WO2001091975A1 - Materiau abrasif - Google Patents
Materiau abrasif Download PDFInfo
- Publication number
- WO2001091975A1 WO2001091975A1 PCT/JP2001/004483 JP0104483W WO0191975A1 WO 2001091975 A1 WO2001091975 A1 WO 2001091975A1 JP 0104483 W JP0104483 W JP 0104483W WO 0191975 A1 WO0191975 A1 WO 0191975A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polishing
- matrix material
- abrasive grains
- aqueous dispersion
- body according
- Prior art date
Links
- 239000003082 abrasive agent Substances 0.000 title abstract description 8
- 238000005498 polishing Methods 0.000 claims abstract description 140
- 239000006185 dispersion Substances 0.000 claims abstract description 88
- 239000006061 abrasive grain Substances 0.000 claims abstract description 66
- 239000000843 powder Substances 0.000 claims abstract description 29
- 239000000839 emulsion Substances 0.000 claims abstract description 26
- 239000004065 semiconductor Substances 0.000 claims abstract description 15
- 229920001577 copolymer Polymers 0.000 claims abstract description 10
- 238000001035 drying Methods 0.000 claims abstract description 9
- 239000000203 mixture Substances 0.000 claims abstract description 8
- 239000011159 matrix material Substances 0.000 claims description 80
- 239000002245 particle Substances 0.000 claims description 42
- 239000002612 dispersion medium Substances 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 26
- 239000011246 composite particle Substances 0.000 claims description 22
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 18
- 238000000465 moulding Methods 0.000 claims description 17
- 229920005989 resin Polymers 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 17
- 238000001694 spray drying Methods 0.000 claims description 16
- 229920000642 polymer Polymers 0.000 claims description 11
- 238000004132 cross linking Methods 0.000 claims description 10
- 239000011230 binding agent Substances 0.000 claims description 8
- 238000007493 shaping process Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000002609 medium Substances 0.000 claims description 3
- 238000001962 electrophoresis Methods 0.000 claims 2
- 229920001038 ethylene copolymer Polymers 0.000 claims 2
- 239000011248 coating agent Substances 0.000 claims 1
- 239000011247 coating layer Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 230000005484 gravity Effects 0.000 claims 1
- 239000004519 grease Substances 0.000 claims 1
- 238000004062 sedimentation Methods 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- 229910000420 cerium oxide Inorganic materials 0.000 abstract description 14
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 abstract description 14
- 238000003756 stirring Methods 0.000 abstract description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 abstract description 5
- 238000003825 pressing Methods 0.000 abstract description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 abstract 2
- YAJYJWXEWKRTPO-UHFFFAOYSA-N 2,3,3,4,4,5-hexamethylhexane-2-thiol Chemical compound CC(C)C(C)(C)C(C)(C)C(C)(C)S YAJYJWXEWKRTPO-UHFFFAOYSA-N 0.000 abstract 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 abstract 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 abstract 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 abstract 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 abstract 1
- 230000003467 diminishing effect Effects 0.000 abstract 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 abstract 1
- 239000011164 primary particle Substances 0.000 abstract 1
- FZYCEURIEDTWNS-UHFFFAOYSA-N prop-1-en-2-ylbenzene Chemical compound CC(=C)C1=CC=CC=C1.CC(=C)C1=CC=CC=C1 FZYCEURIEDTWNS-UHFFFAOYSA-N 0.000 abstract 1
- 239000011369 resultant mixture Substances 0.000 abstract 1
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- 239000003795 chemical substances by application Substances 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 7
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- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
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- 239000002184 metal Substances 0.000 description 6
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- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
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- 230000000052 comparative effect Effects 0.000 description 5
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- 239000002002 slurry Substances 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 4
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- 125000003277 amino group Chemical group 0.000 description 4
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- 229910052717 sulfur Inorganic materials 0.000 description 4
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- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
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- 229910052802 copper Inorganic materials 0.000 description 3
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- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910021645 metal ion Inorganic materials 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
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- 239000004094 surface-active agent Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
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- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- 125000002373 5 membered heterocyclic group Chemical group 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 description 2
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- 125000003118 aryl group Chemical group 0.000 description 2
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- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 2
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- 235000014113 dietary fatty acids Nutrition 0.000 description 2
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- 238000009835 boiling Methods 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 239000003093 cationic surfactant Substances 0.000 description 1
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000002738 chelating agent Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- SOCTUWSJJQCPFX-UHFFFAOYSA-N dichromate(2-) Chemical class [O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O SOCTUWSJJQCPFX-UHFFFAOYSA-N 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical class OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- PXJJSXABGXMUSU-UHFFFAOYSA-N disulfur dichloride Chemical compound ClSSCl PXJJSXABGXMUSU-UHFFFAOYSA-N 0.000 description 1
