 publication Critical patent/DE60221163D1/de
Application granted granted Critical
Publication of DE60221163T2 publication Critical patent/DE60221163T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
DE60221163T 2001-05-02 2002-05-01 Poliermaschine Expired - Lifetime DE60221163T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001135348 2001-05-02
JP2001135348 2001-05-02

Publications (2)

Publication Number Publication Date
DE60221163D1 true DE60221163D1 (de) 2007-08-23
DE60221163T2 DE60221163T2 (de) 2008-04-24

Family

ID=18982827

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60221163T Expired - Lifetime DE60221163T2 (de) 2001-05-02 2002-05-01 Poliermaschine

Country Status (6)

Country Link
US (1) US6916234B2 (de)
EP (2) EP1254743A3 (de)
KR (1) KR100844779B1 (de)
DE (1) DE60221163T2 (de)
MY (1) MY127566A (de)
TW (1) TWI261009B (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM255104U (en) * 2003-02-05 2005-01-11 Applied Materials Inc Retaining ring with flange for chemical mechanical polishing
JP4269259B2 (ja) * 2003-05-30 2009-05-27 株式会社ニコン 加工装置、この加工装置を用いた半導体デバイスの製造方法
JP2005034959A (ja) * 2003-07-16 2005-02-10 Ebara Corp 研磨装置及びリテーナリング
EP1694464B1 (de) 2003-11-13 2010-05-26 Applied Materials, Inc. Haltering mit geformter fläche
US11260500B2 (en) 2003-11-13 2022-03-01 Applied Materials, Inc. Retaining ring with shaped surface
EP2043561B1 (de) 2006-06-30 2016-01-27 Smith & Nephew, Inc. Scharnierprothese mit anatomischer bewegung
JP6073222B2 (ja) * 2010-08-06 2017-02-01 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 保定リングを用いた基板縁部調整
KR101201571B1 (ko) 2011-02-15 2012-11-14 주식회사 엘지실트론 웨이퍼 연마장치
US8998677B2 (en) * 2012-10-29 2015-04-07 Wayne O. Duescher Bellows driven floatation-type abrading workholder
US9011207B2 (en) * 2012-10-29 2015-04-21 Wayne O. Duescher Flexible diaphragm combination floating and rigid abrading workholder
US9039488B2 (en) * 2012-10-29 2015-05-26 Wayne O. Duescher Pin driven flexible chamber abrading workholder
US8998678B2 (en) * 2012-10-29 2015-04-07 Wayne O. Duescher Spider arm driven flexible chamber abrading workholder
US8845394B2 (en) * 2012-10-29 2014-09-30 Wayne O. Duescher Bellows driven air floatation abrading workholder
JP5821883B2 (ja) * 2013-03-22 2015-11-24 信越半導体株式会社 テンプレートアセンブリ及びテンプレートアセンブリの製造方法
CN105453234B (zh) * 2013-08-10 2018-11-02 应用材料公司 抛光新的或翻新的静电夹盘的方法
JP7074606B2 (ja) * 2018-08-02 2022-05-24 株式会社荏原製作所 基板を保持するためのトップリングおよび基板処理装置
JP7178259B2 (ja) * 2018-12-27 2022-11-25 株式会社荏原製作所 研磨装置および研磨方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55157473A (en) * 1979-05-22 1980-12-08 Nippon Telegr & Teleph Corp <Ntt> Polishing method
JP3173041B2 (ja) 1991-05-15 2001-06-04 不二越機械工業株式会社 ドレッサー付きウェハー研磨装置及びその研磨布表面のドレッシング方法
JP3158934B2 (ja) * 1995-02-28 2001-04-23 三菱マテリアル株式会社 ウェーハ研磨装置
US6146259A (en) * 1996-11-08 2000-11-14 Applied Materials, Inc. Carrier head with local pressure control for a chemical mechanical polishing apparatus
JP3807807B2 (ja) * 1997-02-27 2006-08-09 株式会社荏原製作所 ポリッシング装置
US5857899A (en) * 1997-04-04 1999-01-12 Ontrak Systems, Inc. Wafer polishing head with pad dressing element
JP3006568B2 (ja) * 1997-12-04 2000-02-07 日本電気株式会社 ウエハ研磨装置および研磨方法
US6080050A (en) * 1997-12-31 2000-06-27 Applied Materials, Inc. Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus
US6196904B1 (en) * 1998-03-25 2001-03-06 Ebara Corporation Polishing apparatus
JP3959173B2 (ja) * 1998-03-27 2007-08-15 株式会社東芝 研磨装置及び研磨加工方法
KR100550034B1 (ko) * 1998-04-06 2006-02-08 가부시키가이샤 에바라 세이사꾸쇼 폴리싱장치
US6132298A (en) * 1998-11-25 2000-10-17 Applied Materials, Inc. Carrier head with edge control for chemical mechanical polishing
JP2000127024A (ja) 1998-10-27 2000-05-09 Toshiba Corp ポリッシング装置及び研磨加工方法
US6113468A (en) * 1999-04-06 2000-09-05 Speedfam-Ipec Corporation Wafer planarization carrier having floating pad load ring
JP2000299301A (ja) 1999-04-12 2000-10-24 Takusei Kikai:Kk 半導体研磨装置
SG90746A1 (en) * 1999-10-15 2002-08-20 Ebara Corp Apparatus and method for polishing workpiece
JP3753577B2 (ja) * 1999-11-16 2006-03-08 株式会社荏原製作所 基板保持装置及び該基板保持装置を備えたポリッシング装置
JP3354137B2 (ja) 1999-12-17 2002-12-09 不二越機械工業株式会社 ウェーハの研磨装置

