DE60131080D1 - Schleifmaterial - Google Patents

Schleifmaterial

Info

Publication number
DE60131080D1
DE60131080D1 DE60131080T DE60131080T DE60131080D1 DE 60131080 D1 DE60131080 D1 DE 60131080D1 DE 60131080 T DE60131080 T DE 60131080T DE 60131080 T DE60131080 T DE 60131080T DE 60131080 D1 DE60131080 D1 DE 60131080D1
Authority
DE
Germany
Prior art keywords
grinding material
grinding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60131080T
Other languages
English (en)
Other versions
DE60131080T2 (de
Inventor
Kou Hasegawa
Hozumi Satou
Osamu Ishikawa
Yukio Hosaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Application granted granted Critical
Publication of DE60131080D1 publication Critical patent/DE60131080D1/de
Publication of DE60131080T2 publication Critical patent/DE60131080T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE60131080T 2000-05-31 2001-05-29 Schleifmaterial Expired - Lifetime DE60131080T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000161519 2000-05-31
JP2000161519 2000-05-31
PCT/JP2001/004483 WO2001091975A1 (fr) 2000-05-31 2001-05-29 Materiau abrasif

Publications (2)

Publication Number Publication Date
DE60131080D1 true DE60131080D1 (de) 2007-12-06
DE60131080T2 DE60131080T2 (de) 2008-07-31

Family

ID=18665533

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60131080T Expired - Lifetime DE60131080T2 (de) 2000-05-31 2001-05-29 Schleifmaterial

Country Status (6)