- 229940060296 dodecylbenzenesulfonic acid Drugs 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000000635 electron micrograph Methods 0.000 description 1
- 239000005007 epoxy-phenolic resin Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 235000011087 fumaric acid Nutrition 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000000174 gluconic acid Substances 0.000 description 1
- 235000012208 gluconic acid Nutrition 0.000 description 1
- 125000003827 glycol group Chemical group 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- MVFCKEFYUDZOCX-UHFFFAOYSA-N iron(2+);dinitrate Chemical compound [Fe+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O MVFCKEFYUDZOCX-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- WCYWZMWISLQXQU-UHFFFAOYSA-N methyl Chemical compound [CH3] WCYWZMWISLQXQU-UHFFFAOYSA-N 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- DZCCLNYLUGNUKQ-UHFFFAOYSA-N n-(4-nitrosophenyl)hydroxylamine Chemical compound ONC1=CC=C(N=O)C=C1 DZCCLNYLUGNUKQ-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000003002 pH adjusting agent Substances 0.000 description 1
- 238000010979 pH adjustment Methods 0.000 description 1
- 238000003921 particle size analysis Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L persulfate group Chemical group S(=O)(=O)([O-])OOS(=O)(=O)[O-] JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- LFSXCDWNBUNEEM-UHFFFAOYSA-N phthalazine Chemical compound C1=NN=CC2=CC=CC=C21 LFSXCDWNBUNEEM-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- JLKDVMWYMMLWTI-UHFFFAOYSA-M potassium iodate Chemical compound [K+].[O-]I(=O)=O JLKDVMWYMMLWTI-UHFFFAOYSA-M 0.000 description 1
- 239000001230 potassium iodate Substances 0.000 description 1
- 229940093930 potassium iodate Drugs 0.000 description 1
- 235000006666 potassium iodate Nutrition 0.000 description 1
- 239000012286 potassium permanganate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- ORIHZIZPTZTNCU-YVMONPNESA-N salicylaldoxime Chemical compound O\N=C/C1=CC=CC=C1O ORIHZIZPTZTNCU-YVMONPNESA-N 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 210000002966 serum Anatomy 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000011550 stock solution Substances 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- FWMUJAIKEJWSSY-UHFFFAOYSA-N sulfur dichloride Chemical compound ClSCl FWMUJAIKEJWSSY-UHFFFAOYSA-N 0.000 description 1
- 229940052367 sulfur,colloidal Drugs 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000004154 testing of material Methods 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 229960001124 trientine Drugs 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
- B24B37/245—Pads with fixed abrasives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
Definitions
- the present invention relates to an abrasive body. More specifically, the present invention relates to a polishing body in which abrasive grains in the polishing body are very well dispersed.
- the polishing body of the present invention can be suitably used for a polishing pad or the like for polishing the surface of a semiconductor wafer fist.
- CMP Chemical 1 MechanicalPolish
- This CMP is performed by sliding the surface to be polished of a wafer or the like against a disk-shaped polishing pad while simultaneously pressing a slurry (aqueous dispersion) in which abrasive grains are dispersed onto the polishing pad.
- a slurry aqueous dispersion
- this slurry is expensive, and the processing of the used slurry requires more costs.
- abrasive grains are contained in JP-A-5-222356, JP-A-8-294869, JP-A-10-329032, JP-A-11-151659, JP-A-11-188647 and the like.
- a polished body is disclosed. However, in any case, it is considered difficult to sufficiently prevent scratches. Disclosure of the invention
- the present invention can solve the above problems, and is a polishing body in which abrasive grains in the polishing body are dispersed very well.
- the polishing performance is stable in polishing, and the scratch is effectively reduced.
- Aim to provide an abrasive body that can be reduced The present invention achieves the above object, and includes the following.
- a polishing body characterized by comprising a polishing portion formed by solidifying an aqueous dispersion containing a matrix material and abrasive grains dispersed therein.
- the polishing section may be obtained by drying the aqueous dispersion and molding the dried product.
- the aqueous dispersion can be obtained by dispersing abrasive grains in an emulsion in which a matrix material is dispersed.
- the dried product may be obtained by spray-drying the aqueous dispersion.
- the polishing portion has a rectangular shape, and a support portion may be laminated on one surface of the polishing portion.
- a polished body comprising a polished part formed by solidifying an aqueous dispersion containing dispersed composite particles having abrasive grains attached to a matrix material.
- aqueous dispersion further includes a matrix material and Z or abrasive grains dispersed therein.
- the polishing section can be obtained by shaping the aqueous dispersion and shaping the dried product.
- the aqueous dispersion can be obtained by dispersing abrasive grains in an emulsion in which a matrix material is dispersed.
- the dried product can be obtained by spray-drying the aqueous dispersion.
- the polishing portion is plate-shaped, and a support portion may be laminated on one surface of the polishing portion.
- a polishing body characterized in that a water-based dispersion containing a matrix material comprising a cross-linkable polymer and abrasive grains dispersed therein is solidified, and further comprising a polishing portion having a cross-linking structure.
- the polishing section may be obtained by drying the aqueous dispersion and molding the dried product.
- the above-mentioned aqueous dispersion is an emulsified material in which a matrix material is dispersed.
- a dispersion obtained by dispersing abrasive grains in the suspension may be obtained by spray-drying the aqueous dispersion.
- the polishing portion is plate-shaped, and a supporting portion may be laminated on one surface of the polishing portion.
- Aqueous component 1 (dispersed and contained composite particles in which abrasive particles are attached to a matrix material composed of a crosslinkable polymer and having a polishing portion having a solidified body and having a crosslinked structure) Polished body characterized.