Also Published As

Publication number Publication date
KR20020084818A (ko) 2002-11-11
US6916234B2 (en) 2005-07-12
MY127566A (en) 2006-12-29
DE60221163T2 (de) 2008-04-24
EP1611996B1 (de) 2007-07-11
EP1254743A2 (de) 2002-11-06
EP1254743A3 (de) 2004-01-21
KR100844779B1 (ko) 2008-07-07
US20020173256A1 (en) 2002-11-21
TWI261009B (en) 2006-09-01
EP1611996A1 (de) 2006-01-04

Similar Documents

Publication Publication Date Title
DE60237485D1 (de) Poliervorrichtung
DE60125859D1 (de) Poliervorrichtung
DE50204184D1 (de) Espressobrüheinrichtung
ATE524462T1 (de) C5-modifizierte indazolylpyrrolotriazine
DE50103741D1 (de) Welle-Nabe-Verbindung
ATE335486T1 (de) Hydrazono-malonitrile
DE1319930T1 (de) Coriolismassendurchflussmesser
DE60302398D1 (de) Poliervorrichtung
DE60221163D1 (de) Poliermaschine
DE60122236D1 (de) Poliervorrichtung
DE50203412D1 (de) Schwenkkolbenverdränger
DE50203984D1 (de) Kugelgelenk
DE60130379D1 (de) Kugelgelenk
ATE355059T1 (de) Isoxazolopyridinone
DE50201862D1 (de) Messwandler
DE50203093D1 (de) Losradlager
ATE319694T1 (de) Phenylalkyne
ATA18372001A (de) Gelenksbolzenbaueinheit
DE60228031D1 (de) Tonerrecyclisierungsentwickungsverfahren
DE50202088D1 (de) Garmodulsystem
ES1051991Y (es) Cepillo
DE10295006D2 (de) Bauwerksabdichtung
DE50108381D1 (de) Synchronisierschaltungsanordnung
ATA13992002A (de) Schlackengranulierungsanlage
AT500276B1 (de) Radschwenksystem

Legal Events

Date Code Title Description
8364 No opposition during term of opposition