JP7178259B2 - 研磨装置および研磨方法 - Google Patents
研磨装置および研磨方法 Download PDFInfo
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- JP7178259B2 JP7178259B2 JP2018244440A JP2018244440A JP7178259B2 JP 7178259 B2 JP7178259 B2 JP 7178259B2 JP 2018244440 A JP2018244440 A JP 2018244440A JP 2018244440 A JP2018244440 A JP 2018244440A JP 7178259 B2 JP7178259 B2 JP 7178259B2
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- 238000000034 method Methods 0.000 title claims description 8
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
一態様では、研磨面を有する研磨パッドを支持するための研磨テーブルと、基板を前記研磨面に押し付けるための押圧面を有する回転可能なヘッド本体と、前記押圧面を囲むように配置され、かつ前記ヘッド本体と共に回転しながら前記研磨面を押し付けるためのリテーナリングと、前記リテーナリングに固定され、前記リテーナリングと共に回転可能な回転リングと、前記回転リング上に配置された静止リングと、前記静止リングに局所荷重を加える複数の局所荷重付与装置とを備え、前記複数の局所荷重付与装置は、前記静止リングに連結された第1押圧部材および第2押圧部材と、前記第1押圧部材および前記第2押圧部材にそれぞれ連結された第1アクチュエータおよび第2アクチュエータを備え、前記第1押圧部材は、前記研磨面の進行方向において前記リテーナリングの上流側に配置され、前記第2押圧部材は、前記研磨面の前記進行方向において前記リテーナリングの下流側に配置されており、前記第1押圧部材および前記第2押圧部材は、前記リテーナリングの中心と前記研磨テーブルの中心とを通る基準直線と垂直に交わりかつ前記リテーナリングの中心を通る直線上に配置されている、研磨装置が提供される。
2 研磨パッド
2a 研磨面
3 研磨テーブル
5 研磨液供給ノズル
10 研磨ヘッド
11 ヘッド本体
12 研磨ヘッドシャフト
15 旋回軸
16 ヘッドアーム
20 リテーナリング
20a リング部材
20b ドライブリング
30A,30B 局所荷重付与装置
31A,31B 押圧部材
32a,32b 押圧ロッド
33A,33B ブリッジ
35A,35B エアシリンダ
36a,36b ピストンロッド
37A,37B アクチュエータ
38A,38B リニアガイド
39A,39B ガイドロッド
40A,40B ユニットベース
42 制御部
42a 記憶装置
42b 演算装置
43 キャリア
45 弾性膜(メンブレン)
46 圧力室
47 球面軸受
48 内輪
49 外輪
51 回転リング
52 ローラー
54 ローラーシャフト
55 ローラーハウジング
55a 環状凹部
57 軸受
58 ねじ
59 ホイール
60 リテーナリング押圧機構
61 ピストン
62 ローリングダイヤフラム
63 圧力室
75 連結部材
76 軸部
78 スポーク
80 駆動カラー
91 静止リング
92 円環レール
94 レールベース
95 環状溝
100A 外側シール
100B 内側シール
101 第1の周壁
102 第2の周壁
Claims (2)
- 研磨面を有する研磨パッドを支持するための研磨テーブルと、
基板を前記研磨面に押し付けるための押圧面を有する回転可能なヘッド本体と、
前記押圧面を囲むように配置され、かつ前記ヘッド本体と共に回転しながら前記研磨面を押し付けるためのリテーナリングと、
前記リテーナリングに固定され、前記リテーナリングと共に回転可能な回転リングと、
前記回転リング上に配置された静止リングと、
前記静止リングに局所荷重を加える複数の局所荷重付与装置とを備え、
前記複数の局所荷重付与装置は、前記静止リングに連結された第1押圧部材および第2押圧部材と、前記第1押圧部材および前記第2押圧部材にそれぞれ連結された第1アクチュエータおよび第2アクチュエータを備え、
前記第1押圧部材は、前記研磨面の進行方向において前記リテーナリングの上流側に配置され、前記第2押圧部材は、前記研磨面の前記進行方向において前記リテーナリングの下流側に配置されており、
前記第1押圧部材および前記第2押圧部材は、前記リテーナリングの中心と前記研磨テーブルの中心とを通る基準直線と垂直に交わりかつ前記リテーナリングの中心を通る直線上に配置されている、研磨装置。 - 研磨パッドを支持する研磨テーブルを回転させ、
押圧面を有するヘッド本体を回転させながら、前記押圧面で基板を前記研磨パッドの研磨面に押し付け、
前記基板を囲むように配置されたリテーナリングを、前記ヘッド本体および前記基板と共に回転させながら前記研磨面に押し付け、
前記リテーナリングに固定された回転リングを前記リテーナリングと共に回転させながら、かつ第1押圧部材または第2押圧部材から前記回転リング上に配置された静止リングに局所荷重を加えながら前記基板を研磨する工程を含み、
前記第1押圧部材は、前記研磨面の進行方向において前記リテーナリングの上流側に配置され、前記第2押圧部材は、前記研磨面の前記進行方向において前記リテーナリングの下流側に配置されており、
前記第1押圧部材および前記第2押圧部材は、前記リテーナリングの中心と前記研磨テーブルの中心とを通る基準直線と垂直に交わりかつ前記リテーナリングの中心を通る直線上に配置されている、方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018244440A JP7178259B2 (ja) | 2018-12-27 | 2018-12-27 | 研磨装置および研磨方法 |