- the polishing step can be obtained by drying the aqueous dispersion and shaping the dried product.
- the aqueous dispersion may further contain a matrix material and / or abrasive grains dispersed therein.
- the aqueous dispersion can be obtained by dispersing abrasive grains in an emulsion in which a matrix material is dispersed.
- the dried product may be one obtained by spray-drying the aqueous dispersion.
- the polishing section may have a plate shape, and a support section may be laminated on one surface of the polishing section. According to the polishing body of the present invention, even when a large amount of abrasive grains is contained, the abrasive grains are dispersed very well, so that the polishing performance is stable and scratches can be effectively reduced. '
- the polishing body having a polishing portion having a cross-linking structure since the property is not easily changed by heat at the time of cutting, an excellent polishing rate is obtained even for a cut product. Therefore, in this polished body, it is possible to more easily perform a cutting process such as a process of reducing a thickness variation and a groove process without lowering the polishing performance.
- the other polishing body of the present invention uses the polishing section manufactured using the granulated product obtained by the spray drying method, the particle size distribution of the powder can be made small and uniform. . Therefore, the filling amount in the mold during powder molding is stable, and the weight of each molded product is Variations are reduced, and variations in the density of the polished body are suppressed, and the polishing performance for each polishing is stabilized.
- the present invention will be described in more detail.
- the polishing body of the present invention is characterized by comprising a polishing section formed by solidifying an aqueous dispersion containing a matrix material and abrasive grains dispersed therein.
- another polishing body of the present invention is characterized in that the polishing body is provided with a polishing section formed by solidifying an aqueous dispersion containing dispersed composite particles in which abrasive grains adhere to a matrix material.
- the aqueous dispersion containing the composite particles may further contain a matrix material and a metal or abrasive dispersed therein.
- the abrasive body of the present invention comprises (1) an aqueous dispersion containing a matrix material and abrasive grains, which are separately dispersed; and (2) an aqueous dispersion containing composite particles and being dispersed. (3) an aqueous dispersion containing and dispersing the composite particles and abrasive grains, (4) an aqueous dispersion containing and dispersing the composite particles and the matrix material, and (5) An aqueous dispersion containing a matrix material and abrasive grains and dispersed therein, which is obtained by solidifying any of the aqueous dispersions.
- the “matrix material” is a material constituting a matrix phase holding abrasive grains in the polishing body of the present invention, and is composed of one or more components.
- a homopolymer or a copolymer rubber, resin, thermoplastic elastomer, etc.
- gen copolymers, styrene copolymers, (meth) acrylic resins, acrylic copolymers, polyolefin resins, olefinic copolymers, epoxy resins, phenolic resins, and polyimides Resins and the like can be used.
- thermoplastic resins such as (meth) acrylic resins, acrylic copolymers, polyolefm resins, and olefin copolymers are usually used without cross-linking.
- the epoxy resin, phenolic resin, polyimide resin, and gen-based copolymer before curing are crosslinkable and uncrosslinked matrix materials.
- a cross-linked product of this cross-linkable product for example, a thermosetting resin after curing (an epoxy resin after curing, a phenolic resin after curing, a polyimide resin after curing), a frame) And the like are crosslinked matrix materials.
- These matrix materials are preferably dispersed in the aqueous dispersion as particles having an average particle diameter of 10 m or less (more preferably 0.3 to 3 mm). .
- the “matrix material” includes a crosslinkable polymer (including an oligomer), and a crosslinked structure in which the crosslinkable polymer is crosslinked is formed in the polishing portion.
- a crosslinkable polymer including an oligomer
- a crosslinked structure in which the crosslinkable polymer is crosslinked is formed in the polishing portion.
- the crosslinkable matrix material is dispersed in an uncrosslinked state in the aqueous dispersion, and the matrix material is solidified during the step of solidifying the aqueous dispersion or after solidification. Can be crosslinked.
- a crosslinkable oligomer or the like can be crosslinked without a crosslinking agent, or the crosslinking agent can be blended in an aqueous dispersion and crosslinked with a crosslinking agent.
- crosslinking can be performed by reacting at room temperature, or crosslinking can be performed by heating.
- crosslinking can be performed by irradiating an uncrosslinked thermoplastic resin with radiation or the like.
- a non-crosslinkable component may be used in combination with a crosslinkable component.
- the crosslinkable component is at least 15 mass%, more preferably at least 40 mass%, based on the total of the crosslinkable component and the non-crosslinkable component. If the crosslinkable component is less than 15% by mass, the effect of suppressing surface deterioration is reduced, and therefore it is not preferable.
- a binder to bond the matrix material.
- the binder the same copolymer and Z or resin as those of the matrix material can be used.
- the binder include an epoxy resin, a phenol resin, a polyimide resin, a styrene resin, an acryl resin, and an olefin resin.
- the matrix material having a crosslinked structure is also dispersed as particles having an average particle size of 1 O wm or less (more preferably 0.3 to 3 m) in the aqueous dispersion.