Country Link
US (3) US7001252B2 (de)
EP (1) EP1295682B1 (de)
KR (1) KR100726303B1 (de)
DE (1) DE60131080T2 (de)
TW (1) TWI236398B (de)
WO (1) WO2001091975A1 (de)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003338469A (ja) * 2002-05-21 2003-11-28 Fujitsu Ltd 研磨剤、研磨方法および洗浄方法
KR100663781B1 (ko) * 2003-01-31 2007-01-02 히다치 가세고교 가부시끼가이샤 Ｃμρ연마제 및 연마방법
JP2004342751A (ja) * 2003-05-14 2004-12-02 Toshiba Corp Ｃｍｐ用スラリー、研磨方法、および半導体装置の製造方法
JP4342918B2 (ja) 2003-11-28 2009-10-14 株式会社東芝 研磨布および半導体装置の製造方法
TWI323741B (en) * 2004-12-16 2010-04-21 K C Tech Co Ltd Abrasive particles, polishing slurry, and producing method thereof
KR100641348B1 (ko) * 2005-06-03 2006-11-03 주식회사 케이씨텍 Ｃｍｐ용 슬러리와 이의 제조 방법 및 기판의 연마 방법
TW200709294A (en) * 2005-06-13 2007-03-01 Advanced Tech Materials Compositions and methods for selective removal of metal or metal alloy after metal silicide formation
US20070049164A1 (en) * 2005-08-26 2007-03-01 Thomson Clifford O Polishing pad and method for manufacturing polishing pads
TW200720017A (en) * 2005-09-19 2007-06-01 Rohm & Haas Elect Mat Water-based polishing pads having improved adhesion properties and methods of manufacture
EP2083027B8 (de) * 2008-01-24 2012-05-16 JSR Corporation Chemisch mechanisches Polierkissen und chemisch mechanisches Polierverfahren
DE102008008184A1 (de) * 2008-02-08 2009-08-13 Evonik Degussa Gmbh Verfahren zum Polieren einer Siliciumoberfläche mittels einer ceroxidhaltigen Dispersion
JP5274647B2 (ja) * 2008-04-18 2013-08-28 サンーゴバン アブレイシブズ，インコーポレイティド 高空隙率研摩材物品およびその製造方法
EP3187304B1 (de) * 2011-03-21 2022-12-21 Lawrence Livermore National Security, LLC Verfahren und system für durchgehendes polieren
KR101335946B1 (ko) 2011-08-16 2013-12-04 유비머트리얼즈주식회사 텅스텐 연마용 ｃｍｐ 슬러리 조성물
WO2013054883A1 (ja) * 2011-10-13 2013-04-18 三井金属鉱業株式会社 研摩材スラリー及び研摩方法
KR20140144959A (ko) * 2013-06-12 2014-12-22 삼성전자주식회사 연마 패드 제조 장치 및 이를 제조하는 방법
US9259821B2 (en) 2014-06-25 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing layer formulation with conditioning tolerance
SG11201700887WA (en) * 2014-08-11 2017-03-30 Basf Se Chemical-mechanical polishing composition comprising organic/inorganic composite particles
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
KR102630261B1 (ko) 2014-10-17 2024-01-29 어플라이드 머티어리얼스, 인코포레이티드 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 ｃｍｐ 패드 구성
TWI689406B (zh) * 2014-10-17 2020-04-01 美商應用材料股份有限公司 研磨墊及製造其之方法
EP3326751A4 (de) * 2015-07-17 2018-08-29 Fujimi Incorporated Polierkissen und polierverfahren
JP6940495B2 (ja) * 2015-10-30 2021-09-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US10010996B2 (en) 2016-04-20 2018-07-03 Seagate Technology Llc Lapping plate and method of making
US10105813B2 (en) * 2016-04-20 2018-10-23 Seagate Technology Llc Lapping plate and method of making
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
CN112654655A (zh) 2018-09-04 2021-04-13 应用材料公司 先进抛光垫配方
US10464188B1 (en) 2018-11-06 2019-11-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and polishing method
US10569384B1 (en) 2018-11-06 2020-02-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and polishing method
CN110421496A (zh) * 2019-06-20 2019-11-08 安徽省潜山县信兴刷业有限公司 一种羊毛毡抛光轮的制作方法
CN112643562A (zh) * 2020-12-23 2021-04-13 苏州远东砂轮有限公司 一种高强度超柔软砂带及其制备方法
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0716878B2 (ja) * 1989-03-31 1995-03-01 泰弘 谷 砥石の製造方法
JPH03281172A (ja) 1990-03-22 1991-12-11 Mitsubishi Heavy Ind Ltd レジンボンド超砥粒砥石
JPH06254769A (ja) * 1991-07-04 1994-09-13 Taoka Chem Co Ltd 弾性砥石及びその製造方法
JPH0791396B2 (ja) 1992-02-07 1995-10-04 ソマール株式会社 研磨用フイルム
US6069080A (en) 1992-08-19 2000-05-30 Rodel Holdings, Inc. Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like
JPH08294869A (ja) 1995-04-27 1996-11-12 Fuji Photo Film Co Ltd 研磨体
JPH106231A (ja) 1996-06-24 1998-01-13 Denshi Shizai Kaihatsu Kenkyusho:Kk 砥石体及び研ぎ具
GB2316414B (en) * 1996-07-31 2000-10-11 Tosoh Corp Abrasive shaped article, abrasive disc and polishing method
JPH10329032A (ja) 1997-05-29 1998-12-15 Sumitomo Osaka Cement Co Ltd Ｌｓｉ酸化膜研磨用砥石およびｌｓｉ酸化膜研磨方法
JPH11151659A (ja) 1997-11-20 1999-06-08 Sony Corp 研磨パッド、化学的機械研磨法、および化学的機械研磨装置
JPH11188647A (ja) 1997-12-25 1999-07-13 Fuji Photo Film Co Ltd 研磨体
JPH11198045A (ja) 1998-01-19 1999-07-27 Tosoh Corp 研磨用成形体、それを用いた研磨用定盤及び研磨方法
KR100615691B1 (ko) * 1998-12-18 2006-08-25 도소 가부시키가이샤 연마용 부재, 그것을 이용한 연마용 정반 및 연마방법
JP2000301461A (ja) 1999-04-21 2000-10-31 Nippei Toyama Corp 砥石の製造方法および研磨方法

Also Published As

Publication number Publication date
US7001252B2 (en) 2006-02-21
EP1295682A4 (de) 2005-02-02
DE60131080T2 (de) 2008-07-31
TWI236398B (en) 2005-07-21
US20030153255A1 (en) 2003-08-14
US7217305B2 (en) 2007-05-15
KR100726303B1 (ko) 2007-06-13
US20060075686A1 (en) 2006-04-13
US7201641B2 (en) 2007-04-10
EP1295682A1 (de) 2003-03-26
EP1295682B1 (de) 2007-10-24
WO2001091975A1 (fr) 2001-12-06
KR20020019595A (ko) 2002-03-12
US20060116054A1 (en) 2006-06-01

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Legal Events

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