TW108144631A TWI826604B (zh) | 2018-12-27 | 2019-12-06 | 研磨裝置及研磨方法 |
SG10201912259TA SG10201912259TA (en) | 2018-12-27 | 2019-12-16 | Polishing apparatus and polishing method |
KR1020190168476A KR20200081245A (ko) | 2018-12-27 | 2019-12-17 | 연마 장치 및 연마 방법 |
CN201911309643.3A CN111376171B (zh) | 2018-12-27 | 2019-12-18 | 研磨装置及研磨方法 |
US16/720,624 US11731235B2 (en) | 2018-12-27 | 2019-12-19 | Polishing apparatus and polishing method |
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JP2018244440A JP7178259B2 (ja) | 2018-12-27 | 2018-12-27 | 研磨装置および研磨方法 |
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JP2020104201A JP2020104201A (ja) | 2020-07-09 |
JP7178259B2 true JP7178259B2 (ja) | 2022-11-25 |
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Country Status (6)
Country | Link |
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US (1) | US11731235B2 (ja) |
JP (1) | JP7178259B2 (ja) |
KR (1) | KR20200081245A (ja) |
CN (1) | CN111376171B (ja) |
SG (1) | SG10201912259TA (ja) |
TW (1) | TWI826604B (ja) |
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JP2023516875A (ja) | 2020-11-10 | 2023-04-21 | アプライド マテリアルズ インコーポレイテッド | 局所的なウエハ圧力を有する研磨ヘッド |
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JP2015233131A (ja) | 2014-05-14 | 2015-12-24 | 株式会社荏原製作所 | 研磨装置 |
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- 2018-12-27 JP JP2018244440A patent/JP7178259B2/ja active Active
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2019
- 2019-12-06 TW TW108144631A patent/TWI826604B/zh active
- 2019-12-16 SG SG10201912259TA patent/SG10201912259TA/en unknown
- 2019-12-17 KR KR1020190168476A patent/KR20200081245A/ko unknown
- 2019-12-18 CN CN201911309643.3A patent/CN111376171B/zh active Active
- 2019-12-19 US US16/720,624 patent/US11731235B2/en active Active
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JP2004510336A (ja) | 2000-09-26 | 2004-04-02 | ラム リサーチ コーポレーション | Cmpシステムのためのウエハキャリア |
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Also Published As
Publication number | Publication date |
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KR20200081245A (ko) | 2020-07-07 |
JP2020104201A (ja) | 2020-07-09 |
US20200206867A1 (en) | 2020-07-02 |
SG10201912259TA (en) | 2020-07-29 |
CN111376171B (zh) | 2023-06-20 |
TWI826604B (zh) | 2023-12-21 |
US11731235B2 (en) | 2023-08-22 |
CN111376171A (zh) | 2020-07-07 |
TW202026103A (zh) | 2020-07-16 |
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