- abrasive grains are particles mainly having a mechanical polishing action and / or a chemical polishing action. Examples of such abrasive grains include cerium oxide, silica, alumina, titanium oxide, chromium oxide, manganese dioxide, dimanganese trioxide, iron oxide, zirconium oxide, gay carbide, boron carbide, diamond, and barium carbonate. Particles can be mentioned. Among them, cerium oxide, silica, alumina and the like are preferably used because of their good affinity with water. In particular, cerium oxide is more preferable because of its good dispersibility in the emulsion.
- the average grain size of the abrasive grains used is 0.001 to 100 m (preferably 0.05 to 50 m, more preferably 0.05 to 10 m, and still more preferably Is preferably from 0.01 to lm). If the average particle size is less than 0.001 m, the polishing power tends to decrease. On the other hand, if it exceeds 100 im, the abrasive grains to be used are too large and tend to cause scratching. In addition, it is preferable that the abrasive grains are contained in the above-mentioned preferable range even in the abrasive body.
- the “composite particles” are particles in which the abrasive grains adhere to the matrix material (not limited to the surface of the matrix material).
- the method for this attachment is not particularly limited.
- the attachment can be made electrostatically by changing the zeta potential by pH adjustment or the like.
- the matrix material and the abrasive grains have the opposite sign of the potential difference, and the difference in potential between the matrix material and the abrasive particles is 5 mV or more (preferably 10 mV or more, more preferably 2 mV or more. 0 mV or more, particularly preferably 30 mV or more).
- a matrix material and abrasive grains that can exhibit the above-described preferable sign and potential difference may be selected.
- the matrix material by appropriately introducing at least one of a carboxylic acid group, a sulfonic acid group, an amino group, a sulfate ester group, a phosphate ester group, an ether bond and an ester bond into the matrix material, it is possible to further reduce Evening potential can be easily brought closer to a desired value (a more negative value).
- a desired value a more negative value
- the matrix overnight potential of the matrix material is often negative over the entire pH range or over a wide range excluding the low pH range.
- a matrix material having an amino group or the like a matrix material having a positive zeta potential in a specific pH range can be obtained.
- the zeta potential of the abrasive grains is highly dependent on H, has an isoelectric point at which this potential becomes 0, and before and after that, the sign of the zeta potential is reversed. Therefore, by combining a specific matrix material and abrasive grains and mixing them in the PH region where their zeta potentials have the opposite sign, the matrix material and the abrasive grains can be integrally combined by electrostatic force. Can be. Also, even if the mixing potential is the same sign during mixing, the matrix material and the abrasive grains may be integrated by changing the pH and setting the zeda potential to the minus sign. it can.
- the surface of the composite particles may be covered with a polycondensate such as a silane coupling agent in order to prevent the abrasive grains from detaching.
- a polycondensate such as a silane coupling agent
- This polycondensate does not necessarily need to be chemically bonded to the composite particles, especially when the three-dimensionally grown polycondensate is physically held on the surface of the composite particles. Is also good.
- a predetermined silane coupling agent, and further, a predetermined alkoxysilane, aluminum alkoxide, titanium alkoxide, or the like is polycondensed in the presence of particles that are integrally composited by electrostatic force.
- the dispersion medium of the above “aqueous dispersion” may be water alone, or may be a mixed dispersion medium containing a dispersion medium other than water.
- the water content is preferably at least 10% by mass (more preferably at least 20% by mass).
- the dispersing medium other than water included in the mixed dispersing medium include other dispersing media such as aprotic polar solvents, esters, ketones, phenols, alcohols, and amines.
- the dispersion medium has a boiling point of 60 to 200 ° C (preferably 60 to 160 ° C) since it is not easily steamed and easily removed at the time of preparing the aqueous dispersion. It is preferable to use
- the solid concentration of the aqueous dispersion is 1 to 80% by mass (more preferably 10 to 60% by mass). %). If it exceeds 80% by mass, the dispersion stability of the aqueous dispersion tends to decrease, and precipitation may occur, which is not preferable.
- the aqueous dispersion is such that abrasive grains are dispersed in an emulsion in which a matrix material is dispersed.
- the method for dispersing is not particularly limited, and for example, it can be obtained by mixing an emulsion containing a matrix material obtained by emulsion polymerization, suspension polymerization, or the like, with a dispersion in which fine particles are dispersed. it can. Further, it can be obtained by directly dispersing abrasive grains in the emulsion.
- the method for obtaining the emulsion in which the matrix material is dispersed is not particularly limited, and may be obtained by emulsion polymerization, suspension polymerization, or the like. Alternatively, it can be obtained by dissolving a matrix material obtained in advance with a solvent or the like and then dispersing this solution.
- the matrix material in addition to the dispersion medium, the matrix material, the abrasive grains and the composite particles, for example, in addition to the binder described above, a surfactant, a vulcanizing agent, a vulcanization accelerator, a cross-linking agent, a bridge, Contains accelerators, fillers, foaming agents, hollow particles that form voids (expandable, non-expandable), softeners, antioxidants, ultraviolet absorbers, antistatic agents, plasticizers, etc. as necessary. Can be made.
- oxidizing agents hydroxides of alkali metals, acids, PH regulators, polyvalent metal ions (chelating agents), and scratch-preventing agents, which are conventionally contained in slurries used for CMP, may also be contained. it can.
- any of a cationic type, an anionic type and a nonionic type can be used.
- the cationic surfactant include an aliphatic amine salt and an aliphatic ammonium salt.
- the anionic surfactant include fatty acid salt, carboxylate such as alkyl ether carboxylate, and alkylbenzene sulfonate.
- the nonionic surfactant include ether type such as polyoxyethylene alkyl ether, ether ester type such as glycerin ester polyoxetylene ether, and ester type such as polyethylene glycol fatty acid ester, glycerin ester and sorbitan ester. And the like.
- Nonionic surfactants are preferable because they have a large effect of suppressing the generation of scratches.
- the oxidizing agent include peracetic acid, perbenzoic acid, and tert-butyl hydroperoxide.
- Organic peroxides such as oxides and hydrogen peroxide, permanganate compounds such as potassium permanganate, dichromate compounds such as potassium dichromate, octalogenic compounds such as potassium iodate, nitric acid and iron nitrate
- Examples include nitric acid compounds, perhalogen oxides such as perchloric acid, transition metal salts such as potassium ferricyanide, persulfates such as ammonium persulfate, and heteropoly acids.
- vulcanizing agent examples include sulfur (powder sulfur, precipitated sulfur, colloidal sulfur, insoluble sulfur, highly dispersible sulfur, etc.), and sulfur-based compounds (sulfur monochloride, sulfur dichloride, etc.).
- crosslinking agent examples include peroxides (dicumyl peroxide, di-t-butyl peroxide), oximes (p-quinone dioxime, p, p'-dibenzoylquinone dioxime, etc.), and polyamines (tri- Ethylenetetramine, hexamethylenediamine rubbamate, 4,4′-methylenebis-o-chloroaniline, etc.), and modified phenolic resins (eg, alkylphenolic resins having a methyl radical).
- the acid is preferably an organic acid.
- organic acids include para-toluenesulfonic acid, dodecylbenzenesulfonic acid, isoprenesulfonic acid, gluconic acid, lactic acid, citric acid, tartaric acid, malic acid, glycolic acid, malonic acid, formic acid, oxalic acid, succinic acid, fumaric acid , Maleic acid and phthalic acid.
- One of these organic acids may be used alone, or two or more thereof may be used in combination.
- examples of the acid include inorganic acids such as nitric acid, hydrochloric acid and sulfuric acid.
- pH adjuster examples include inorganic acids such as hydrochloric acid and sulfuric acid, and sodium hydroxide, hydroxide (such as sodium hydroxide).
- polyvalent metal ions examples include metals such as aluminum, titanium, vanadium, chromium, manganese, iron, cobalt, nickel, copper, zinc, germanium, zirconium, molybdenum, tin, antimony, tantalum, tungsten, lead, and cerium. Ions. These may be only one kind or two or more kinds of polyvalent metal ions may coexist.
- the above scratch inhibitors include biphenol, biviridyl, 2-vinylpyridine and 4-vinylpyridine, salicylaldoxime, o-phenylenediamine and m Monophenylenediamine, catechol, o-aminophenol, thiourea, N-alkyl-containing (meth) acrylamide, N-aminoalkyl-containing (meth) acrylamide, 5-membered heterocyclic ring Heterocyclic compound having no aromatic ring to be formed 7-Hydroxy-5-methyl-1,3,4-triazaindolizine), heterocyclic compound having a 5-membered heterocyclic ring and having an aromatic ring forming a skeleton 5-methyl-1H-benzotriazole, etc.), phthalazine, and compounds with a heterocyclic six-membered ring containing three nitrogen atoms (melamine, 3-amino-5,6-dimethyl-1,2,4-triazide) And the derivatives of the
- the anti-scratch agent 7-hydroxy-5-methyl-1,3,4-triazaindridine is preferable.
- a surfactant can be used as an anti-scratch agent.
- solidification requires two steps of a step of removing (drying) the dispersion medium and a step of molding. These two steps may be performed at the same time or separately. Further, after the dispersion medium has been removed to some extent, molding may be performed, and thereafter, the dispersion medium may be completely removed. This method may be appropriately selected according to the properties of the matrix material. Further, a step of further pulverizing the dried product after removing the dispersion medium may be provided, and thereafter, a finely pulverized powder may be formed.
- the dispersion medium can be spontaneously evaporated and removed by leaving it in an open system. Further, the evaporation of the dispersion medium can be promoted by performing heating, pressure, and the like. -The removal of the dispersion medium can also be performed by a spray drying method. Thereby, the dispersion medium can be rapidly evaporated and granulated.
- This spray drying method is a method in which a predetermined aqueous dispersion is finely atomized, and is sprayed in hot air or vacuum to instantaneously obtain a powdery dry powder (granulated product). By using this spray-drying method, the powdering step after drying can be omitted, and the particle size distribution of the powder can be made small and uniform.
- the filling amount in the mold when performing powder molding Is stabilized, and the weight variation of each molded article is reduced. Also, it is possible to obtain a more evenly dispersed granulated powder than a pulverized product. A molded product having higher strength can be obtained by using the powder. In addition, variations in the density of the polished body are suppressed, and the polishing performance for each polishing is stabilized.
- the residue (dispersed mass, flakes, powder, pellets, etc.) from which the dispersion medium has been removed to some extent, or dry powder (including granulated products) from which the dispersion medium has been almost completely removed is pressed. It can be carried out by molding, extrusion molding, injection molding, etc. In addition, if the removal of the dispersion medium and the molding are performed at the same time, the aqueous dispersion is poured into a desired mold, and the dispersion medium is the same as above. It can be solidified into the shape of the mold by removing it.
- the aqueous dispersion can be directly spread on the surface of a film or the like serving as a substrate without using a mold, and then the dispersion medium can be removed in the same manner as described above. It should be noted that various additives as described above may be added during molding.
- the “polishing unit” has a mechanical and / or chemical polishing effect.
- the polishing body of the present invention (for example, a plate shape, in particular, a disk shape) may be entirely composed of a polishing portion.
- a plate-like body a shape is not limited, and may be a disk shape or a square shape).
- the polishing part may be provided on the surface of the polishing body, or a polishing part of a strip having a predetermined shape may be regularly arranged on the surface of the polishing body.
- the material of the support portion is not particularly limited, but polyurethane resin (whether foamed or non-foamed), metal, non-woven fabric and the like are used. Of these, particularly flexible polyurethane resin, metal (particularly stainless steel) are used. Etc.) are preferred.
- the volume ratio of abrasive grains that can be contained in the polishing body is 1 to
- the polishing body of the present invention is preferably used for polishing a semiconductor.
- the object to be polished by this polishing object is glass, silicon oxide film, amorphous silicon film, polycrystalline silicon film, single crystal silicon film, silicon nitride film, pure tungsten film, pure aluminum film, or pure copper.
- a film made of an alloy of tungsten, aluminum, copper, or the like and another metal may be used.
- Other examples include films made of oxides and nitrides of metals such as tantalum and titanium.
- thermoplastic resin When a thermoplastic resin is used as the matrix material
- the emulsion obtained above was adjusted to pH 8.5 with a 25% aqueous potassium hydroxide solution. Then, water (ion exchange ⁇ :) was added and stirred at room temperature using a three-one motor. Further, after adding cerium oxide powder (CeQ 2 ) having a particle size of 0.3 before processing, the mixture was stirred at 1500 rpm for 3 minutes to obtain the aqueous dispersion A. Obtained.
- B Each component shown in Table 2 is charged into a flask with a capacity of 2 liters at a ratio of 70 ° C in a nitrogen gas atmosphere. For 6 hours to polymerize. As a result, an emulsion containing polymethyl methacrylate-based polymer particles having an amino group, which is a cationic functional group, a functional group having a polyethylene glycol chain, and an amino group was obtained. The polymerization yield was 95%.
- the methoxypolyethylene glycol methacrylate in Table 2 was manufactured by Shin-Nakamura Kagaku Kogyo Co., Ltd., using the product name "NK Ester M-90 G", # 400, and the azo-based polymerization initiator was Wako Pure Chemical Industries, Ltd. The product name "V50" was used.
- the emulsion containing 10% by mass of the obtained polymethyl methacrylate-based polymer particles was adjusted to pH 10 with potassium hydroxide.
- the overnight potential of the polymethyl methacrylate-based polymer particles in this emulsion was +17 mV.
- the dispersion which was adjusted to contain 10% by mass of cerium oxide powder having a particle size before processing of 0.3 m was similarly adjusted to pH10.
- the overnight potential of cerium oxide in this dispersion was _18 mV.
- the difference between the two potentials is 35 mV.
- emulsions and dispersions were stirred and mixed at a mass ratio of 1: 1 in a 2 liter flask. Then, 3 parts by weight of tetra Ethoxysilane was added, and the mixture was stirred at 25 T for 1 hour, and further stirred at 40 T for 3 hours, and then cooled to obtain an aqueous dispersion B in which composite particles were dispersed. Note that 95% of the surface of the composite particles had serum oxide attached thereto.
- the emulsion containing the obtained carboxy-modified polystyrene 'particles at 10% by mass was adjusted to pH 4 with nitric acid.
- the electrophoretic potential of the lipoxy-modified polystyrene particles in this emulsion was 14 OmV.
- the dispersion adjusted so that the cerium oxide powder having a particle size of 0.3 m before processing was contained at 10% by mass was similarly adjusted to PH4.
- the overnight potential of cerium oxide in this dispersion was +2 O mV.
- the difference between the two zeta potentials is 6 OmV.
- these emulsions and dispersions were stirred and mixed at a mass ratio of 1: 1 in a flask having a capacity of 2 liters for 2 hours. Then, 3 parts by mass was added to the flask, and the mixture was stirred at 25 for 1 hour. After stirring for 3 hours, cooling was performed to obtain an aqueous dispersion C in which the composite particles were dispersed. In addition, serium oxide was attached to 90% of the surface of the composite particles.
- the aqueous dispersion medium of the emulsion obtained in the same manner as in (1) was evaporated and dried. Thereafter, the same amount of toluene as the evaporated and dried aqueous dispersion medium was added, followed by stirring and mixing.
- a non-aqueous dispersion D was obtained by stirring and mixing the same amount of cerium oxide powder in i in this liquid. The viscosity increased with the addition of the cerium oxide powder, and it became impossible to perform stirring on the way.
- Each of the aqueous dispersions A to C and the non-aqueous dispersion D obtained in (1) was spread thinly on a polyethylene film, left at room temperature for 48 hours and dried to obtain flakes.
- the obtained flakes were each subjected to mold pressing to obtain disk-shaped abrasives A to D having a diameter of 30 cm and a thickness of 3 mm.
- the polished bodies A to C are products of the present invention, and the polished body D is a comparative product.
- Abrasives A to D are each attached to the surface plate of a polishing machine (Lapmaster I STF, model "LM-15"), and 4 cm square thermal oxide film while supplying only 150 cc of water per minute.
- the wafer was polished.
- the other polishing conditions were as follows: table rotation speed: 50 rpm, head rotation speed: 50 rpm, polishing pressure: 350 gZcm 2 , polishing time: 2 minutes. From this result, the polishing rate was calculated using the following equation (1).
- Polishing rate (AZ) (Thickness of oxide film before polishing—Thickness of oxide film after polishing) Z polishing time (1) 2Evaluation of scratch
- the particle size before processing was 0.3 m, whereas the particle size immediately before forming as a polished body was 0.3 to 0.4 im. That is, the average particle diameter is 1 to 1.3 times, and it is expected that the abrasive is contained in the polished body with almost no change from the particle diameter before processing.
- the particle diameter before processing is 0.3 m, while the particle diameter immediately before forming as a abrasive body is 2.
- Q zm Met That is, it is 7.3 times the average particle size, and it is expected that the abrasive grains are largely agglomerated even in the abrasive body D.
- scratches that could be visually confirmed were not observed on wafers polished with the polished bodies A to C.
- abrasive D countless scratches were observed.
- thermosetting resin a thermosetting resin
- the aqueous thermoplastic resin emulsion prepared in Example 1 was used (solid content: 48% by mass).
- the pH of the aqueous thermosetting resin a was adjusted to 8.5 with a 25% 7j oxidizing realm aqueous solution. Thereafter, water (ion-exchanged water) was added, and the mixture was stirred at room temperature using a three-one motor. Furthermore, after the unprocessed particle size were introduced 0. 3 iim cerium oxide powder (Ce_ ⁇ 2), the curing agent "EH-3615 S" was charged and stirred for 3 minutes at 600 rpm Z min aqueous dispersion Got body E.
- aqueous dispersion F in which a matrix material and abrasive grains using a thermosetting resin and a thermoplastic resin in combination are dispersed.
- the aqueous thermoplastic resin b and water (ion-exchanged water) were added to the aqueous thermosetting resin a, followed by stirring at room temperature.
- the percentage of the solid content concentration of the aqueous thermosetting resin a and the aqueous thermoplastic resin b is such that the aqueous thermosetting resin a is 50% by mass based on the sum of the two.
- thermoplastic resin and abrasive grains are dispersed G
- aqueous thermoplastic resin b Water (ion exchange water) was added to the aqueous thermoplastic resin b. ⁇ ⁇ The mixture was stirred at room temperature. Thereafter, ⁇ 8.5 was adjusted with a 25% aqueous solution of a hydroxylic power. Further, a cerium oxide powder (Ce ⁇ 2 ) having a particle diameter of 0.3 ⁇ m before processing was added, and the mixture was stirred at 600 rpm for 3 minutes to obtain an aqueous dispersion G. '
- Each of the aqueous dispersions E to G obtained in (1) was spread thinly on a polyethylene film and left at room temperature for 48 hours to be dried to obtain flakes.
- Each of the obtained flakes is Disc-shaped polished bodies E to G with a diameter of 30 cm and a thickness of 3 mm were obtained by various mold presses.
- the polished bodies E and F are invention products (example products), and the polished body G is a comparative product.
- the surface was cut.
- the machining center was used for cutting, and the end mill was used for the cutting blade.
- the feed rate was set to 10 OmmZ, with the cut amount being 0.02 mm.
- Abrasives A to C are each attached to the surface plate of a polishing machine (Lapmaster STF, model “LM-15”), and 4 cm square thermal oxide film wafers are supplied while supplying only 150 cc of water per minute.
- the other polishing conditions were as follows: table rotation speed: 50 rpm, head rotation speed: 50 rpm, polishing pressure: 350 gZcm 2 , and polishing time: 2 minutes.
- the dressing conditions were as follows: dresser count: # 100, table rotation speed: 30 rpm, head rotation speed: 30 rpm, dressing pressure: 300 gcm 2 , dressing time: 10 minutes.
- Table 5 shows the polishing results.
- the thickness variation of the entire polished body of each of the polished bodies E to G is small as intended.
- the polishing rate was higher for the polished bodies E and F for the polished bodies than for the non-abraded ones, while the polishing rate for the polished bodies G, which are comparative examples, was considerably higher. It has become a small value. This is because the variations in thickness of the polished bodies E and F were reduced by cutting.
- the abrasive body G as a comparative example although the thickness variation is small, it is considered that the surface of the abrasive body was slightly melted by heat during cutting and the surface was slightly deteriorated.
- no alteration of the surface of the abrasive bodies E and F of the invention was observed. -Example using dry method ⁇
- Example 1 Using the aqueous dispersion A used in Example 1, a spray drying method was performed under the following operating conditions to obtain a granulated powder having an average particle size of 60 m.
- the bending strength of the polished body H was tested by the method described below. As a result, the bending strength of the polished body E similarly measured was 130 kgf / cm2, but the polished body H had a bending strength of 330 kg / cm2. there were. Comparing the two, the abrasive body H is superior in terms of bending strength. You can see that it is.
- Test method A test was performed using an Instron universal material testing machine 4204 in accordance with ASTM 638.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01934382A EP1295682B1 (en) | 2000-05-31 | 2001-05-29 | Abrasive material |
US10/030,141 US7001252B2 (en) | 2000-05-31 | 2001-05-29 | Abrasive material |
DE60131080T DE60131080T2 (de) | 2000-05-31 | 2001-05-29 | Schleifmaterial |
US11/288,094 US7217305B2 (en) | 2000-05-31 | 2005-11-29 | Polishing body |
US11/288,086 US7201641B2 (en) | 2000-05-31 | 2005-11-29 | Polishing body |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000-161519 | 2000-05-31 | ||
JP2000161519 | 2000-05-31 |
Related Child Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10030141 A-371-Of-International | 2001-05-29 | ||
US11/288,086 Division US7201641B2 (en) | 2000-05-31 | 2005-11-29 | Polishing body |
US11/288,094 Division US7217305B2 (en) | 2000-05-31 | 2005-11-29 | Polishing body |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2001091975A1 true WO2001091975A1 (fr) | 2001-12-06 |
Family
ID=18665533
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2001/004483 WO2001091975A1 (fr) | 2000-05-31 | 2001-05-29 | Materiau abrasif |
Country Status (6)
Country | Link |
---|---|
US (3) | US7001252B2 (ja) |
EP (1) | EP1295682B1 (ja) |
KR (1) | KR100726303B1 (ja) |
DE (1) | DE60131080T2 (ja) |
TW (1) | TWI236398B (ja) |
WO (1) | WO2001091975A1 (ja) |
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-
2001
- 2001-05-29 DE DE60131080T patent/DE60131080T2/de not_active Expired - Lifetime
- 2001-05-29 WO PCT/JP2001/004483 patent/WO2001091975A1/ja active IP Right Grant
- 2001-05-29 US US10/030,141 patent/US7001252B2/en not_active Expired - Fee Related
- 2001-05-29 KR KR1020027001332A patent/KR100726303B1/ko not_active IP Right Cessation
- 2001-05-29 EP EP01934382A patent/EP1295682B1/en not_active Expired - Lifetime
- 2001-05-30 TW TW090113091A patent/TWI236398B/zh not_active IP Right Cessation
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2005
- 2005-11-29 US US11/288,094 patent/US7217305B2/en not_active Expired - Fee Related
- 2005-11-29 US US11/288,086 patent/US7201641B2/en not_active Expired - Fee Related
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JPH03281172A (ja) * | 1990-03-22 | 1991-12-11 | Mitsubishi Heavy Ind Ltd | レジンボンド超砥粒砥石 |
JPH06254769A (ja) * | 1991-07-04 | 1994-09-13 | Taoka Chem Co Ltd | 弾性砥石及びその製造方法 |
JPH106231A (ja) * | 1996-06-24 | 1998-01-13 | Denshi Shizai Kaihatsu Kenkyusho:Kk | 砥石体及び研ぎ具 |
JPH11198045A (ja) * | 1998-01-19 | 1999-07-27 | Tosoh Corp | 研磨用成形体、それを用いた研磨用定盤及び研磨方法 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8062547B2 (en) | 2005-06-03 | 2011-11-22 | K.C. Tech Co., Ltd. | CMP slurry, preparation method thereof and method of polishing substrate using the same |
US9333467B2 (en) * | 2013-06-12 | 2016-05-10 | Samsung Electronics Co., Ltd. | Apparatus for manufacturing polishing pad and method of manufacturing polishing pad using the same |
CN110421496A (zh) * | 2019-06-20 | 2019-11-08 | 安徽省潜山县信兴刷业有限公司 | 一种羊毛毡抛光轮的制作方法 |
Also Published As
Publication number | Publication date |
---|---|
EP1295682B1 (en) | 2007-10-24 |
US20060116054A1 (en) | 2006-06-01 |
US20030153255A1 (en) | 2003-08-14 |
KR100726303B1 (ko) | 2007-06-13 |
TWI236398B (en) | 2005-07-21 |
DE60131080D1 (de) | 2007-12-06 |
KR20020019595A (ko) | 2002-03-12 |
US7201641B2 (en) | 2007-04-10 |
US7217305B2 (en) | 2007-05-15 |
US20060075686A1 (en) | 2006-04-13 |
DE60131080T2 (de) | 2008-07-31 |
EP1295682A1 (en) | 2003-03-26 |
EP1295682A4 (en) | 2005-02-02 |
US7001252B2 (en) | 2006-02-21 |
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